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Desenvolvimento da técnica analítica para determinar a resistência térmica de contato no processo de forjamentoPolozine, Alexandre January 2009 (has links)
A Resistência Térmica de Contato entre a ferramenta de forjamento e a peça é um parâmetro importante para a otimização, por simulação computacional, do comportamento do material forjado. Os procedimentos atuais destinados à determinação da Resistência Térmica de Contato apresentam discrepância significativa nos resultados. A falta de valores confiáveis deste parâmetro afeta a precisão da simulação. Visando a importância das ferramentas computacionais para a otimização do processo de forjamento, no presente trabalho foi desenvolvida uma nova técnica para determinar a Resistência Térmica de Contato. A técnica inovadora inclui o método de medição de temperaturas interfaciais desconhecido anteriormente, a montagem para realizá-lo e o sistema de medição de temperaturas volumétricas. Esta técnica é destinada ao uso sob condições de altas e moderadas temperatura e pressão muito grande, o que é característico da zona de contato material forjado–ferramenta. A inovação foi testada com sucesso para alguns materiais típicos (aço, liga de alumínio e liga de titânio) utilizados no forjamento a quente ou a morno. Os valores da Resistência Térmica de Contato, obtidos nos testes, são recomendados para uso em programas de simulação computacional. / The Thermal Contact Resistance between a die and a blank is an important parameter in the computer simulation used for the optimization of the blank plastic deformation. The known procedures intended for the determination of the Thermal Contact Resistance show significant discrepancy in results. The lack of reliable values of this parameter affects the precision of the simulation. Taking in account the importance of computer tools for the optimization of the forging process, a new technique for the determination of the Thermal Contact Resistance has been developed in the present study. The developed technique includes a method for the measurement of the interface temperatures, which was unknown before, and the equipment for the realization of this method as well as the system for the measurement of the volumetric temperatures. This technique is intended for use under moderate and high temperature / high pressure conditions at the die–workpiece interface. The innovation has been tested successfully on some typical materials (steel, aluminium alloy e titanium alloy) used in warm and hot forging. Values of the Thermal Contact Resistance obtained by these tests are recommended for use in computer simulations.
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Desenvolvimento da técnica analítica para determinar a resistência térmica de contato no processo de forjamentoPolozine, Alexandre January 2009 (has links)
A Resistência Térmica de Contato entre a ferramenta de forjamento e a peça é um parâmetro importante para a otimização, por simulação computacional, do comportamento do material forjado. Os procedimentos atuais destinados à determinação da Resistência Térmica de Contato apresentam discrepância significativa nos resultados. A falta de valores confiáveis deste parâmetro afeta a precisão da simulação. Visando a importância das ferramentas computacionais para a otimização do processo de forjamento, no presente trabalho foi desenvolvida uma nova técnica para determinar a Resistência Térmica de Contato. A técnica inovadora inclui o método de medição de temperaturas interfaciais desconhecido anteriormente, a montagem para realizá-lo e o sistema de medição de temperaturas volumétricas. Esta técnica é destinada ao uso sob condições de altas e moderadas temperatura e pressão muito grande, o que é característico da zona de contato material forjado–ferramenta. A inovação foi testada com sucesso para alguns materiais típicos (aço, liga de alumínio e liga de titânio) utilizados no forjamento a quente ou a morno. Os valores da Resistência Térmica de Contato, obtidos nos testes, são recomendados para uso em programas de simulação computacional. / The Thermal Contact Resistance between a die and a blank is an important parameter in the computer simulation used for the optimization of the blank plastic deformation. The known procedures intended for the determination of the Thermal Contact Resistance show significant discrepancy in results. The lack of reliable values of this parameter affects the precision of the simulation. Taking in account the importance of computer tools for the optimization of the forging process, a new technique for the determination of the Thermal Contact Resistance has been developed in the present study. The developed technique includes a method for the measurement of the interface temperatures, which was unknown before, and the equipment for the realization of this method as well as the system for the measurement of the volumetric temperatures. This technique is intended for use under moderate and high temperature / high pressure conditions at the die–workpiece interface. The innovation has been tested successfully on some typical materials (steel, aluminium alloy e titanium alloy) used in warm and hot forging. Values of the Thermal Contact Resistance obtained by these tests are recommended for use in computer simulations.
