Doctor Theologiae - DTh / Benewens persoonlike belangstelling in die boodskap van die Ou Testament vir die kerk van vandag, is dit veral kontemporêre teologiese debatte en verwikkelinge op die kerklike terrein, plaaslik sowel as op die breë ekumeniese front, wat tot hierdie studie aanJeiding gegee het. Eerstens: Een van die artikels van die Belharbelydenis' lui onder andere: "Ons glo ... dat God op 'n besondere wyse (Homself geopenbaar het as) die God van die noodlydende, die arme en die verontregte ...(my kursivering); dat Hy aan die verdruktes reg laat geskied en brood aan die hongeriges gee; dat Hy die gevangenes bevry en blindes laat sien; dat Hy dié wat bedruk is ondersteun, die vreemdelinge beskerm en weeskinders en weduwees help en die pad van die goddelose versper." Toe dié spesifieke artikel van die konsepbelydenis gedurende die sinodesitting' onder bespreking gekom het, het somrnige van die afgevaardigdes ernstige besware geopper teen die wyse van formulering dat God op 'n besondere wyse die God van die noodlydende, die arme en die verontregte is. So 'n stelling skep, volgens hulle, die indruk dat God inderdaad kant gekies het vir die noodlydendes en dat Hy dus by implikasie 'n God van die armes, verdruktes en verontregtes is. Die sinodale kommissie wat VIr die formulering van die konsepbelydenis verantwoordelik was, het hierop ontkennend geantwoord en tot gerusstelling van die sinodegangers aangevoer dat die betrokke artikel eenvoudig beskou moet word as die verwoording van die "basiese, oer-Bybelse en oer-Christelike oortuiging, naamlik dat God die hulp van die hulpelose is"(Smit 1984:65). Die konsepbelydenis is aan die Kerk deurgegee met die oog op kritiese besinning gedurende die sinodereses en vir die voorlegging van kommentaar by die daaropvolgende sinode.' Vanselfsprekend sou só 'n totaal nuwe belydenisskrif sy eie invloed op die kerklike lewe uitoefen. Daar kan verwag word dat verskillende aksente op sekere artikels mettertyd gelê sal word. Oor sommige van die stellings sal gaandeweg nuwe interpretasies na vore kom en 'n verskeidenheid van betekenisnuanses sal met verloop van tyd verwag kan word Belangrikste van alles is dat bepaalde formuleringe deur die loop van die kerk se geskiedenis opnuut aan die hand van die Skrif getoets sal word. Die studie is indertyd geïnisieer in die hoop om in so 'n Wirkungsgeschichte 'n bydrae te lewer.

Mass mortality events (MMEs) are die-offs that result in increased carrion biomass and sometimes the impairment of functional roles. Concurrently, several vulture species are declining. Carrion is a basal resource in ecosystems and its recycling by vultures is considered an ecosystem service. However, the consequences of simultaneously increasing carrion loads and declining vulture populations are unknown. I developed a theoretical framework predicting that, with increasing carrion biomass, carrion food web diversity would increase horizontally and vertically, respectively increasing and decreasing carrion recycling efficiency. Using a manipulative experiment, I investigated the role of bottom-up and top-down forces affecting plant communities during an MME. I selected 5 sites to establish 6 treatments crossing different levels of carrion addition and nutrient addition, and control with vertebrate scavenger and herbivore access. I transplanted six cherrybark oak (Quercus pagoda) seedlings to each plot, protecting half of them from herbivory. Carrion biomass shifted dominance of plant functional groups to favor annual plants, an effect reduced by scavenger access. Herbivore access affected plant community response to carrion and limited growth and survival of transplanted seedlings regardless of treatment. Nutrient addition did not affect plant communities, growth, and survival suggesting that MME effects on plants are likely mediated primarily by top-down forces. To determine if behavioral plasticity of vultures affects carrion recycling efficiency, I monitored turkey (Cathartes aura) and black (Coragyps atratus) vulture behavior. Both species increased group size, but only black vultures increased individuals feeding per group and activity overlap between species increased with increasing carrion biomass. As a result, estimated carrion consumption by vultures increased with carrion biomass suggesting behavioral plasticity may alleviate some of the effects of vulture declines on carrion recycling. Finally, vultures compete with invertebrate scavengers so declining vultures may release their populations to compensate for the loss. However, in one of my experiments, variation in vulture visitation was negatively correlated with the abundance of blowflies parasitized by Entomophthora sp. Our observations may suggest that vultures were more likely mediating carrion decomposition affecting parasitism, which may limit blowflies from compensating for declining vultures.

