The main objectives of this dissertation is to investigate the prospects of embedded thermoelectric devices integrated in a chip package and to develop a design methodology aimed at taking advantage of the on-chip on-demand cooling capabilities of the thermoelectric devices. First a simulation framework is established and validated against experimental results, which helps to study the cooling capabilities of embedded thermoelectric coolers (TEC) in both a transient and steady state. The potential for up to 15°C of total cooling has been shown. The thermal simulation framework allows for rapid assessment of TEC and system level thermal performance. Next, the thesis develops a co-simulation environment that is capable of simulating the thermal and electrical domain and couples them to design intelligent TEC controllers. These controllers are implemented on chip and can leverage the transient cooling capability of the device. The controllers are simulated within the co-simulation environment and their potential to control high power chip events are thoroughly investigated. The system level overheads are considered and discussions on implementation techniques are presented. The co-simulation framework is also extended to allow for simulation of real predictive technology microprocessor cores and their workloads. Finally the thesis implements a fully on-chip autonomous energy system that takes advantage of the TEC in its reverse energy harvesting mode and uses the same device to harvest energy and use the energy to power the on-chip cooling circuit. This increases the overall energy efficiency of the cooler and verifies the TEC control methods.

The continuing requirement for computational processing power, multi-functional devices and component miniaturization have emphasised the need for thermal management systems able to maintain the temperature at safe operating condition. The thermal management industry is constantly seeking for new cutting edge, efficient, cost effective heat transfer enhancement technologies. The aim of this study is to utilize the electron beam treatment for the improvement of the heat transfer area in liquid cooled plates and experimentally evaluate the performance. Considering the complexity of the technology, this thesis focuses on the design and production of electron beam enhanced test samples, construction of the test facility, testing procedure and evaluation of thermal and hydraulic characteristics. In particular, the current research presented in this thesis contains a number of challenging and cutting edge technological developments that include: (1) an overview of the semiconductor industry, cooling requirements, the market of thermal management systems, (2) an integral literature review of pin-fin enhancement technology, (3) design and fabrication of the electron beam enhanced test samples, (4) upgrade and construction of the experimental test rig and the development of the test procedure, (5) reduction of the experimental data and analysis to evaluate thermal and hydraulic performance. The experimental results show that the capability of the electron beam treatment to improve the thermal efficiency of current untreated liquid cooled plates is approximately three times. The highest heat transfer rate was observed for the sample S3; this is attributed to the irregularities of the enhanced structure, which improves the heat transfer area, mixing, and disturbs the thermal and velocity boundary layers. Enhancement of heat transfer for all three samples was characterised by an increase of pressure drop. The electron beam enhancement technique is a rapid process with zero material waste and cost effective. It allows thermal management systems to be produced smaller and faster, reduce material usage, without compromising safety, labour cost or the environment.

Thermoelectric devices are capable of providing both localized active cooling and waste heat power generation. This work will explore the possibility of embedding thermoelectric devices within electronic packaging in order to achieve better system performance. Intel and Nextreme, Inc. have produced thin-film superlattice thermoelectric devices that have above average performance for thermoelectrics and are much thinner than most devices on the market currently. This allows them to be packaged inside of the electronic package where the thermoelectric devices can take advantage of the increased temperatures and decreased thermal lag as compared to the devices being planted on the outside of the package. This work uses the numerical CFD solver FLUENT and the analog electronic circuit simulator SPICE to simulate activity of thermoelectric devices within an electronics package.

Thesis (MDiploma (Mechanical Engineering))--Cape Technikon, 1992. / An investigation into the use of thermoelectric cooling energised by photovoltaic (PV) panels for removing sensible heat from electronic telecommunications equipment. The thermoelectric cooler consists of a solid-state heat pump which operates on the principle of the Peltier effect. The thermoelectric device transfers heat through a cold sink to ambient outside air via a hot sink. A major prerequisite was that the system should be selfsufficient in terms of power because the sites for the microwave transmitters are often remote. Solar power was the only alternative source of energy and the cooler was designed to accept direct current from PV panels which are usually used to power transmitters on distant locations. The cooling device had to be reliable, virtually maintenance-free and simple to repair.

Fresh water collection techniques have gained significant attention due to global dwindling of fresh water resources and recent scares such as the 2011-2017 California drought. This project explores the economic viability of actively harvesting water from fog, and techniques to maximize water collection. Vapor compression and thermoelectric cooling based dehumidifier prototypes are tested in a series of experiments to assess water collection capability in foggy environments, and what parameters can increase that capability. This testing shows an approximate maximum collection rate of 1.25 L/kWh for the vapor compression prototype, and 0.32 L/kWh for the thermoelectric cooling prototype; compared to 315 L/kWh for desalination or 12 L/m2/day for passive meshes. Exploration of parameters on the thermoelectric cooling prototype show a potential increase in water collection rate of 29% with the addition of a Teflon coating to the collection surface, 15% by clearing the collection surface, and 89% by tilting certain collection surfaces by 60-75°. In combination, these parameters could push active atmospheric water harvesting into economic viability where significant infrastructure investment is not feasible.