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Thermal contact resistance between molecular systems : an equilibrium molecular dynamics approach applied to carbon nanotubes, graphene and few layer graphene / Une approche par la dynamique moléculaire à l'équilibre appliquée aux nanotubes de carbone, au graphène et au graphène de quelques couchesNi, Yuxiang 18 October 2013 (has links)
Cette thèse se concentre sur le calcul des résistances thermique de contact dans plusieurs systèmes moléculaires à base de nanotubes de carbone (NTCs) et de quelques couches de graphène (QCG). Ce travail a été réalisé en utilisant la méthode de simulation par dynamique moléculaire à l’équilibre (DME). Nous avons utilisé la méthode basée sur les fluctuations de la différence de température dans nos simulations de DME. Cette méthode ne nécessite que l’entrée des températures des sous-systèmes quand le flux thermique, qui intervient dans toutes les autres approches, reste plus difficile à calculer en terme de durée de simulation et d’algorithme. Premièrement, trois cas ont été étudiés pour valider cette méthode : (i) des super-réseaux Si/Ge ; (ii) des nanofils de SiC de plusieurs diamètres ; et (iii) QCGs. La validité de la méthode par fluctuation de la différence de température est démontrée par des simulations de dynamique moléculaire à l’équilibre et hors-équilibre. Ensuite, avec cette méthode, nous montrons qu’un polymère fonctionnalisé azoture (HLK5) a une plus faible résistance de contact avec un NTC que la résistance entre un NTC et un PEMA, car HLK5 forme des liaisons covalentes (C-N bonds) avec un NTC par le groupement azoture de sa queue, quand seul de faibles interactions de van der Waals existent dans le cas d’un contact NTC-PEMA. Les données de nos simulations de DME concordent raisonnablement avec les résultats expérimentaux. Nous rapportons ensuite la résistance thermique de contact entre QCG et un substrat de SiO2, qui peut être contrôlée par le nombre de couches de graphène. Avec l’avantage d’une interface résistante, nous montrons que des super-réseaux SiO2/QCG ont une conductivité thermique descendant sous 0.30 W/mK, ce qui est une perspective prometteuse pour l’isolation thermique à l’échelle du nanomètre. Dans la dernière partie, nous recherchons la dépendance de la résistance thermique inter-plan avec le nombre de couches de graphène pour des QCG suspendus ou supportés. Nous montrons que la présence d’un substrat de dioxyde de silicium peut significativement réduire les résistances inter-plan de QCG possédant peu de couches de graphène, et la conductivité thermique effective est augmentée en accord. Le modèle de Frenkel-Kontorova a été introduit pour expliquer les bandes interdites induites par le substrat dans la relation de dispersion de QCG et le transfert d’énergie thermique correspondant. L’augmentation de la conduction thermique inter-plan est attribuée au rayonnement de phonons à l’interface QCG-substrat, qui redistribue l’énergie se propageant dans le plan du QCG en énergie dans la direction inter-plan et dans le substrat. / This thesis is devoted to the calculation of thermal contact resistance in various molecular systems based on carbon nanotubes (CNTs) and few layer graphene (FLG). This work has been performed through equilibrium molecular dynamics (EMD) simulations. We adopted the temperature difference fluctuations method in our EMD calculations. This method only needs the input of the temperatures of the subsystems whereas the heat flux, which is involved in all the other approaches, remains more difficult to compute in terms of simulation time and algorithm. Firstly, three cases were studied to validate this method, namely: (i) Si/Ge superlattices; (ii) diameter modulated SiC nanowires; and (iii) few-layer graphenes. The validity of the temperature difference fluctuations method is proved by equilibrium and non-equilibrium MD simulations. Then, by using this method, we show that an azide-functionalized polymer (HLK5) has a lower contact resistance with CNT than the one between CNT and PEMA, because HLK5 could form covalent bonds (C-N bonds) with CNT through its tail group azide, while only weak Van der Waals interactions exist in the case of CNT-PEMA contact. The data from our EMD simulations match with the results from experiments in a reasonable range. We then report the thermal contact resistance between FLG and a SiO2 substrate, which could be tuned with the layer number. Taking advantage of the resistive interface, we show that a SiO2 /FLG superlattices have a thermal conductivity as low as 0.30 W/mK, exhibiting a promising prospect in nano-scale thermal insulation. In the last part, we investigated the layer number dependence of the cross-plane thermal resistances of suspended and supported FLGs. We show that the existence of a silicon dioxide substrate can significantly decrease the cross-plane resistances of FLGs with low layer numbers, and the effective thermal conductivities were increased accordingly. The Frenkel-Kontorova model was introduced to explain the substrate-induced band gaps in FLG dispersion relations and the corresponding thermal energy transfer. The enhanced thermal conduction in the cross-plane direction is ascribed to the phonon radiation that occurs at the FLG-substrate interface, which re-distributes the FLG in-plane propagating energy to the cross-plane direction and to the substrate.
