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41	Wafer-level heterogeneous integration of MEMS actuators Braun, Stefan January 2010 (has links) This thesis presents methods for the wafer-level integration of shape memory alloy (SMA) and electrostatic actuators to functionalize MEMS devices. The integration methods are based on heterogeneous integration, which is the integration of different materials and technologies. Background information about the actuators and the integration method is provided. SMA microactuators offer the highest work density of all MEMS actuators, however, they are not yet a standard MEMS material, partially due to the lack of proper wafer-level integration methods. This thesis presents methods for the wafer-level heterogeneous integration of bulk SMA sheets and wires with silicon microstructures. First concepts and experiments are presented for integrating SMA actuators with knife gate microvalves, which are introduced in this thesis. These microvalves feature a gate moving out-of-plane to regulate a gas flow and first measurements indicate outstanding pneumatic performance in relation to the consumed silicon footprint area. This part of the work also includes a novel technique for the footprint and thickness independent selective release of Au-Si eutectically bonded microstructures based on localized electrochemical etching. Electrostatic actuators are presented to functionalize MEMS crossbar switches, which are intended for the automated reconfiguration of copper-wire telecommunication networks and must allow to interconnect a number of input lines to a number of output lines in any combination desired. Following the concepts of heterogeneous integration, the device is divided into two parts which are fabricated separately and then assembled. One part contains an array of double-pole single-throw S-shaped actuator MEMS switches. The other part contains a signal line routing network which is interconnected by the switches after assembly of the two parts. The assembly is based on patterned adhesive wafer bonding and results in wafer-level encapsulation of the switch array. During operation, the switches in these arrays must be individually addressable. Instead of controlling each element with individual control lines, this thesis investigates a row/column addressing scheme to individually pull in or pull out single electrostatic actuators in the array with maximum operational reliability, determined by the statistical parameters of the pull-in and pull-out characteristics of the actuators. / QC20100729 Microelectromechanical systems MEMS silicon wafer-level integration heterogeneous integration transfer integration packaging assembly wafer bonding adhesive bonding eutectic bonding release etching electrochemical etching microvalves microactuator Shape Memory Alloy SMA NITINOL TiNi NiTi cold-state reset bias spring stress layers crossbar switch routing switch switch array electrostatic actuator S-shaped actuator zipper actuator addressing transfer stamping blue tape Computer engineering Datorteknik
42	Mikromechanisches kraftgekoppeltes Sensor-Aktuator-System für die resonante Detektion niederfrequenter Schwingungen / Micro-mechanical force-coupled sensor-actuator-system for the resonant detection of low frequency vibrations Forke, Roman 25 January 2013 (has links) (PDF) Die vorliegende Arbeit beschreibt die Entwicklung und Charakterisierung eines mikromechanischen kraftgekoppelten Schwingsystems für die resonante Detektion niederfrequenter Schwingungen. Es wird ein neuartiges Prinzip vorgestellt, das es ermöglicht, niederfrequente Vibrationen frequenzselektiv zu erfassen. Mittels Amplitudenmodulation wird das niederfrequente Signal in einen höheren Frequenzbereich umgesetzt. Durch Ausnutzung der mechanischen Resonanzüberhöhung wird aus dem breitbandigen Signal ein schmales Band herausgefiltert, die anderen Frequenzbereiche werden unterdrückt. Auf diese Weise wird direkt die spektrale Information des niederfrequenten Signals gewonnen. Eine Fourier-Transformation ist hierbei nicht notwendig. Die Abstimmung des Sensors erfolgt über eine Wechselspannung und führt dadurch zu einer einfachen Auswertung. Die Schwerpunkte der Arbeit liegen in den theoretischen Untersuchungen zum neuartigen Sensorprinzip, in der Entwicklung einer mikromechanischen Sensorstruktur zum Einsatz des