No / Passive and active devices are essential devices in mobile and base stations’ transceiver. Consequently, these devices dominated the large part of the PCB of the today’s transceiver. However, the tomorrow’s mobile terminals without circuit tunability would be extremely large in size to accommodate present and future radio access technologies (RATs). The stand-alone transceiver for one single RAT is comprised of single passive and active devices and adding two or more RATs for the same transceiver would require adding two or more devices, since all of these RATs standards work on different frequency bands. Apparently, without tunability approach, this will increase the complexity of the system design and will cover a large part of the circuit space leading to power consumptions, loss which results to the poor efficiency of the transceiver. In this work, a miniaturized RF MEMS tunable bandpass is developed to operate in the frequency range from 1.8 to 2.6 GHz.

Multi band technology helps in getting multiple operating frequencies using a single microwave device. This thesis presents the design of dual and tri band microwave devices using coupled transmission line structures. Chapter 2 presents the design of a novel dual band transmission line structure using coupled lines. In chapter 3, Design of a dual band branch line coupler and a dual band Wilkinson power divider are proposed using the novel dual band transmission line structure presented in the previous chapter. In chapter 4, Design of a tri band transmission line structure by extending the dual band structure is presented. The Conclusion and future work are presented in chapter 5.

There are a significant number of microwave applications, including active antenna arrays, wireless communication systems, navigational applications, etc., where improvement of such qualities as manufacturing costs, size, weight, power consumption, etc. is still on the agenda of todays RF design. In order to meet these requirements, new technologies must be actively involved in fabrication of RF components with improved characteristics. One of such fabrication technologies is called LIGA, used before primarily in fluidics, photonics, bioengineering, and micromechanics, and only recently receiving growing attention in RF component fabrication. One of the RF components suffering limitations in performance due to limitations in fabrication capabilities is the compact single metal layer (SML) coupled-line 3-dB coupler, also called hybrid, required in some applications thanks to its ability to divide power equally and electrically isolate the output from the input. In todays practical edge-coupled SML coupler designs, the level of coupling is limited by the capabilities of the photolithographic process to print the coupled lines close enough for tight coupling and it is usually no tighter that 8 dB. A promising way to overcome this limitation is increasing the area of metallic interface of the coupled lines, thus increasing the mutual capacitance of the lines, and inherently the coupling between them. This should be preferably done with keeping the coupler compact with respect to the footprint area, which is attained by making taller conductors, i.e. employing the third dimension. In contrast with previously used RF component fabrication processes, LIGA is the technology that allows the designer to explore the third dimension and build tall conductors while being also able to use small features. When the two-dimensional edge-coupled SML couplers are extended into the three-dimensional structures, they rather become the side-coupled SML couplers. Tall-conductor coupled lines have been characterized in this work to reveal their dependence on their geometry and a 3-dB SML coupler with tall conductors has been developed and fabricated using LIGA at the Institute for Microstructure Technology (IMT), Karlsruhe, Germany. The simulation and measurement results demonstrate the potentially superior performance of LIGA couplers, and the promising capabilities of LIGA for fabrication of RF microstructures.

There are a significant number of microwave applications, including active antenna arrays, wireless communication systems, navigational applications, etc., where improvement of such qualities as manufacturing costs, size, weight, power consumption, etc. is still on the agenda of todays RF design. In order to meet these requirements, new technologies must be actively involved in fabrication of RF components with improved characteristics. One of such fabrication technologies is called LIGA, used before primarily in fluidics, photonics, bioengineering, and micromechanics, and only recently receiving growing attention in RF component fabrication. One of the RF components suffering limitations in performance due to limitations in fabrication capabilities is the compact single metal layer (SML) coupled-line 3-dB coupler, also called hybrid, required in some applications thanks to its ability to divide power equally and electrically isolate the output from the input. In todays practical edge-coupled SML coupler designs, the level of coupling is limited by the capabilities of the photolithographic process to print the coupled lines close enough for tight coupling and it is usually no tighter that 8 dB. A promising way to overcome this limitation is increasing the area of metallic interface of the coupled lines, thus increasing the mutual capacitance of the lines, and inherently the coupling between them. This should be preferably done with keeping the coupler compact with respect to the footprint area, which is attained by making taller conductors, i.e. employing the third dimension. In contrast with previously used RF component fabrication processes, LIGA is the technology that allows the designer to explore the third dimension and build tall conductors while being also able to use small features. When the two-dimensional edge-coupled SML couplers are extended into the three-dimensional structures, they rather become the side-coupled SML couplers. Tall-conductor coupled lines have been characterized in this work to reveal their dependence on their geometry and a 3-dB SML coupler with tall conductors has been developed and fabricated using LIGA at the Institute for Microstructure Technology (IMT), Karlsruhe, Germany. The simulation and measurement results demonstrate the potentially superior performance of LIGA couplers, and the promising capabilities of LIGA for fabrication of RF microstructures.