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Récupération de l'énergie des solides massifs : cas d'acier de la coulée continue / Energy recovery from solids-case of steel slab after the continuous castingSayah, Haytham 05 October 2012 (has links)
La production d'acier fait partie des productions mondiales les plus consommatrices d'énergie. L'état de l'art montre que les brames, après la coulée continue, sont refroidies à l'air libre de 900 °C à la température ambiante. Durant ce processus 540 MJ/tonne d'acier sont perdues. Cette thèse a permis de définir une méthode et un équipement aptes à extraire de l'énergie à haute valeur exergétique lors du refroidissement.Deux voies de récupérations sont présentées. La première voie est via un cycle thermodynamique direct. Le cycle choisi pour cette voie est le cycle de Hirn avec resurchauffe ayant un rendement global de 30 % produisant 10 MW de puissance électrique. La deuxième voie est via un système indirect utilisant le SYLTHERM 800 comme fluide caloporteur entre la brame et un cycle ORC, fonctionnant avec du R-245fa et avec un rendement globale de 17,6 %. Dans les deux configurations, les transferts thermiques choisis sont la conduction et le rayonnementUn banc d'essais, dimensionné utilisant la technique de similitude, a permis d'étudier les transferts thermiques intervenant dans l'équipement de récupération. La variation de la résistance de contact à l'interface brame-sole est étudiée en fonction de la température ainsi que le comportement thermique de l'échangeur de conduction. L'étude thermodynamique ainsi que l'étude thermique ont permis d'effectuer un pré-dimensionnement de l'équipement de récupération pour les deux configurations étudiées.Un modèle numérique utilisant la méthode des réseaux de composants est élaboré. Ce modèle est capable de reproduire les mêmes phénomènes physiques que ceux intervenant dans l'équipement de récupération / Steel production industry is one of the most energy consuming sectors. The state-of-the-art indicates that steel slabs leaving the continuous casting process are cooled without energy recovery by radiating to the atmosphere and convection. Not only a large amount of energy is wasted but this type of cooling is time consuming. During the cooling process of steel slabs from an initial temperature of approximately 900°C to outdoor air temperature, 580 MJ per ton of steel are wasted. This study has defined a method and an equipment capable of extracting the energy at high exergy value during cooling.The energy could be recovered using two different systems. The first is a direct thermodynamic generation cycle. The selected direct cycle is the Hirn cycle with intermediate reheating having an overall efficiency of 30 % and producing about 10 MW electric power. The second is an indirect system using SYLTHERM 800 as an intermediate heat transfer fluid between the metal slabs and an organic Rankine cycle using R-245fa as a working fluid with 17.6 % efficiency and producing about 6 MW. In both systems the dominant heat transfers to recover heat are conduction for the floor heat exchanger and radiation for the ceiling heat exchanger.A test bench was mounted, using a similitude technique, to study heat transfers. The variation of the thermal contact resistance as a function of the contact temperature is studied as well as the thermal behaviour of the conduction heat exchanger. The thermodynamic and the thermal studies led to a preliminary design of the recovery equipment.A numerical model is developed using the component interaction network. This model can reproduce the same physical phenomena taking place in the recovery equipment.
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Thermal contact resistance in micromoulding.Gonzalez Castro, Gabriela, Babenko, Maksims, Bigot, S., Sweeney, John, Ugail, Hassan, Whiteside, Benjamin R. 12 1900 (has links)
yes / This work outlines a novel approach for determining thermal contact resistance (TCR) in micromoulding. The proposed technique aims to produce TCR predictions with known confidence values and combines experimental evidence (temperature fields and contact angle measurements) with various mathematical modelling procedures (parametric representation of surfaces, finite element analysis and stochastic processes). Here, emphasis is made on the mathematical aspects of the project. In particular, we focus on the description of the parametric surface representation technique based on the use of partial differential equations, known as the PDE method, which will be responsible for characterizing and compressing micro features in either moulds or surface tools. / EPSRC
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INTERFACIAL THERMAL CONDUCTIVITY USING MULTIWALL CARBON NANOTUBESRussell, Carissa Don 01 January 2010 (has links)
Shrinking volume, coupled with higher performance, microprocessors and integrated circuits have led to serious heat dissipation issues. In an effort to mitigate the excessive amounts of waste heat and ensure electronic survivability, heat sinks and spreaders are incorporated into heat generating device structures. This inevitability creates a thermal pathway through an interface. Thermal interfaces can possess serious thermal resistances for heat conduction. The introduction of a thermal interface material (TIM) can drastically increase the thermal performance of the component. Exceptional thermal properties of multiwall carbon nanotubes (MWCNTs) have spurred interest in their use as TIMs. MWCNTs inherently grow in vertically-oriented, high aspect ratio arrays, which is ideal in thermal interface applications because CNTs posses their superior thermal performance along their axis. In this paper, laser flash thermal characterization of sandwich‐bonded and cap‐screw‐bonded aluminum discs for both adhesive-infiltrated and “dry”, 100% MWCNT arrays, respectively. Thermal contact resistances as low as 18.1 mm2K/W were observed for adhesive‐infiltrated arrays and, even lower values, down to 10.583 mm2K/W were measured for “dry” MWCNT arrays. The improved thermal performance of the arrays compared to thermal adhesives and greases currently used in the electronics and aerospace industries, characterize MWCNT arrays as a novel, lighter‐weight, non‐corrosive replacement.
