Small and efficient energy harvesters, as a renewable power supply, draw lots of attention in last few years. This thesis presents a planar rotary electromagnetic generator with copper coils fabricated by printed circuit board (PCB) as inductance and Nd-Fe-B magnets as magnetic member. Coils are fabricated on PCB, which is presumably cost-effective and promising methods. 28-pole Nd-Fe-B magnets with outer diameter of 50 mm and thickness of 2 mm was sintered and magnetized, which can provide magnetic field of 1.4 Tesla. This harvester consists of planar multilayer with multi-pole coils and multi-pole permanent magnet, and the volume of this harvester is about 50x50x2.5 mm3. Finite element analysis is used to design energy harvesting system, and simulation model of the energy harvester is established. In order to confirm the simulation, experiment data are compared with simulation result. The PCB energy harvester prototype can generate induced voltage 1.11 V and 26.54mW output power at rotary speed of 4,000 rpm, and the efficiency of this energy harvester is 31.5%.

In this dissertation we develop, analyze and implement effective numerical methods for multiscale phenomena arising from flows in heterogeneous porous media. The main purpose is to develop innovative numerical and analytical methods that can capture the effect of small scales on the large scales without resolving the small scale details on a coarse computational grid. This research activity is strongly motivated by many important practical applications arising in contaminant transport in heterogeneous porous media, oil reservoir simulations and subsurface characterization. In the work, we investigate three main multiscale numerical methods, i.e., multiscale finite element method, partition of unity method and mixed multiscale finite element method. These methods employ limited single or multiple global information. We apply these numerical methods to partial differential equations (elliptic, parabolic and wave equations) with continuum scales. To compute the solution of partial differential equations on a coarse grid, we define global fields such that the solution smoothly depends on these fields. The global fields typically contain non-local information required for achieving a convergence independent of small scales. We present a rigorous analysis and show that the proposed global multiscale numerical methods converge independent of small scales. In particular, a global mixed multiscale finite element method is extensively studied and applied to two-phase flows. We present some numerical results for two-phase simulations on coarse grids. The numerical results demonstrate that the global multiscale numerical methods achieve high accuracy.

In this thesis, we develop and test a fundamentally new linear-discontinuous least-squares (LDLS) method for spatial discretization of the one-dimensional (1-D) discrete-ordinates (SN) equations. This new scheme is based upon a least-squares method with a discontinuous trial space. We implement our new method, as well as the lineardiscontinuous Galerkin (LDG) method and the lumped linear-discontinuous Galerkin (LLDG) method. The implementation is in FORTRAN. We run a series of numerical tests to study the robustness, L2 accuracy, and the thick diffusion limit performance of the new LDLS method. By robustness we mean the resistance to negativities and rapid damping of oscillations. Computational results indicate that the LDLS method yields a uniform second-order error. It is more robust than the LDG method and more accurate than the LLDG method. However, it fails to preserve the thick diffusion limit. Consequently, it is viable for neutronics but not for radiative transfer since radiative transfer problems can be highly diffusive.

Analog-to-digital (A/D) conversion is a process that bridges the real analog world to digital signal processing. It takes a continuous-time, continuous amplitude signal as its input and outputs a discrete-time, discrete-amplitude signal. The resolution and sampling rate of an A/D converter vary depending on the application. Recently, there has been a growing demand for broadband (>1 MHz), high-resolution (>14bits) A/D converters. Applications that demand such converters include asymmetric digital subscriber line (ADSL) modems, cellular systems, high accuracy instrumentation, and medical imaging systems. This thesis suggests some design techniques for such high resolution and high sampling rate A/D converters. As the A/D converter performance keeps on increasing it becomes increasingly difficult for the input driver to settle to required accuracy within the sampling time. This is because of the use of larger sampling capacitor (increased resolution) and a decrease in sampling time (higher speed). So there is an increasing trend to have a driver integrated onchip along with A/D converter. The first contribution of this thesis is to present a new precharge scheme which enables integrating the input buffer with A/D converter in standard CMOS process. The buffer also uses a novel multi-path common mode feedback scheme to stabilize the common mode loop at high speeds. Another major problem in achieving very high Signal to Noise and Distortion Ratio (SNDR) is the capacitor mismatch in Digital to Analog Converters (DAC) inherent in the A/D converters. The mismatch between the capacitor causes harmonic distortion, which may not be acceptable. The analysis of Dynamic Element Matching (DEM) technique as applicable to broadband data-converters is presented and a novel second order notch-DEM is introduced. In this thesis we present a method to calibrate the DAC. We also show that a combination of digital error correction and dynamic element matching is optimal in terms of test time or calibration time. Even if we are using dynamic element matching techniques, it is still critical to get the best matching of unit elements possible in a given technology. The matching obtained may be limited either by random variations in the unit capacitor or by gradient effects. In this thesis we present layout techniques for capacitor arrays, and the matching results obtained in measurement from a test-chip are presented. Thus we present various design techniques for high speed and low noise A/D converters in this thesis. The techniques described are quite general and can be applied to most of the types of A/D converters.