Avec la croissance actuelle du marché des applications de transfert de données multimédia à très haut débit, les bandes de fréquences autour de 60 GHz sont une nouvelle alternative promettant des performances intéressantes en terme de débits mais soulèvent des défis techniques et technologiques au niveau des architectures et circuits. C'est dans ce cadre que s'inscrit cette thèse, qui propose une approche multi bande impulsionnelle MBOOK avec un récepteur à détection d'énergie, et qui analyse plus spécifiquement les verrous au niveau de l'émetteur. L'étude du canal de propagation à 60 GHz, basée sur les modèles de canaux du standard IEEE 802.15.3c, a permis de démontrer la potentialité de cette architecture et permet d'atteindre des débits de 2 Gbps à 2metres dans un environnement de type résidentiel. Le dimensionnement de l'architecture ainsi que des performances des principaux blocs ont conduit à plusieurs possibilités pour l'architecture de l'émetteur MBOOK à 60 GHz. Les critères ont été d'assurer un compromis performances, consommation. Une étude approfondie sur l'étude des imperfections de certains blocs critiques et l'impact sur l'impulsion transmise, et donc sur les performances du système ont été établies. Le banc de filtres, nécessaire à l'émission et à la réception, représente l'un des verrous, et nous proposons une solution de filtrage à base de lignes couplées. L'étude des solutions de génération d'impulsions, des étages de commutation, et des étages d'amplification de l'émetteur sont détaillées et discutées dans les deux derniers chapitres / With the current increasing market request concerning high speed data rates applications, the 60 GHz frequency bands seems to be one of the new promising alternatives for high data rate wireless communications. In this context, the development of new systems operating at these frequencies becomes a very attractive research subject. This study focuses on nomadic systems offering high data and reconfigurable rates, low complexity, low power consumption for short communications. One of the important tasks in the millimetre wave architecture design is to consider the channel propagation characteristics simultaneously with the technological performance of integrated circuits and antennas. This requires a co-design of the entire system. Therefore, we begun by studying the characteristics of the channel propagation channel at 60GHz according to the IEEE 802.15.3c and IEEE 802.11.ad models. This PHD thesis proposes a new transceiver architecture based on multi-band impulse mode, with On Off Keying modulation schema and non coherent receiver. This architecture is dedicated to nomadic systems offering high data and reconfigurable rates, low complexity, low power consumption for short communications. Analysis and performances for the proposed architecture are presented. More than 2 Gbps at 2 m are obtained. The imperfections of some critical blocks and their impact on the transmitted pulses were analysed and thus the performance of the system has been established. The potentiality of microstrip band pass filter bank presenting a constant relative bandwidth and reasonable insertion losses is presented in this study. The study of pulse generation solutions, switchers, amplification stages and antennas are detailed and discussed in the last two chaptersconstant relative bandwidth and reasonable insertion losses is presented in this study.The study of pulse generation solutions, switchers, amplification stages and antennas are detailed and discussed in the last two chapters.