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MULTIWALL CARBON NANOTUBE ARRAYS FOR THERMAL INTERFACE ENHANCEMENTEtheredge, Darrell Keith 01 January 2012 (has links)
High performance/small package electronics create difficult thermal issues for integrated circuits. Challenges exist at material interfaces due to interfacial contact resistances. Multiwall carbon nanotube (MWCNT) arrays are considered to be excellent candidates for use as thermal interface materials (TIMs) due to outstanding thermal/mechanical properties. In this work, MWCNT array TIMs are analyzed in aluminum and carbon fiber composites via flash diffusivity analysis. The effect of TIM thickness, areal/bulk density, surface cleanliness, and volumetric packing fraction; along with the effect of substrate finish and interfacial contact pressure on thermal performance are analyzed. Trends show the best TIMs possess low thickness, high bulk density and packing fraction, and clean surfaces. Pressure dramatically increases thermal performance after establishing contact, with diminishing returns from additional pressure. Diffusivities approaching 40 mm2/s and 0.65 mm2/s are recorded for aluminum and composite systems. Oxygen plasma etching and high temperature annealing (“Graphitizing”) are investigated as methods to remove amorphous carbon from array surfaces. Graphitized TIMs report diffusivity improvements up to 53.8%. Three methods of incorporating MWCNTs into composites are attempted for thermal/mechanical property enhancement. Conductance calculations show increasing diffusivity without increasing thickness enhances thermal performance in composites. MWCNTs for mechanical property enhancement produce no change, or detrimental effects.
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A study of heat transfer at the cavity-polymer interface in microinjection moulding : the effects of processing conditions, cavity surface roughness and polymer physical properties on the heat transfer coefficientBabenko, Maksims January 2015 (has links)
This thesis investigates the cooling behaviour of polymers during the microinjection moulding process. The work included bespoke experimental mould design and manufacturing, material characterisation, infra-red temperature measurements, cooling analysis and cooling prediction using commercial simulation software. To measure surface temperature of the polymers, compounding of polypropylene and polystyrene with carbon black masterbatch was performed to make materials opaque for the IR camera. The effects of addition of carbon black masterbatch were analysed using differential scanning calorimetry and Fourier transform infrared spectroscopy. Sapphire windows formed part of the mould wall and allowed thermal measurements using an IR camera. They were laser machined on their inside surfaces to generate a range of finishes and structures. Their topographies were analysed using laser confocal microscope. The surface energy of sapphire windows was measured and compared to typical mould steel, employing a contact angle measurement technique and calculated using Owens-Wendt theory. A heating chamber was designed and manufactured to study spreading of polymer melts on sapphire and steel substrates. A design of experiments approach was taken to investigate the influence of surface finish and the main processing parameters on polymer cooling during microinjection moulding. Cooling curves were obtained over an area of 1.92 by 1.92 mm of the sapphire window. These experiments were conducted on the Battenfeld Microsystem 50 microinjection moulding machine. A simulation study of polymer cooling during the microinjection moulding process was performed using Moldflow software. Particular interest was paid to the effect of the values of the interfacial heat transfer coefficient (HTC) on the simulated cooling predictions. Predicted temperature curves were compared to experimentally obtained temperature distributions, to obtain HTC values valid for the material and processing parameters.
