New technology is revolutionizing the retail industry by providing new conditions and questioning the traditional way of shopping. Wearable devices have gained popularity lately and smartwatches are one of the most popular among them [12]. However, little research has been made in the area of creating experiences for grocery retail purchases using smartwatches, which is where this study aims to contribute. Through establishing what affordances and challenges there might be when creating a digital experience for people using smart watches with the intent of purchasing groceries. With the support from CompanyX, one of the leading companies with their core business in grocery retail, the study was built around Apple Watch users as the target group. An experience-centered design method was used to incorporate the end user at each stage of the design process. A high fidelity prototype was created based on the decoded material from the semi-structured interviews performed. The prototype was then evaluated in a remote setup using both in-depth test sessions and a broader evaluation questionnaire. The results showed that the prototype proposed added value for the user by providing an experience that would encourage a more structured and inspirational way of purchasing groceries. The attitude towards the prototype was positive. However, further improvements are suggested and discussed aiming to suit the limited interaction options of a smartwatch, better. The study provides insights in what the attitude looks towards different types of functionalities aiming to create an enhanced grocery shopping experience among Apple Watch users. / Nya tekniska förutsättningar revolutionerar handelsmarknaden genom nya förutsättningar som ifrågasätter traditionellt sätt att handla på. Teknologier som Wearables har under de senaste åren blivit mycket populära där de vristburna enheterna är de som står ut särskilt i popularitet. Dock har lite studier gjorts på hur man med hjälp av Wearables skulle kunna skapa en upplevelse ämnad att underlätta shoppingupplevelsen hos personer som handlar matvaror. Vad öppnar en smartklocka upp för förutsättningar och vad finns det för utmaningar att skapa en upplevelse med hjälp av en smartklocka? Med stöd från CompanyX, en av Sveriges ledande företag inom dagligvaruhandel, byggdes studien kring Apple Watch-användare. Användaren var central genom hela studien då den var byggt runt användarbeteenden och användarupplevelser. En prototyp skapades baserat på de resultat som fastställdes kring användandet, samt testad på slutanvändarna. Resultaten visade att prototypen skapade värde för användaren då den uppmuntrade till ett mer strukturerat samt inspirerande sätt att handla matvaror på. Prototypen togs emot positivt men skulle gynnas av ytterligare förbättringar och design iterationer främst kring smartklockans begränsade interaktionsmöjligheter. Studien bidrar med insikter kring hur attityden ser ut kring skapandet av en användarupplevelse för matvaruhandel i en smartklocka hos Apple Watch användare.

Background: Increased pressure, rising demand and cost constraints have driven a need for radical service re-design in the NHS. To deliver re-design objectives it is necessary to understand how they are perceived by service users and providers. Aim: To investigate the views of patients and health care professionals (HCP) on aspects of health policy and service re-design affecting primary care. Setting: Patients and HCPs from one geographical area in England. Method: Themes from phase one qualitative interviews were explored quantitatively using a questionnaire in phase two and a discrete choice experiment (DCE) in phase three. Factor analysis was used to explore HCP responses in phase two. In phase three the DCE was administered to explore patients‟ relative priorities of a range of attributes. Results: HCPs had concerns that the Quality Outcomes Framework (QOF) detracted from the patient‟s agenda and did not improve health outcomes. GPs felt continuity of care was important Monday through Friday but were not keen on its provision out of hours. Neither did they feel nurses could run chronic disease management clinics without a GP present. Patients felt continuity could be provided by different HCPs for different conditionsPatients stated continuity of care and consultation duration were the most important attributes in a primary care service. However, in the DCE they prioritised both being seen on the day and by a GP over longer appointments. Patient preference to be seen by a GP may reflect the low uptake of non-medical prescribing in the area. Conclusion: Continuity of care, while remarked as being important to both HCPs and patients, appears less important when weighted against other primary care service attributes. HCPs appear to want longer consultations whereas patients saw time as encompassing both the time to wait for an appointment and consultation length. For patients, the quality of the time with a HCP may be more important than its duration, additionally patients appear to want choice but not necessarily to choose.