L’objectif de ce travail de thèse est le développement en technologie intégrée standard d’une structure de ligne de transmission optimisée en termes de pertes, d’encombrement, de facteur de qualité et surtout du choix du niveau de couplage aux fréquences millimétriques. Cette structure a été nommée CS-CPW (Coupled Slow-wave CoPlanar Waveguide). Dans un premier temps, la théorie ainsi que les modèles électriques des CS-CPW sont présentés. Grâce aux modèles et aux simulations électromagnétiques, des coupleurs directionnels avec plusieurs valeurs de couplage (3 dB, 10 dB, 18 dB) ont été conçus en technologie BiCMOS 55 nm. Ils présentent tous une très bonne directivité, elle est toujours supérieure à 15 dB. Un premier prototype de coupleur a été mesuré à 150 GHz. Dans un deuxième temps, des filtres à la base des lignes couplées ont été développés à 80 GHz en utilisant des lignes CS-CPW. Les résultats des simulations présentent des résultats concurrentiels avec l’état de l’art : 11% de bande passante relative et un facteur non-chargé autour de 25. Finalement, trois projets ont démarré à la base de ces lignes. Ces projets sont actuellement utilisés dans deux travaux de thèse et un stage : un RTPS à 47 GHz, un isolateur à 75 GHz et un balun à 80 GHz. / This work focuses on high-performances CS-CPW (Coupled Slow-wave CoPlanar Waveguide) transmission lines in classical CMOS integrated technologies for the millimiter-wave frequency band. First, the theory as well as the electrical models of the CS-CPW are presented. Thanks to the models and electromagnetic simulations, directional couplers with different coupling levels (3 dB, 10 dB, 18 dB) were designed in BiCMOS 55 nm technology. They have a good directivity, always better than 15 dB. A first prototype of a coupler was measured at 150 GHz presenting good agreement with the simulations. Next, coupled-line base filters were developed at 80 GHz using the CS-CPWs. Simulation present competitive results with the state-of-art: 11% of fractional bandwidth and a unload quality factor of 25. Finally, three projects started based on the CS-CPWs. The projects are currently used in two theses and one internship: a RTPS at 47 GHz, an isolator at 75 GHz and a balun at 80 GHz.

In recent years, the wireless industry has witnessed tremendous development for the defense and commercial segments. The explosive growth in the modern radio frequency and microwave systems leads to an increased interest in the research of miniaturized microwave circuits with superior performance. Broadband components, in particular band pass filters (BPFs) and couplers are some of the widely used components in the modern communication systems, software defined radios, cognitive radios, imaging systems and positioning radars. In order to meet these requirements, the use of innovative geometries, a thorough understanding of their behavior by appropriate analytical techniques and the use of appropriate fabrication approaches are essential. This thesis is an effort in this direction. In this thesis work, an aperture in the ground plane is used to achieve the tight coupling in the edge and broadside-coupled coupled lines which may be otherwise difficult due to the fabrication limitations. Since microstrip lines with an aperture in the ground plane are found to be very useful in various MIC and MMIC components, closed form analytical expressions developed here will be useful for their initial synthesis. The performances of components using these are enhanced using open/short circuited resonators, spurlines and stubs. A quasi-static approach has been investigated to obtain simple closed form expressions for a microstrip line with a rectangular aperture in the ground plane. The effect of a rectangular aperture in the ground plane has been incorporated in the commonly used expressions of a regular microstrip line by introducing the concept of an equivalent effective height. The expressions for the effective height microstrip geometries with defected ground are obtained and this has been further extended to various possibilities of two-conductor and three-conductor coupled lines. Analysis of the filters and the couplers are mainly based on the even and odd mode propagation characteristics of coupled lines. This approach is extended in this thesis for three conductor coupled lines. Novel broadband BPFs and couplers and dual band pass filters employing various coupled line configurations and defected ground have been developed in this research work. Most of these components have been implemented on a regular microwave laminate or LTCC medium (planar or multi-layer) and tested for the required RF performances. The experimental results were compared against the analytically computed results based on the circuit models and the full wave simulations using electromagnetic (EM) simulations for the validation. The results are in good agreement. With practical requirements of the organization in mind, additional design elements such as open circuit stubs have been incorporated in some of these designs to achieve the desired performance. It is expected that the wideband filter (3.0GHz to 3.8GHz) and the broadband coupler (4GHz to 6GHz) developed in this thesis work would be deployed in systems developed at the Central Research Laboratory, Bharat Electronics Limited, Bangalore, India. In summary, the present doctoral work strives to (i) establish a simplified analysis method for the microstrip lines and coupled microstrip lines with a rectangular aperture in the ground plane, (ii) extend the even and odd mode analysis of the coupled lines for several new coupled line configurations, (iii) design novel broadband microwave filters, dual band filter and couplers using both these, (iv) fabricate these devices using the planar technologies including LTCC, and (v) validate the analysis and design with important practical applications.

