Les insectes sont soumis aux fluctuations thermiques de leur environnement mais disposent d’un panel varié de réponses comportementales, physiologiques et biochimiques pour en minimiser les effets délétères et maintenir leur intégrité physiologique. Ainsi certaines espèces régulent activement leur température interne indépendamment de la température de l’environnement. Si ces insectes peuvent s’affranchir des contraintes thermiques imposées par leur environnement, ceux qui se nourrissent du sang chaud d’hôtes vertébrés endothermes n’ont pas d’autres choix que de se confronter à une situation de stress thermique à chaque prise alimentaire. Le principal objectif de ce travail de thèse est de comprendre comment des insectes hématophages, employant des stratégies alimentaires différentes, gèrent le stress thermique associé au flux massif de chaleur engendré par l’ingestion du repas de sang. Nos résultats montrent que ces insectes ont su s’adapter en développant différentes stratégies de thermorégulation. / Insects are submitted to thermal fluctuations of their environment and have developed a wide ranged panel of behavioral, physiological and biochemical responses, to minimize the subsequent deleterious effects and maintain their physiological integrity. Some species actively regulate their internal temperature independently of the temperature of the environment. If these insects can overcome the constraints imposed by their thermal environment, those that feed on warm-blooded vertebrate hosts have no choice but to confront a situation of thermal stress at each feeding event. The main objective of this work is to understand how bloodsucking insects manage heat stress associated with the massive flow of heat generated by the ingestion of the blood meal. Our results show these insects have developed different strategies of thermoregulation to protect themselves from overheating.

Les technologies de transistors bipolaires à hétérojonctions (HBT) ont montré leur efficacité pour permettre aux circuits de traiter les grands signaux au delà de 100Gbit/s pour les réseaux optiques Ethernet. Pour assurer ce résultat, une bonne fiabilité doit être garantie. Des tests de vieillissements accélérés sous contraintes thermiques et électrothermiques sont réalisés et analysés avec les outils de simulation physique Sentaurus TCAD afin d’obtenir les lois de vieillissement physiques. Le modèle compact HICUM niveau 2, basé sur la physique, est utilisé pour modéliser précisément le composant avant vieillissement, puis pour ajuster les caractéristiques intermédiaires pendant le vieillissement. L’évolution des paramètres du modèle est décrit avec des équations appropriées pour obtenir un modèle électrique compact du vieillissement basé sur la physique. Les lois de vieillissement et les équations d’évolutions des paramètres avec le temps de contrainte sont implantées dans le modèle électrique de vieillissement en langage Verilog-A, ce qui permet de simuler l’impact des mécanismes de défaillances sur le circuit en conditions opérationnelles. / Modern InP Heterojunction Bipolar Transistors (HBT) technology has shown its efficiency for making large signal ICs working above 100 Gbits/s for Ethernet optical transport network. To full-fill this expectation, a good reliability has to be assured. Accelerated aging tests under thermal and electro-thermal stress conditions are performed and analyzed with Sentaurus TCAD device simulation tools to achieve the physical aging laws. The physics based advanced bipolar compact model HICUM Level 2 is used for precise modeling of the devices before aging. The HICUM parameters are extracted to fit the intermediate characterizations during aging. The evolution of the model parameters is described with suitable equations to achieve a physics based compact electrical aging model. The aging laws and the parameter evolution equations with stress time are implemented in compact electrical aging model in Verilog-A languages which allows us to simulate the impact of device failure mechanisms on the circuit in operating conditions.