The mechanical properties of pure Aluminium, Al-0.2%Cu and Al-0.4%Cu at large strains were studied by channel-die compression at three different temperatures: 77K, 200K and 300K. The results were interpreted in terms of work hardening rate versus stress (0/r) diagrams. The evolution of the structure was studied on a range of scales from macroscopic to microscopic, by optical study of slip lines, X-ray diffraction for texture measurements, Electron Back-Scattering Kikuchi Patterns for local texture measurements, and by Transmission Electron Microscopy for microstructural information. Intense shear banding was observed at large strains in all alloys at all temperatures. The texture evolution was shown to be consistent with this change in deformation mode. At low temperatures, stage HI of deformation was shown to be represented by a straight line in the 6lr diagram. Increasing the temperature lead to a dramatic decrease in work hardening rate and to an increasing concavity of the 0lr plots. The addition of solutes to pure Aluminium was shown to result in an increase of the work hardening rate, which could be represented by a simple translation of the 0/r plots on the stress axis. At large strains, all three materials experienced a stage (stage IV) of constant work hardening at low rate. The stage IV work hardening rate decreased with increasing temperature, and was not influenced by solute content. The stage Ill-Stage IV transition was very sharp at 77K and smoother at higher testing temperatures. Phenomenological models were developed for the prediction of the influence of temperature and solute content on work hardening. Moderate strains were modelled taking into account the evolution of the dislocation density into two different populations during the deformation. The influence of solutes on work hardening was modelled by considering how segregation of solute atoms at the dislocation cores influences dynamic recovery. Stage IV work hardening was considered to arise from the accumulation of dislocation debris resulting from the dynamic recovery events. / Thesis / Master of Engineering (ME)

No description available.