neuen Prinzips sowie in der Entwicklung und Charakterisierung eines Messsystems zur Detektion niederfrequenter mechanischer Schwingungen mit dem neuen Sensor. / This thesis describes the development and characterization of a micromechanical force coupled oscillator system for the resonant detection of low frequency vibrations. It presents a novel working principle that enables spectral measurements of low frequency vibrations. The low frequency spectral content is converted into a higher frequency range by means of amplitude modulation. Due to the mechanical resonance a narrow band is filtered out of the wide band vibration signal. The remaining frequency content is suppressed. Hence, the spectral information is directly obtained with the sensor system without a fast Fourier transform. The tuning is done with an AC voltage resulting in a simple analysis. The main focuses of the work are the theoretical analysis of this novel sensor principle, the development of the micromechanical sensor structure for the use of the novel principle as well as the development and characterization of a measurement system for the spectral detection of low frequency mechanical vibrations with the developed sensor system. Mikrotechnologie elektromechanische Modulation kraftgekoppelte Schwinger resonante Schwingungsdetektion Breitbandschwinger frequenzselektiv kapazitiv BDRIE Systemsimulation mechanischer Spektrumanalyzer microtechnology MEMS condition monitoring electro mechanical modulation force coupled oscillator resonant vibration detection resonator wideband damping capacitive detection BDRlE technology vibration sensor wafer level test system simulation mechanical spectrum analyzer ddc:600 ddc:620 ddc:629 MEMS Zustandsüberwachung Resonator Dämpfung Vibrationssensor Charakterisierung
43	Mikromechanisches kraftgekoppeltes Sensor-Aktuator-System für die resonante Detektion niederfrequenter Schwingungen Forke, Roman 23 November 2012 (has links) Die vorliegende Arbeit beschreibt die Entwicklung und Charakterisierung eines mikromechanischen kraftgekoppelten Schwingsystems für die resonante Detektion niederfrequenter Schwingungen. Es wird ein neuartiges Prinzip vorgestellt, das es ermöglicht, niederfrequente Vibrationen frequenzselektiv zu erfassen. Mittels Amplitudenmodulation wird das niederfrequente Signal in einen höheren Frequenzbereich umgesetzt. Durch Ausnutzung der mechanischen Resonanzüberhöhung wird aus dem breitbandigen Signal ein schmales Band herausgefiltert, die anderen Frequenzbereiche werden unterdrückt. Auf diese Weise wird direkt die spektrale Information des niederfrequenten Signals gewonnen. Eine Fourier-Transformation ist hierbei nicht notwendig. Die Abstimmung des Sensors erfolgt über eine Wechselspannung und führt dadurch zu einer einfachen Auswertung. Die Schwerpunkte der Arbeit liegen in den theoretischen Untersuchungen zum neuartigen Sensorprinzip, in der Entwicklung einer mikromechanischen Sensorstruktur zum Einsatz des neuen Prinzips sowie in der Entwicklung und Charakterisierung eines Messsystems zur Detektion niederfrequenter mechanischer Schwingungen mit dem neuen Sensor. / This thesis describes the development and characterization of a micromechanical force coupled oscillator system for the resonant detection of low frequency vibrations. It presents a novel working principle that enables spectral measurements of low frequency vibrations. The low frequency spectral content is converted into a higher frequency range by means of amplitude modulation. Due to the mechanical resonance a narrow band is filtered out of the wide band vibration signal. The remaining frequency content is suppressed. Hence, the spectral information is directly obtained with the sensor system without a fast Fourier transform. The tuning is done with an AC voltage resulting in a simple analysis. The main focuses of the work are the theoretical analysis of this novel sensor principle, the development of the micromechanical sensor structure for the use of the novel principle as well as the development and characterization of a measurement system for the spectral detection of low frequency mechanical vibrations with the developed sensor system. info:eu-repo/classification/ddc/600 ddc:600 info:eu-repo/classification/ddc/620 ddc:620 info:eu-repo/classification/ddc/629 ddc:629

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