This thesis tackles issues of particular interest regarding analysis and design of passive components at the mm-wave and Terahertz (THz) bands. Innovative analysis techniques and modeling of complex structures, design procedures, and practical implementation of advanced passive devices are presented. The first part of the thesis is dedicated to THz passive components. These days, THz technology suffers from the lack of suitable waveguiding structures since both, metals and dielectric, are lossy at THz frequencies. This implies that neither conventional closed metallic structures used at microwave frequencies, nor dielectric waveguides used in the optical regime, are adequate solutions. Among a variety of new proposals, the Single Wire Waveguide (SWW) stands out due to its low attenuation and dispersion. However, this surface waveguide presents difficult excitation and strong radiation on bends. A Dielectric-Coated Single Wire Waveguide (DCSWW) can be used to alleviate these problems, but advantages of the SWW are lost and new problems arise. Until now, literature has not given proper solution to radiation on bends and, on the other hand, rigorous characterization of these waveguides lacks these days. This thesis provides, for the first time, a complete modal analysis of both waveguides, appropriated for THz frequencies. This analysis is later applied to solve the problem of radiation on bends. Several structures and design procedures to alleviate radiation losses are presented and experimentally validated. The second part of the thesis is dedicated to mm-wave passive components. These days, when implementing passive components to operate at such small, millimetric wavelengths, to ensure proper metallic contact and alignment between parts results challenging. In addition, dielectric absorption becomes significant at mm-wave frequencies. Consequently, conventional hollow metallic waveguides and planar transmission lines present high attenuation so that new topologies are being considered. Gap Waveguides (GWs), based on a periodic structure introducing an Electromagnetic Bandgap effect, result very suitable since they do not require metallic contacts and avoid dielectric losses. However, although GWs have great potential, several issues prevent GW technology from becoming consolidated and universally used. On the one hand, the topological complexity of GWs difficulties the design process since full-wave simulations are time-costly and there is a lack of appropriate analysis methods and suitable synthesis procedures. On the other hand, benefits of using GWs instead of conventional structures are required to be more clearly evidenced with high-performance GW components and proper comparatives with conventional structures. This thesis introduces several efficient analysis methods, models, and synthesis techniques that will allow engineers without significant background in GWs to straightforwardly implement GW devices. In addition, several high-performance narrow-band filters operating at Ka-band and V-band, as well as a rigorous comparative with rectangular waveguide topology, are presented. / Esta tesis aborda problemas actuales en el análisis y diseño de componentes pasivos en las bandas de onda milimétrica y Terahercios (THz). Se presentan nuevas técnicas de análisis y modelado de estructuras complejas, procedimientos de diseño, e implementación práctica de dispositivos pasivos avanzados. La primera parte de la tesis se dedica a componentes pasivos de THz. Actualmente no se disponen de guías de onda adecuadas a THz debido a que ambos, metales y dieléctricos, introducen grandes pérdidas. En consecuencia, no es adecuado escalar las estructuras metálicas cerradas usadas en microondas, ni las guías dieléctricas usadas a frecuencias ópticas. Entre un gran número de recientes propuestas, la Single Wire Waveguide (SWW) destaca por su baja atenuación y casi nula dispersión. No obstante, como guía superficial, la SWW presenta difícil excitación y radiación en curvas. El uso de un recubrimiento dieléctrico, creando la Dielecric-Coated Single Wire Waveguide (DCSWW), alivia estos inconvenientes, pero las ventajas anteriores se pierden y nuevos problemas aparecen. Hasta la fecha, no se han encontrado soluciones adecuadas para la radiación en curvas de la SWW. Además, se echa en falta una caracterización rigurosa de ambas guías. Esta tesis presenta, por primera vez, un análisis modal completo de SWW y DCSWW, adecuado a la banda de THz. Este análisis es aplicado posteriormente para evitar el problema de la radiación en curvas. Se presentan y validan experimentalmente diversas estructuras y procedimientos de diseño. La segunda parte de la tesis abarca componentes pasivos de ondas milimétricas. Actualmente, estos componentes sufren una importante degradación de su respuesta debido a que resulta