Global ETD Search

21	High throughput flip chip assembly process and reliability analysis using no-flow underfill materials Thorpe, Ryan 05 1900 (has links) No description available. Electronic packaging Materials Electronic packaging Reliability Surface mount technology
22	Design and integration of a large area warpage measurement system Petriccione, Gregory James 05 1900 (has links) No description available. Packaging Microelectronics Testing Surface mount technology Packaging Testing
23	Solder paste inspection based on phase shift profilometry Hui, Tak-wai. January 2007 (has links) Thesis (M. Phil.)--University of Hong Kong, 2008. / Also available in print.
24	Investigations on damage mechanics and life prediction of fine-pitch electronics in harsh environments Islam, Mohd Nokibul, LAll, Pradeep. January 2005 (has links) (PDF) Dissertation (Ph.D.)--Auburn University, 2005. / Abstract. Vita. Includes bibliographic references.
25	Scheduling batch processing machines in a flow shop Manjeshwar, Praveen Kumar. January 2005 (has links) Thesis (Ph. D.)--State University of New York at Binghamton, Department of Systems Science and Industrial Engineering, 2005. / Includes bibliographical references.
26	Solution to a bay design and production sequencing problem Creswell, Steven Howard, 1961- January 1989 (has links) This thesis addresses the problem of setting up a surface mount placement machine for production. The objective is to minimize the number of machine changeovers made during a production run consisting of a number of circuit cards. The solution to the problem involves two separate decisions. The first decision considers determining how to combine feeders together in "bays" or groups of feeders, and how to assign the bays to the circuit cards. The second decision considers the circuit card production sequence. A mathematical programming formulation is given, however, its solution is very difficult for problems of a realistic size. Several heuristic approaches are suggested and used to solve actual and test problems. The heuristic for bay design uses clustering techniques used in Group Technology while the sequencing problem is solved using heuristics based on solution techniques for the Traveling Salesman problem. Surface mount technology. Group technology. Traveling-salesman problem.
27	Analysis of the solder paste release in fine pitch stencil printing processes Rodriguez, German Dario 08 1900 (has links) No description available. Solder pastes Screen process printing Surface mount technology Electronic packaging Testing
28	Reworkable high temperature adhesives for Multichip Module (MCM-D) and Chip-on-Board (COB) applications Pike, Randy T. 08 1900 (has links) No description available. Microelectronics Electronic packaging Adhesives Surface mount technology
29	Modeling and experiments of underfill flow in a large die with a non-uniform bump pattern Zheng, Leo Young. January 2008 (has links) Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Mechanical Engineering, 2008. / Includes bibliographical references.
30	Advanced process window design for 01005 assemblies Ramasubramanian, Arun Shrrivats. January 2008 (has links) Thesis (M.S.)--State University of New York at Binghamton, Department of Systems Science and Industrial Engineering, Thomas J. Watson School of Engineering and Applied Science, 2008. / Includes bibliographical references.

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