Background: Mixed-methods research (MMR) offers much to healthcare professions on clinical and research levels. Speech-language therapists and audiologists work in both educational and health settings where they deal with real-world problems. Through the nature of their work, they are confronted with multifaceted questions arising from their efforts to provide evidence-based services to individuals of all ages with communication disorders. MMR methods research is eminently suited to addressing such questions. Objective: The aim of this tutorial is to increase awareness of the value of MMR, especially for readers less familiar with this research approach. Method: A literature review was conducted to provide an overview of the key issues in MMR. The tutorial discusses the various issues to be considered in the critical appraisal of MMR, followed by an explanation of the process of conducting MMR. A critical review describes the strengths and challenges in MMR. Results: MMR is less commonly used or published in the fields of speech-language therapy and audiology. Conclusion: Researchers working in teams can draw on the strengths of different disciples and their research approaches. Such collaborative enterprises will contribute to capacity building. Researchers, SLTs and audiologists are encouraged to make use of MMR to address the complex research issues in the multicultural, multifaceted South African context. MMR makes an important contribution to the understanding of individuals with communication disorders, and in turn, researchers in the two disciplinary fields of speech-language therapy and audiology can contribute to the development of this research approach. MMR is well suited to the complexity of South African contexts and its populations, as it can provide multiple perspectives of a topic.

Made available in DSpace on 2016-06-02T20:09:12Z (GMT). No. of bitstreams: 1 3205.pdf: 5300214 bytes, checksum: 3f861c26909b3c7508f3c108c17ef408 (MD5) Previous issue date: 2010-08-20 / Financiadora de Estudos e Projetos / The identification and resolution of interfaces is a requirement that must be met for additional methods for evaluating design for Hydraulic and Sanitary Building Services (plumbing systems). The reason is that these building systems, in general, may have a higher incidence of problems of compatibility with others, because they all relate to. In this context, this work aims to identify the main physical interfaces among the plumbing systems, masonry and structures systems, which occur in the pavement type of residential multistory buildings. The building system of fuel gas is also discussed, because it works in conjunction with cold water system in these buildings. Physical interfaces are considered: between plumbing systems and non-loadbearing walls or structural masonry; and between the plumbing systems and masonry structures and reinforced concrete cast on site. For this literature review was performed and case studies in the cities of Ribeirão Preto, São Carlos and São Paulo, comprising six companies and two buildings (units of analysis). Of the companies surveyed, two are construction and incorporation companies (the contractors). Four companies are design offices (contracted), two specialized in plumbing systems, one in masonry structure, and one architectural design offices specializing in non-loadbearing walls. The literature review is related to the main recommendations of the Brazilian technical standards and with the necessary information for the design phases, referring to the interfaces of the systems mentioned. The case studies resulted in findings that identified the compliance and nonconformities resulting from physical interaction among the various designs necessary for the production of buildings. Through these case studies, it was still possible to develop a matrix for the interfaces found on the pavement type, and relating them to main stages of the design. The results of this study can allow feedback from the design stage, thus contributing to the same quality as the product. / A identificação e a solução de interfaces é um dos requisitos que devem ser atendidos para complementar os métodos de avaliação dos projetos dos Sistemas Prediais Hidráulicos e Sanitários (SPHS). Isto porque estes sistemas prediais, de um modo geral, podem apresentar maior incidência de problemas de compatibilização com os demais, pois se relacionam com todos eles. Neste contexto, esta dissertação tem por objetivo identificar as principais interfaces físicas entre os SPHS e os de vedações e estruturas, que ocorrem no pavimento tipo de edifícios residenciais de múltiplos pavimentos. O sistema predial de gás combustível também é abordado, pois trabalha conjuntamente com o predial de água fria nesses edifícios. As interfaces físicas consideradas são: entre os SPHS e as vedações com blocos cerâmicos convencionais e estruturais, e entre os SPHS e as estruturas de alvenaria e de concreto armado moldado no local. Para isso foi realizada revisão bibliográfica e estudo de casos nas cidades de Ribeirão Preto, São Carlos e São Paulo, compreendendo seis empresas e dois edifícios (unidades de análise). Das empresas consultadas, duas empresas são incorporadoras e construtoras (contratantes). Quatro empresas são de projetos (contratadas), sendo duas especializadas em projetos de sistemas prediais, uma de alvenaria estrutural, e uma de arquitetura especializada em alvenaria de vedação. A revisão bibliográfica está relacionada com as principais recomendações das normas técnicas brasileiras e com as informações necessárias para as fases de projeto, referentes às interfaces dos sistemas citados. O estudo de casos implicou em resultados que permitiram identificar as conformidades e as inconformidades físicas decorrentes da interação entre os distintos projetos necessários à produção de edifícios. Através deste, foi possível ainda, elaborar uma matriz para as principais interfaces encontradas no pavimento tipo, relacionando-as com as fases de projeto. Os resultados deste trabalho possibilitam a retroalimentação da etapa projeto, contribuindo para a qualidade do mesmo como produto.

