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Compact thermal modeling for 3D IC designLi, Xiaoming, January 2005 (has links)
Thesis (M.S.)--State University of New York at Binghamton, Watson School of Engineering and Applied Science (Electrical Engineering), 2005. / Includes bibliographical references.
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Multi-physics investigation on the failure mechanism and short-time scale wave motion in flip-chip configurationOh, Yoonchan 01 November 2005 (has links)
The demands for higher clock speeds and larger current magnitude in high-performance flip-chip electronic packaging configurations of small footprint have inevitably raised the concern over rapid thermal transients and large thermal spatial gradients that could severely compromise package performance. Coupled electrical-thermal-mechanical multi-physics were explored to evaluate the concern and to establish the knowledge base necessary for improving flip-chip reliability. It was found that within the first few hundred nanoseconds upon power-on, there were fast attenuating, dispersive shock waves of extremely high frequency propagating in the package. The notions of high cycle fatigue, power density and joint time-frequency analysis were employed to characterize the waves and the various failure modes associated with the moving of these short-lived dynamical disturbances in bulk materials and along interfaces. A qualitative measure for failure was also developed which enables the extent of damages inflicted by short-time wave propagation to be calculated in the probability sense. Failure modes identified in this study are all in agreement with what have been observed in industry. This suggests that micron cracks or interfacial flaws initiated at the short-time scale would be further propagated by the CTE-induced thermal stresses at the long-time scale and result in eventual electrical disruptions.
Although epoxy-based underfills with fillers were shown to be effective in alleviating thermal stresses and improving solder joint fatigue performance in thermal cycling tests of long-time scale, underfill material viscoelasticity was found to be insignificant in attenuating short-time scale wave propagation. On the other hand, the inclusion of Cu interconnecting layers in flip-chips was shown to perform significantly better than Al layers in suppressing short-time scale effects. These results imply that, if improved flip-chip reliability is to be achieved, all packaging constituent materials need to be formulated to have well-defined short-time scale and long-time scale properties. In addition, the results also suggest that the composition and layout of all packaging components be optimized to achieve discouraging or suppressing short-time scale dynamic effects. In summary, results reported herein and numerical procedures developed for the research would not just render higher packaging manufacturing yield, but also bring out significant impact on packaging development, packaging material formulation and micro-circuit layout design.
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Modularized and parametric modeling methodology for concurrent mechanical design of electronic packagingZhou, Wen Xu 05 1900 (has links)
No description available.
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Reliability testing and modeling of linear image sensor devicesGosavi, Mridula. January 2006 (has links)
Thesis (M.S.)--State University of New York at Binghamton, Industrial and Systems Engineering Department, 2006. / Includes bibliographical references.
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Rework of lead-free area array packages assembled on ultra-thin flexible substratesChennagiri, Gurudutt. January 2007 (has links)
Thesis (M.S.)--State University of New York at Binghamton, Industrial and Systems Engineering Dept., 2007. / Includes bibliographical references.
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Evaluation of nondestructive x-ray techniques for electronic packaging materialsDollar, Laura Lucio 08 1900 (has links)
No description available.
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Thermo-mechanical evaluation of interfacial integrity in multilayered microelectronic packagesXie, Weidong 05 1900 (has links)
No description available.
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Prediction and validation of thermomechanical reliability in electronic packagingDing, Hai 08 1900 (has links)
No description available.
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Properties and selection of materials for flip chip packages with low-K die /Tang, Chi Wang. January 2007 (has links)
Thesis (M.Phil.)--Hong Kong University of Science and Technology, 2007. / Includes bibliographical references (leaves 94-97). Also available in electronic version.
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Materials science in pre-plated leadframes for electronic packages /Liu, Lilin. January 2006 (has links)
Thesis (Ph.D.)--Hong Kong University of Science and Technology, 2006. / Includes bibliographical references. Also available in electronic version.
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