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Caractérisation thermique d'un matériau à changement de phase dans une structure conductriceMerlin, Kevin 30 September 2016 (has links)
La récupération de chaleur fatale est un véritable challenge pour l’amélioration de l’efficacité énergétique. Le stockage par chaleur latente est une solution qui répond à cet enjeu. Nous nous intéressons aux procédés industriels avec un rapport puissance sur énergie élevé. L’un des procédés identifiés est la stérilisation de produits agroalimentaires. Cependant, les matériaux à changement de phase, peu conducteurs, ne permettent pas d’obtenir des puissances thermiques suffisantes pour ces applications. L’amélioration de la surface d’échange ou l’augmentation de la conductivité thermique du matériau sont alors nécessaires. Un premier dispositif expérimental de stockage thermique comparant différentes techniques d’intensification des transferts a été réalisé. Le concept à base de paraffine et de Graphite Naturel Expansé (GNE) s’est montré le plus performant par rapport à des solutions de type ailettes ou poudre de graphite. La caractérisation thermique du matériau composite GNE/paraffine sélectionné a été réalisée par plusieurs méthodes. Des valeurs de conductivité thermique effective de l’ordre 20 W.m-1.K-1 ont été obtenues. Dans un second temps, un démonstrateur de 100kW/6kW.h est dimensionné et réalisé. Ce dispositif testé sur un procédé de stérilisation existant permet une économie d’énergie de 15%, conforme aux prévisions. L’identification de la conductivité thermique plane du matériau et l’influence de la résistance thermique de contact sont réalisées à l’aide d’un dispositif expérimental, couplé à un modèle numérique. Enfin, le développement d’un dispositif de vieillissement permet l’étude de la stabilité thermique de ce matériau. / Waste heat recovery is a challenge for the improvement of energy efficiency. Latent heat storage is a solution that addresses this issue. We focus on industrial processes with high energy on power ratios. One of the identified processes is the sterilization of food products. However, phase change materials, which have low thermal conductivities, do not provide sufficient thermal powers for these applications. The improvement of the heat exchange surface or the increase in thermal conductivity of the material are then necessary. A first experimental thermal storage comparing various heat transfer intensification techniques was achieved. The concept based on paraffin and Expanded Natural Graphite (ENG) has proven to be the most efficient compared to solutions using fins or graphite powder. The thermal characterization of the selected composite material ENG/paraffin was performed by several methods. Effective thermal conductivities values of about 20 W.m-1.K-1 were obtained. In a second step, a 100kW/6kW.h demonstrator is designed and realized. This device tested on an existing sterilization process provides an energy saving of 15%, as expected. The identification of the planar thermal conductivity of the composite material and the influence of the thermal contact resistance are carried out using an experimental device, coupled to a numerical model. Finally, an aging device is used to study the thermal stability of this material
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Etude de l’échauffement de la caténaire lors du captage à l’arrêt : Développement d’un outil informatique / Study of the catenary overheating during standstill current collectionBausseron, Thomas 03 December 2014 (has links)
Dans le domaine ferroviaire de nombreux incidents ont montré le problème de l'échauffement de la caténaire au droit du contact avec le pantographe durant le captage de courant à l'arrêt. L'échauffement à l'interface pantographe/caténaire peut entraîner la rupture du fil de contact de la caténaire. Le travail présenté dans cette étude, issu de la collaboration entre la SNCF et l'institut FEMTO-ST, vise à améliorer la compréhension des phénomènes physiques mis en jeu. L'objectif à terme est d'anticiper une maintenance coûteuse comme le remplacement du fil de contact. Un modèle électrothermique 2D transitoire du fil de contact a été développé et couplé à un modèle thermique 1D transitoire pour obtenir une modélisation quasi 3D. La modélisation, alimentée par des données expérimentales, permet de déterminer la répartition du courant électrique et donc la production de chaleur interne. Une modélisation électrothermique de la bande vient compléter le système. / In the railroad and trains domain, many incidents show the main problem of overheating of the catenary at the contact with the pantograph when the train was stopped whereas all the electrical systems of the train should nevertheless be fed. Analysis of these incidents has shown that the overheating of the interface catenary-pantograph during the ream conditioning was sometimes at the origin of the break of the contact wire. In order to forecast such very expensive problems for the company, the French National Railway Company (SNCF) and the research institute FEMTO-ST carried out theoretical and experimental studies to better understand this phenomenon. First a quasi 3D transient electrothermal modeling tool has been developed for the contact wire. It has also permitted to estimate the distribution of current in the wire in order to obtain the internal heat power generation. An electrothermal modelisation of the strip complete the system. Finally the heat transfer equation in the wire with particular boundary conditions has been solved in all the finite differences network thanks to the Euler's implicit method.
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