Vertical stacking—based on modern manufacturing and integration technologies—of multiple 2D chips enables three-dimensional integrated circuits (3D ICs). This exploitation of the third dimension is generally accepted for aiming at higher packing densities, heterogeneous integration, shorter interconnects, reduced power consumption, increased data bandwidth, and realizing highly-parallel systems in one device. However, the commercial acceptance of 3D ICs is currently behind its expectations, mainly due to challenges regarding manufacturing and integration technologies as well as design automation. This work addresses three selected, practically relevant design challenges: (i) increasing the constrained reusability of proven, reliable 2D intellectual property blocks, (ii) planning different types of (comparatively large) through-silicon vias with focus on their impact on design quality, as well as (iii) structural planning of massively-parallel, 3D-IC-specific interconnect structures during 3D floorplanning. A key concept of this work is to account for interconnect structures and their properties during early design phases in order to support effective and high-quality 3D-IC-design flows. To tackle the above listed challenges, modular design-flow extensions and methodologies have been developed. Experimental investigations reveal the effectiveness and efficiency of the proposed techniques, and provide findings on 3D integration with particular focus on interconnect structures. We suggest consideration of these findings when formulating guidelines for successful 3D-IC design automation. / Dreidimensional integrierte Schaltkreise (3D-ICs) beruhen auf neuartigen Herstellungs- und Integrationstechnologien, wobei vor allem “klassische” 2D-ICs vertikal zu einem neuartigen 3D-System gestapelt werden. Dieser Ansatz zur Erschließung der dritten Dimension im Schaltkreisentwurf ist nach Expertenmeinung dazu geeignet, höhere Integrationsdichten zu erreichen, heterogene Integration zu realisieren, kürzere Verdrahtungswege zu ermöglichen, Leistungsaufnahmen zu reduzieren, Datenübertragungsraten zu erhöhen, sowie hoch-parallele Systeme in einer Baugruppe umzusetzen. Aufgrund von technologischen und entwurfsmethodischen Schwierigkeiten bleibt jedoch bisher die kommerzielle Anwendung von 3D-ICs deutlich hinter den Erwartungen zurück. In dieser Arbeit werden drei ausgewählte, praktisch relevante Problemstellungen der Entwurfsautomatisierung von 3D-ICs bearbeitet: (i) die Verbesserung der (eingeschränkten) Wiederverwendbarkeit von zuverlässigen 2D-Intellectual-Property-Blöcken, (ii) die komplexe Planung von verschiedenartigen, verhältnismäßig großen Through-Silicion Vias unter Beachtung ihres Einflusses auf die Entwurfsqualität, und (iii) die strukturelle Einbindung von massiv-parallelen, 3D-IC-spezifischen Verbindungsstrukturen während der Floorplanning-Phase. Das Ziel dieser Arbeit besteht darin, Verbindungsstrukturen mit deren wesentlichen Eigenschaften bereits in den frühen Phasen des Entwurfsprozesses zu berücksichtigen. Dies begünstigt einen qualitativ hochwertigen Entwurf von 3D-ICs. Die in dieser Arbeit vorgestellten modularen Entwurfsprozess-Erweiterungen bzw. -Methodiken dienen zur effizienten Lösung der oben genannten Problemstellungen. Experimentelle Untersuchungen bestätigen die Wirksamkeit sowie die Effektivität der erarbeiten Methoden. Darüber hinaus liefern sie praktische Erkenntnisse bezüglich der Anwendung von 3D-ICs und der Planung deren Verbindungsstrukturen. Diese Erkenntnisse sind zur Ableitung von Richtlinien für den erfolgreichen Entwurf von 3D-ICs dienlich.