Die-attachment, as the first level of electronics packaging, plays a key role for the overall performance of the power electronics packages. Nanosilver sintering has becoming an emerging solder-free, environmental friendly die-attach technology. Researchers have demonstrated the feasibility of die-attachment on silver (Ag) or gold (Au) surfaces by pressure-less or low-pressure (< 5 MPa) nanosilver sintering. This study extended the application of nanosilver sintering die-attach technique to copper (Cu) surface. The main challenge of nanosilver sintering on Cu is the formation of thick Cu oxide during processing, which may lead to weak joints. In this study, different processes were developed based on the die size: for small-area dice (< 5 * 5 mm2), different sintering atmospheres (e.g. forming gas) were applied to protect Cu surface from oxidation; for large-area dice (> 5 * 5 mm2), a double-print, low-pressure (< 5 MPa) assisted sintering process was developed. For both processes, die-shear tests demonstrated die-shear strength can reach 40 MPa. The effects of different sintering parameters of the processing were analyzed by different material characterization techniques. With forming gas as sintering atmosphere, not only Cu surface was protected from oxidation, but also the organics in the paste were degraded with nanosilver particles as catalyst. External pressure applied in the processing not only increased the density of sintered Ag, but also enhanced the contact area of sintered-Ag/Cu interface. Microstructure of Ag/Cu interface were characterized by transmission electron microscopy (TEM). Characterization results indicate that Ag/Cu metallic bonds formed at the interface, which verified the high die-shear strength of the die-attachment. Thermal performance of nanosilver sintered die-attachment on Cu was evaluated. A system was designed and constructed for measuring both transient thermal impedance (Zth) and steady-state thermal resistance (Rth) of insulated gate bipolar transistor (IGBT) packages. The coefficient of variation (CV) of Zth measurement by the system was lower than 0.5%. Lead-free solder (SAC305) was applied in comparison of thermal performance with nanosilver paste. With same sample geometry and heating power level, nanosilver sintered joints on Cu showed in average 12.6% lower Zth and 20.1% lower Rth than SAC305 soldered joints. Great thermal performances of nanosilver sintering die-attachment on Cu were mainly due to the low thermal resistivity of sintered-Ag and the good bonding quality. Both passive temperature cycling and active power cycling tests were conducted to evaluate the reliability of nanosilver sintered joints on Cu. For passive temperature cycling tests (-40 - 125 C), the die-shear strengths of mechanical samples had no significant drop over 1000 cycles, and nanosilver sintered IGBT on Cu packages showed almost no change on Zth after 800 cycles. For active power cycling test (Tj = 45 - 175 C), nanosilver sintered IGBT on Cu assembly had a lifetime over 48,000 cycles. The failure point of the assembly was the detachment of the wirebonds. Great reliability performances of nanosilver sintered die-attachment on Cu were mainly due to the low mismatch of coefficient of thermal expansion (CTE) between sintered-Ag and Cu. Meanwhile, low inter-diffusion rate between Ag and Cu prevented the interface from the reliability issue related to Kirkendall voids, which often took place in tin (Sn) -based solder joints. / Ph. D.

Yes / Cavitation is an important phenomenon in solid-phase deformation of polymers, which either has potential adverse effects on physical properties or creates potential opportunities for new properties. In either case, it needs to be better understood to help achieve better control of cavitation and its effects. Cavitation associated with solid-phase deformation in a β-nucleated isotactic polypropylene was found to depend on the solid-phase deformation route employed. Compared with samples obtained by free tensile stretching, cavitation was suppressed in samples deformed via die-drawing, although an almost identical β-to α-phase transition was observed for both deformation routes. Even when die-drawn samples were subsequently deformed to large strains by free stretching, there was still no comparable cavitation compared with the single free tensile-stretching route. The die-drawing process appears to suppress cavitation by fundamentally diminishing the number of growable nuclei of cavities, rather than merely hindering the growth of cavities. A relationship between cavitation intensity and the fractions of lamellae along specific directions has been established. During subsequent free stretching of die-drawn samples, newly created cavities were suggested to be initiated within the crystalline layers. The reduction of the cavity nuclei in the die-drawing process originated from the stabilization of the connections between the crystalline blocks within the lamellae. / This work is supported by the National Natural Science Foundation of China (21704102 and 51525305), Newton Advanced Fellowship of the Royal Society, United Kingdom (NA 150222) and ExxonMobil.

No abstract provided. / Thesis / Master of Science (MSc)

In dieser Dissertation wird eine umfassende Untersuchung von Perowskit-Tintenformulierungen für die Herstellung von hocheffizienten MAPbI3- und FAPbI3-Bauelementen durchgeführt. Darüber hinaus schlagen wir einen kombinatorischen Slot-Die-Beschichtungsansatz für das Screening und die Herstellung von Perowskit-Zusammensetzungen vor. Diese Ergebnisse zeigen, dass die Slot-Die-Beschichtung eine vielversprechende Technik für die Hochskalierung von Metallhalogenid-Perowskit-Dünnschichten ist. / This dissertation gives a comprehensive investigation into perovskite ink formulations for the fabrication of highly efficient MAPbI3 and FAPbI3 devices. Additionally, we propose a combinatorial slot-die coating approach for screening and fabricating perovskite compositions. These results demonstrate that slot-die coating is a promising technique for the upscaling of metal-halide perovskite thin-films.

No description available.

No description available.