Thermoelectric materials are capable of direct conversion of thermal energy to electrical energy and vice versa. Their applications include thermoelectric coolers, generators, as well as sensors. Conventional thermoelectric devices consist of multiple units of p-type and n-type semiconducting elements, in which electrical current and heat flux flow parallel to each other. In contrast, transverse thermoelectric devices could decouple electrical current and heat flux such that they flow perpendicular to each other. Transverse thermoelectricity could be realized in single-phase anisotropic materials or composite materials with engineered anisotropy. Studies have shown that composite transverse thermoelectric materials could provide a better performance than their single-phase counterparts. In this dissertation proposal, two configurations of transverse thermoelectric composites are examined using both analytical and numerical methods. Mathematical models are established to calculate the effective properties of anisotropic thermoelectric composites by analyzing the representative unit cells using the Kirchhoff circuit law (KCL) and the Thevenin’s theorem followed by tensor transformation. Thermoelectric figure of merit (ZT), power factor, as well as cooling performance (maximum cooling temperature ΔTmax) of transverse thermoelectrics are studied. Comparisons between the mathematical models and numerical simulation showed good agreement, while some discrepancies are observed and discussed. Since transverse composite thermoelectrics can decouple the electrical and thermal transports, they can offer new opportunities for device design including thin film sensors and cascading coolers, as well as for performance enhancement such as improved power factors. / Mechanical Engineering

Nanotechnology has made it possible to create materials with unique properties. This development offers new opportunities and overcomes challenges for many thermal transport applications. Yet, it requires a more fundamental scientific understanding of nanoscale transport. This thesis emphasizes how simulation, mathematical, and numerical methods can lead to more grounded studies of nanoscale thermal transport for biological and physical applications. For instance, magnetic fluid hyperthermia (MFH), an emerging cancer treatment, is a noninvasive method to selectively destroy a tumor by heating a ferrofluid-impregnated malignant tissue with minimal damage to the surrounding healthy tissue. We model the problem by considering an idealized spherical tumor that is surrounded by healthy tissue. The dispersed magnetic nanoparticles in the tumor are excited by an AC magnetic field to generate heat. The temperature distribution during MFH is investigated through a bioheat transfer relation which indicates that the P\'eclet, Joule, and Fourier numbers are the more influential parameters that determine the heating during such a thermotherapy. Thus, we show that a fundamental parametric investigation of the heating of soft materials can provide pathways for optimal MFH design. Since ferrofluid materials themselves play a key role in heating, we examine six materials that are being considered as candidates for MFH use. These are simulated to investigate the heating of ferrofluid-loaded tumors. We show that iron-platinum, magnetite, and maghemite are viable MFH candidates since they are able to provide the desired heating of a tumor which will destroy it while keeping the surrounding healthy tissues at a relatively safe temperature. Recent advances in the synthesis and nanofabrication of electron devices have lead to diminishing feature sizes. This has in turn increased the power dissipation per unit area that is required to cool the devices, leading to a serious thermal management challenge. The phonon thermal conductivity is an important material property because of its role in thermal energy transport in semiconductors. A higher thermal conductivity material is capable of removing more heat since higher frequency phonons are able to travel through it. In this thesis, the effects of surface stress on the lattice thermal conductivity are presented for a silicon nanowire. Based on a continuum approach, a phonon dispersion relation is derived for a nanowire that is under surface stress and the phonon relaxation time is employed to subsequently determine its thermal conductivity. The surface stress is found to significantly influence the phonon dispersion and thus the Debye temperature. Consequently, the phonon thermal conductivity decreases with increasing surface stress. Different magnitudes of surface stress could arise from various material coatings and through different nanofabrication processes, effects of which are generally unclear and not considered. Our results show how such variations in surface stress can be gainfully used in phonon engineering and to manipulate the thermal conductivity of a nanomaterial. The thermal transport during thermoelectric cooling is also an important property since thermoelectric devices are compact, reliable, easy to control, use no refrigerants and require lower maintenance than do more traditional refrigeration devices. We focus on the Thomson effect that occurs when there is a current flow in the presence of a temperature gradient in the material, and investigate its influence on an intrinsic silicon nanowire cooler. The temperature dependence of the Thomson effect has a significant influence on the cooling temperature. We also consider thermal nonequilibrium between electrons and phonons over the carrier cooling length in the nanowire. The results show that a strong energy exchange between electrons and phonons lowers the cooling performance, suggesting useful strategies for thermoelectric device design. / Ph. D.

Since most of the energy input is converted to thermal energy in laser applications, the proper thermal management of laser systems is an important issue. Maintaining the laser diode and crystal temperature distributions in a narrow range during the operation is the most crucial requirement for the cooling of a laser system. In the present study, thermoelectric cooling (TEC) of a 1064 nm wavelength diode pumped laser source is investigated both experimentally and numerically. During the heat removal process, the thermal resistance through and between the materials, the proper integration of the TEC assembly, and the heat sink efficiency become important. For the aim of evaluating and further improving the system performance, various assembly configurations, highly conductive components, efficient interface materials and heat sink alternatives are considered. Several experiments are conducted during the system development stage, and parallel numerical simulations are performed both for comparison and also for providing valuable input for the system design. Results of the experiments and the simulations agree well with each other. As the laser device works in the transient regime, the experiments and the simulations are also implemented in this regime. In the final part of the study, the experiments are performed under the actual device working conditions. It is proved that with the designed TEC module and the copper heat sink system, the laser device can operate longer than the required operational time successfully.

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