The diploma thesis deals with preparation and realization of D1 reconstruction of D1-212 bridge in Ostrovačice. It is a motorway bridge that transfers traffic over road II / 386. The reconstruction will demolish the superstructure of bridge with bridge equipment and parts of the abutments and their new construction. The preparation of the project solves the engineering report, the block plan drawing, the financial and time schedule - by objects, the budget SO 201, the study of the implementation of the main construction technologys, the project of the site equipment, the design of the main building machines, the SO 201 time schedule, a desigh of the bill of quantities for structure, technical note for superstructure of a bridge and control and test plans. Part of the preparation of the building is the processing of the emergency plan.

Vertical stacking—based on modern manufacturing and integration technologies—of multiple 2D chips enables three-dimensional integrated circuits (3D ICs). This exploitation of the third dimension is generally accepted for aiming at higher packing densities, heterogeneous integration, shorter interconnects, reduced power consumption, increased data bandwidth, and realizing highly-parallel systems in one device. However, the commercial acceptance of 3D ICs is currently behind its expectations, mainly due to challenges regarding manufacturing and integration technologies as well as design automation. This work addresses three selected, practically relevant design challenges: (i) increasing the constrained reusability of proven, reliable 2D intellectual property blocks, (ii) planning different types of (comparatively large) through-silicon vias with focus on their impact on design quality, as well as (iii) structural planning of massively-parallel, 3D-IC-specific interconnect structures during 3D floorplanning. A key concept of this work is to account for interconnect structures and their properties during early design phases in order to support effective and high-quality 3D-IC-design flows. To tackle the above listed challenges, modular design-flow extensions and methodologies have been developed. Experimental investigations reveal the effectiveness and efficiency of the proposed techniques, and provide findings on 3D integration with particular focus on interconnect structures. We suggest consideration of these findings when formulating guidelines for successful 3D-IC design automation.:1 Introduction 1.1 The 3D Integration Approach for Electronic Circuits 1.2 Technologies for 3D Integrated Circuits 1.3 Design Approaches for 3D Integrated Circuits 2 State of the Art in Design Automation for 3D Integrated Circuits 2.1 Thermal Management 2.2 Partitioning and Floorplanning 2.3 Placement and Routing 2.4 Power and Clock Delivery 2.5 Design Challenges 3 Research Objectives 4 Planning Through-Silicon Via Islands for Block-Level Design Reuse 4.1 Problems for Design Reuse in 3D Integrated Circuits 4.2 Connecting Blocks Using Through-Silicon Via Islands 4.2.1 Problem Formulation and Methodology Overview 4.2.2 Net Clustering 4.2.3 Insertion of Through-Silicon Via Islands 4.2.4 Deadspace Insertion and Redistribution 4.3 Experimental Investigation 4.3.1 Wirelength Estimation 4.3.2 Configuration 4.3.3 Results and Discussion 4.4 Summary and Conclusions 5 Planning Through-Silicon Vias for Design Optimization 5.1 Deadspace Requirements for Optimized Planning of Through-Silicon Vias 5.2 Multiobjective Design Optimization of 3D Integrated Circuits 5.2.1 Methodology Overview and Configuration 5.2.2 Techniques for Deadspace Optimization 5.2.3 Design-Quality Analysis 5.2.4 Planning Different Types of Through-Silicon Vias 5.3 Experimental Investigation 5.3.1 Configuration 5.3.2 Results and Discussion 5.4 Summary and Conclusions 6 3D Floorplanning for Structural Planning of Massive Interconnects 6.1 Block Alignment for Interconnects Planning in 3D Integrated Circuits 6.2 Corner Block List Extended for Block Alignment 6.2.1 Alignment Encoding 6.2.2 Layout Generation: Block Placement and Alignment 6.3 3D Floorplanning Methodology 6.3.1 Optimization Criteria and Phases and Related Cost Models 6.3.2 Fast Thermal Analysis 6.3.3 Layout Operations 6.3.4 Adaptive Optimization Schedule 6.4 