Thermoelectric generators (TEG) are re-emerging technology that can be used to recover heat waste from commercial and industrial processes to generate electricity, enhancing fuel utilization and lowering greenhouse gas emissions. TEG modules are solid-state heat engines that produce no noise or vibration during operation. Notably, TEG modules are also able to operate at low-temperature differences, which makes them ideal for a wide range of heat waste recovery applications. Annular thermoelectric generator (ATEG) modules are optimal in applications where either the heat source or sink are round in shape. Bi2Te3 solution-based compounds are of significant interest in the application of thermoelectric materials (TE) used in low-temperature cooling and power generation applications. The main objective of the current work is to design a mechanically reliable ring-shaped ATEG module with a predictable performance using spark plasma sintered Bi2Te3 TE material for low temperature waste heat recovery applications. In terms of structure, this work is divided into two parts. The first part investigates how the use of a powder pre-treatment technique affects the mechanical and thermoelectric properties of P- and N-type Bi2Te3. In addition, part one also presents the measurements of these materials’ mechanical and thermoelectric properties, which serve as inputs for the finite element models used to design thermoelectric modules with parallel and perpendicular configurations vis-a-vis the sintering pressing direction. The second part evaluates the thermoelectric performance and thermal stresses of a ring-shaped ATEG couple that has been integrated between hot-side and cold-side heat exchangers. To this end, two configurations are compared with respect to their heat/electrical current flow paths: one that allows for radial flow (radial configuration), and one that allows for axial flow (axial configuration). The P- and N-type Bi2Te3 powder was treated using a mechanically agitated fluidized powder reduction facility that was built in-house. The characteristic uniaxial tensile strength of the P-type Bi0.4Sb1.6Te3 increased from 13.9 MPa to 26.3 MPa parallel to the sintering pressure, and from 16.3 MPa to 30.6 MPa perpendicular to the sintering pressure following oxide reduction using 5% H2 ˗ 95% Ar at 380 ℃ for 24 h. The figure of merit, ZT, increased from 0.35 to 0.80 and from 0.42 to 1.13 at room temperature (25 ℃) in the parallel and the perpendicular directions, respectively, after the surface oxide reduction treatment. On the other hand, the annealing effects of the oxide reduction pr-treatment of the N-type (Bi0.95 Sb0.05)2(Se0.05 Te0.95)3 using 5% H2 ˗ 95% Ar at 380 ℃ for 24 h were found to be responsible for the majority of the mechanical properties and ZT enhancement. Additionally, the characteristic uniaxial tensile strengths for this material increased from 30.4 to 34.1 MPa and from 30.8 to 38 MPa in the parallel and the perpendicular directions, respectively. The ZTmax (150 ℃) increased from 0.54 to 0.63 in both the parallel and perpendicular directions due to oxide reduction, while annealing led to an increase to 0.58 and 0.62 in the parallel and the perpendicular directions, respectively. An analytical model was constructed to compare the thermoelectric performance of the two configurations under three different hot-side thermal resistances, and a 3D coupled finite element ANSYS model was constructed to study and compare the thermal stresses of the two configurations at different dimensions. The two models were then used to create 2D maps in order to investigate the effects of ATEG couple configuration and dimensions, as well as the hot-side thermal resistance, with the goal of identifying the optimum design. The optimization of module geometry requires a trade-off between performance and mechanical reliability. The results of these investigations showed that increases in the temperature difference across the ATEG couple (ΔT) led to increases in both power and thermal stresses in both configurations. When both configurations were generating the same power at ΔT = 105 ℃, the thermal stresses in the radial configuration were as much as 67 MPa higher than those in the axial configuration due to the formation of additional tensile hoop stresses. The lowest thermal stress obtained for the axial couple configuration was 67.8 MPa, which was achieved when the couple had an outer diameter of 16 mm, an axial thickness of 1 mm, a ΔT of 14.8 ℃, and power generation of 10.4 mW per couple. The maximum thermal stress values were located at the corners of the interface between the solder and the TE rings due to the mismatched coefficient of thermal expansion. This thesis makes a novel contribution to the state-of-the-art literature in ring-shaped ATEG modules, as it details a well-characterised spark plasma sintered Bi2Te3 TE material and a methodology for designing a ring-shaped ATEG module with reliable, robust, and predictable thermoelectric and mechanical performance. The details of the contribution made by this work have been disseminated in the form of three journal publications, which have been integrated into this sandwich Ph.D. thesis. / Thesis / Doctor of Science (PhD)