Thesis--University of Wisconsin--Madison. / Typescript. Vita. eContent provider-neutral record in process. Description based on print version record. Includes bibliographical references (leaves 179-186).

Thesis (Ph.D) - Swinburne University of Technology, Faculty of Information & Communication Technologies, 2009. / A thesis submitted in fulfillment of the requirements for the degree of Master of Engineering, Industrial Research Institute of Swinburne, Faculty of Engineering and Industrial Sciences, Swinburne University of Technology, 2009. Typescript. "August 2009". Bibliography: p. 207-223.

Thesis (Ph.D.) -- University of Rhode Island, 2008. / Typescript. Includes bibliographical references (leaves 140-145).

Thesis (Ph. D.)--University of California, Los Angeles, Calif., 1967. / "An authorized facsimile and was produced by microfilm-xerography in 1970 by University Microfilms, A Xerox Company, Ann Arbor, Mich."

Thesis--Wisconsin. / Vita. Includes bibliographical references.

Thesis (Ph. D.)--Electrical and Computer Engineering, Georgia Institute of Technology, 2007. / Dr. William T. Rhodes, Committee Co-Chair ; Dr. John Buck, Committee Member ; Dr. William Hunt, Committee Member ; Dr. Stephen P. DeWeerth, Committee Member ; Dr. Ronald G. Driggers, Committee Member ; Dr. Gisele Bennett, Committee Chair.

No description available.

This thesis describes the preparation and thermal rearrangement, via homo-[l,5]-hydrogen migration, of a series of unsymmetrically substituted bicyclic and tricyclic vinylcyclo-propanes (65a)-(67a), (68b), (69), (70), (71a), (72a), (74)-(76) and (77a). In each of these compounds two hydrogen atoms one (H[sub=C]) adjacent to the substituent and the other (H[sub=J]) more distant from it - are suitably disposed to undergo homo-[1,5]-hydrogen migration. It was found that an oxygen substituent retarded the rate of homo-[l,5]-migration of the hydrogen atom (H[sub=C]) adjacent to it relative to that of the other more remote hydrogen atom (H[sub=J]) The retarding effect appeared to be dependent on the structure of the oxy-substituted vinylcyclopropane as well as on the nature of the oxygen substituent. A methyl substituent exerted a negligible, retarding effect on the rate of migration of while phenyl and trimethylsilyl groups accelerated the rate of migration of H[sub=C] relative to that of H[sub=J]. The results are consistent with the proposal that in the transition state for the homo-[1,5]-hydrogen migration the carbon centre bearing the migrating hydrogen atom develops a partial negative charge. / Science, Faculty of / Chemistry, Department of / Graduate

Lithium-ion batteries are the source of energy for many battery-powered devices due to their high energy density and specific energy. These batteries generate a significant amount of heat during charging and discharging. Therefore, managing the thermal behavior becomes more critical to avoid the overheating of these batteries.  The purpose of this paper to investigate the thermal behavior of the Cramer 82V battery pack from Globe Group during high current discharge and provide a simulation model that can be the foundation for the next generation of batteries.  The approach of this project was to research, test, and simulate the battery pack to understand and model the thermal behavior. For more extensive sampling, 7 Cramer 82V6Ah batteries were tested to investigate and analyze the thermal behavior of the batteries during the discharge. In addition, several thermal simulations in SolidWorks were conducted on the battery pack model and compared to the experimental results.   The results from the simulation and experiment are compared at specific positions to ensure the simulation results are valid and can be used for the development of the next generation of the battery pack.

High power circuits, those involving high levels of voltages and currents to produce several kilowatts of power, would possess an optimized efficiency when driven at high frequencies (on the order of MHz). Such an approach would greatly reduce the size of capacitive and magnetic components, and thus ultimately reduce the cost of the power electronic circuits. The problem with this strategy in conventional packaging, however, is that at high frequencies, interconnects between the power devices on one board (such as Power MOSFETs or IGBTs) and components on another board (such as the coasting diodes) suffer from severe parasitic effects, thus affecting the overall electrical performance of the system. A conceivable solution to this problem is the design and construction of a power electronics module which would incorporate all power devices and supporting circuitry into one very simple and compact module. Such an approach would reduce interconnect inductances (thus reducing costly parasitic effects), increase system efficiency and electrical performance, produce a standardization for power electronic modules, and through this standardization, lower overall industry-wide system costs and increase power electronic system reliability. This technology would prove especially valuable for power electronics in industry, where prevalent power systems such as half bridge or full bridge converters would benefit greatly from the large reduction of inductances which currently exist between separate bridge legs. This thesis will discuss a novel multilayer approach towards the described issues. A power module has been designed and fabricated which contains one metallization power layer for the power devices, and a second metallization control layer for the low power signal components. The two layers are separated by a dielectric layer which serves as an electrical separation and as a physical spacer. In addition, issues have been addressed towards optimal physical layout and construction (with regards to thermal dissipation), materials comparisons have been made, and thermal simulations and experimental verifications performed. Issues relating to standardized power electronic module design and the efforts of this researcher at the Microelectronics Laboratories at Virginia Polytechnic Institute and State University to contribute to this quickly evolving field will be discussed. Such topics as power electronic module design, control and driver circuitry design, material issues, and thermal issues will be discussed. / Master of Science