Experimental Investigation 6.4.1 Configuration 6.4.2 Results and Discussion 6.5 Summary and Conclusions 7 Research Summary, Conclusions, and Outlook Dissertation Theses Notation Glossary Bibliography / Dreidimensional integrierte Schaltkreise (3D-ICs) beruhen auf neuartigen Herstellungs- und Integrationstechnologien, wobei vor allem “klassische” 2D-ICs vertikal zu einem neuartigen 3D-System gestapelt werden. Dieser Ansatz zur Erschließung der dritten Dimension im Schaltkreisentwurf ist nach Expertenmeinung dazu geeignet, höhere Integrationsdichten zu erreichen, heterogene Integration zu realisieren, kürzere Verdrahtungswege zu ermöglichen, Leistungsaufnahmen zu reduzieren, Datenübertragungsraten zu erhöhen, sowie hoch-parallele Systeme in einer Baugruppe umzusetzen. Aufgrund von technologischen und entwurfsmethodischen Schwierigkeiten bleibt jedoch bisher die kommerzielle Anwendung von 3D-ICs deutlich hinter den Erwartungen zurück. In dieser Arbeit werden drei ausgewählte, praktisch relevante Problemstellungen der Entwurfsautomatisierung von 3D-ICs bearbeitet: (i) die Verbesserung der (eingeschränkten) Wiederverwendbarkeit von zuverlässigen 2D-Intellectual-Property-Blöcken, (ii) die komplexe Planung von verschiedenartigen, verhältnismäßig großen Through-Silicion Vias unter Beachtung ihres Einflusses auf die Entwurfsqualität, und (iii) die strukturelle Einbindung von massiv-parallelen, 3D-IC-spezifischen Verbindungsstrukturen während der Floorplanning-Phase. Das Ziel dieser Arbeit besteht darin, Verbindungsstrukturen mit deren wesentlichen Eigenschaften bereits in den frühen Phasen des Entwurfsprozesses zu berücksichtigen. Dies begünstigt einen qualitativ hochwertigen Entwurf von 3D-ICs. Die in dieser Arbeit vorgestellten modularen Entwurfsprozess-Erweiterungen bzw. -Methodiken dienen zur effizienten Lösung der oben genannten Problemstellungen. Experimentelle Untersuchungen bestätigen die Wirksamkeit sowie die Effektivität der erarbeiten Methoden. Darüber hinaus liefern sie praktische Erkenntnisse bezüglich der Anwendung von 3D-ICs und der Planung deren Verbindungsstrukturen. Diese Erkenntnisse sind zur Ableitung von Richtlinien für den erfolgreichen Entwurf von 3D-ICs dienlich.:1 Introduction 1.1 The 3D Integration Approach for Electronic Circuits 1.2 Technologies for 3D Integrated Circuits 1.3 Design Approaches for 3D Integrated Circuits 2 State of the Art in Design Automation for 3D Integrated Circuits 2.1 Thermal Management 2.2 Partitioning and Floorplanning 2.3 Placement and Routing 2.4 Power and Clock Delivery 2.5 Design Challenges 3 Research Objectives 4 Planning Through-Silicon Via Islands for Block-Level Design Reuse 4.1 Problems for Design Reuse in 3D Integrated Circuits 4.2 Connecting Blocks Using Through-Silicon Via Islands 4.2.1 Problem Formulation and Methodology Overview 4.2.2 Net Clustering 4.2.3 Insertion of Through-Silicon Via Islands 4.2.4 Deadspace Insertion and Redistribution 4.3 Experimental Investigation 4.3.1 Wirelength Estimation 4.3.2 Configuration 4.3.3 Results and Discussion 4.4 Summary and Conclusions 5 Planning Through-Silicon Vias for Design Optimization 5.1 Deadspace Requirements for Optimized Planning of Through-Silicon Vias 5.2 Multiobjective Design Optimization of 3D Integrated Circuits 5.2.1 Methodology Overview and Configuration 5.2.2 Techniques for Deadspace Optimization 5.2.3 Design-Quality Analysis 5.2.4 Planning Different Types of Through-Silicon Vias 5.3 Experimental Investigation 5.3.1 Configuration 5.3.2 Results and Discussion 5.4 Summary and Conclusions 6 3D Floorplanning for Structural Planning of Massive Interconnects 6.1 Block Alignment for Interconnects Planning in 3D Integrated Circuits 6.2 Corner Block List Extended for Block Alignment 6.2.1 Alignment Encoding 6.2.2 Layout Generation: Block Placement and Alignment 6.3 3D Floorplanning Methodology 6.3.1 Optimization Criteria and Phases and Related Cost Models 6.3.2 Fast Thermal Analysis 6.3.3 Layout Operations 6.3.4 Adaptive Optimization Schedule 6.4 Experimental Investigation 6.4.1 Configuration 6.4.2 Results and Discussion 6.5 Summary and Conclusions 7 Research Summary, Conclusions, and Outlook Dissertation Theses Notation Glossary Bibliography

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