difícil asegurar contacto metálico y alineamiento adecuados para la operación a longitudes de onda tan pequeñas. Además, la absorción dieléctrica incrementa notablemente a estas frecuencias. En consecuencia, tanto guías metálicas huecas como líneas de transmisión planares convencionales presentan gran atenuación, siendo necesario considerar topologías alternativas. Las Gap Waveguides (GWs), basadas en una estructura periódica que introduce un efecto de Electromagnetic Bandgap, resultan muy adecuadas puesto que no requieren contacto entre partes metálicas y evitan las pérdidas en dieléctricos. No obstante, a pesar del potencial de las GWs, varias barreras impiden la consolidación y uso universal de esta tecnología. Por una parte, la compleja topología de las GWs dificulta el proceso de diseño dado que las simulaciones de onda completa consumen mucho tiempo y no existen actualmente métodos de análisis y diseño apropiados. Por otra parte, es necesario evidenciar el beneficio de usar GWs mediante dispositivos GW de altas prestaciones y comparativas adecuadas con estructuras convencionales. Esta tesis presenta diversos métodos de análisis eficientes, modelos, y técnicas de diseño que permitirán la síntesis de dispositivos GW sin necesidad de un conocimiento profundo de esta tecnología. Asimismo, se presentan varios filtros de banda estrecha operando en las bandas Ka y V con altas prestaciones, así como una comparativa rigurosa con la guía rectangular. / Aquesta tesi aborda problemes actuals en relació a l'anàlisi i disseny de components passius en les bandes d'ona mil·limètrica i Terahercis. Es presenten noves tècniques d'anàlisi i modelatge d'estructures complexes, procediments de disseny, i implementació pràctica de dispositius passius avançats. La primera part de la tesi es focalitza en components passius de THz. Actualment no es disposen de guies d'ona adequades a THz causa que tots dos, metalls i dielèctrics, introdueixen grans pèrdues. En conseqüència, no és adequat escalar les estructures metál·liques tancades usades en microones, ni les guies dielèctriques usades a freqüències òptiques. Entre un gran nombre de propostes recents, la Single Wire Waveguide (SWW) destaca per la seua baixa atenuació i quasi nul·la dispersió. No obstant això, com a guia superficial, la SWW presenta difícil excitació i radiació en corbes. L'ús d'un recobriment dielèctric, creant la Dielecric-Coated Single Wire Waveguide (DCSWW), alleuja aquests inconvenients, però els avantatges anteriors es perden i nous problemes apareixen. Fins a la data, no s'han trobat solucions adequades per a la radiació en corbes de la SWW. A més, es troba a faltar una caracterització rigorosa d'ambdues guies. Aquesta tesi presenta, per primera vegada, un anàlisi modal complet de SWW i DCSWW, adequat a la banda de THz. Aquest anàlisi és aplicat posteriorment per evitar el problema de la radiació en corbes. Es presenten i validen experimentalment diverses estructures i procediments de disseny. La segona part de la tesi es centra en components passius d'ones mil·limètriques. Actualment, aquests components pateixen una important degradació de la seua resposta a causa de que resulta difícil assegurar contacte metàl·lic i alineament adequats per a l'operació a longituds d'ona tan menudes. A més, l'absorció dielèctrica incrementa notablement a aquestes freqüències. En conseqüència, tant guies metàl·liques buides com línies de transmissió planars convencionals presenten gran atenuació, sent necessari considerar topologies alternatives. Les Gap Waveguides (GWs), basades en una estructura periòdica que introdueix un efecte de Electromagnetic Bandgap, resulten molt adequades ja que no requereixen contacte entre parts metàl·liques i eviten les pèrdues en dielèctrics. No obstant, tot i el potencial de les GWs, diverses barreres impedixen la consolidació i ús universal d'aquesta tecnologia. D'una banda, la complexa topologia de les GWs dificulta el procés de disseny atés que les simulacions d'ona completa consumeixen molt de temps i no existeixen actualment mètodes d'anàlisi i disseny apropiats. D'altra banda, és necessari evidenciar el benefici d'utilitzar GWs mitjançant dispositius GW d'altes prestacions i comparatives adequades amb estructures convencionals. Aquesta tesi presenta diversos mètodes d'anàlisi eficients, models, i tècniques de disseny que permetran la síntesi de dispositius GW sense necessitat d'un coneixement profund d'aquesta tecnologia. Així mateix, es presenten diversos filtres de banda estreta operant en les bandes Ka i V amb altes prestacions, així com una comparativa rigorosa amb la guia rectangular. / Berenguer Verdú, AJ. (2017). Analysis and design of efficient passive components for the millimeter-wave and THz bands [Tesis doctoral]. Universitat Politècnica de València. https://doi.org/10.4995/Thesis/10251/84004