This thesis investigates the stress inside Retroreflective Raised Pavement Markers (RRPMs) under tire-marker impact and laboratory testing scenarios. Many RRPMs have poor durability although they meet certain standards of the existing laboratory tests. It has been suspected that the current testing procedures might not be adequate to decide the field performance of RRPMs. Thus, it is necessary to evaluate the existing laboratory testing procedures and develop additional ones that could simulate the field performance of RRPMs more accurately. The tire-marker impact on rigid and flexible pavement will be investigated to identify the critical locations and magnitudes of stress inside markers during the impact. Various external factors, such as tire loading, tire speed, contact angle and contact location, might have effects on the stress inside markers during the impact and be considered as critical factors when developing a laboratory test. On the other hand, RRPMs have different profiles in terms of height, lens slope, and size etc, which affect the structure and field performance as well. The study explores the stress inside markers during the impact by varying the external factors and marker profile. In addition, the interface forces between RRPMs and pavement surface will be studied. Furthermore, the tire-marker impact simulation on rigid and flexible pavement will be compared so that specific testing procedures can be distinguished based on pavement type. Finally, the existing laboratory tests will be examined and additional tests be recommended based on the tire-marker impact analysis. The researcher found that the critical compressive stress is produced at the top edges of the markers on both types of pavement, while the patterns of critical tensile stress can be different between the two types of pavement. In addition, tire loading and contact location were determined to have effect on the stress inside the markers. Furthermore, different loading rates should be used in laboratory test based on pavement type. Finally, the researcher evaluated four laboratory tests and found that each test has its merit but none of them can test RRPMs comprehensively, so it is recommended that the four tests are used together to test RRPMs.

As part of a larger effort to understand the fundamental knowledge of polymer scratch behavior, this dissertation is focused on both experimental study and numerical analysis of scratch deformation of a broad range of polymers, with an emphasis on the mechanical understanding of how the scratch-induced damage is formed. An instrumented progressive load scratch method recommended by ASTM/ISO standards was adopted for the experimental work. The commercial finite element (FE) method package ABAQUS was employed as a numerical simulation tool to describe the stress-strain fields, and it analyzes the deformation mechanisms during the scratch process. A thorough parametric study has been performed to assess the influence of material parameters and surface properties, such as Young's modulus, yield strength, and friction coefficient, on the polymer scratch behavior. Upon investigation of the scratch behaviors of a broad range of polymer materials, various kinds of scratch damage features are identified and correlated with the mechanical characteristics of the polymers. A generalized scratch damage mechanism map for polymers is presented. Correlation between different material types and scratch damage mechanisms is made. It is found that both the material characteristics and the stress state exerted on the scratched surface are responsible for the observed scratch damage mechanisms. The phenomenological deduction of the scratch damage process based on the stick-slip mechanism is established. A more realistic material law for the scratch analysis is also provided. To evaluate the polymer resistance against scratch visibility quantitatively, an entirely new automated on-set scratch visibility determination methodology is developed based on typical visual characteristics of human eyes. Its application on the evaluation of mar and abrasion of polymer is also explored. This new methodology can quantify polymer scratch resistance consistently and reliably regardless of the sample surface characteristics and color.

Interconnect modeling plays an important role in design and verification of VLSI circuits and packages. For low frequency circuits, great advances for parasitic resistance and capacitance extraction have been achieved and wide varieties of techniques are available. However, for high frequency circuits and packages, parasitic inductance and impedance extraction still poses a tremendous challenge. Existing algorithms, such as FastImp and FastHenry developed by MIT, are slow and inherently unable to handle multiple dielectrics and magnetic materials. In this research, we solve three problems in interconnect modeling for high frequency circuits and packages. 1) Multiple dielectrics are common in integrated circuits and packages. We propose the first Boundary Element Method (BEM) algorithm for impedance extraction of interconnects with multiple dielectrics. The algorithm uses a novel equivalentcharge formulation to model the extraction problem with significantly fewer unknowns. Then fast matrix-vector multiplication and effective preconditioning techniques are applied to speed up the solution of linear systems. Experimental results show that the algorithm is significantly faster than existing methods with sufficient accuracy. 2) Magnetic materials are widely used in MEMS, RFID and MRAM. We present the first BEM algorithm to extract interconnect inductance with magnetic materials. The algorithm models magnetic characteristics by the Landau Lifshitz Gilbert equation and fictitious magnetic charges. The algorithm is accelerated by approximating magnetic charge effects and by modeling currents with solenoidal basis. The relative error of the algorithm with respect to the commercial tool is below 3%, while the speed is up to one magnitude faster. 3) Since traditional interconnect model includes mutual inductances between pairs of segments, the resulting circuit matrix is very dense. This has been the main bottleneck in the use of the interconnect model. Recently, K = L-1 is used. The RKC model is sparse and stable. We study the practical issues of the RKC model. We validate the RKC model and propose an efficient way to achieve high accuracy extraction by circuit simulations of practical examples.

Electric field guided assembly of colloids is a new area of research in colloidal science where sub-micrometer particles, or colloids, are assembled using patterned electrodes. The design of these devices is often limited by an inability to characterize accurately forces and fluxes with linearized electrokinetic theory. The research presented in this dissertation describes an application of the finite element method to the nonlinear electrokinetic equations. The finite element model thus developed is then used to describe the nonlinear electrophoretic mobility of a dilute colloidal dispersion, investigate hydrodynamic and electric particle-particle interactions, and characterize particle-surface interactions. The effect of Stern layer conduction on the electrophoretic mobility and dielectric response is included using the generalized dynamic Stern layer model. The electrokinetic force is calculated using the Maxwell stress tensor method rather than the effective dipole method as it is more consistent with nonlinear electrokinetic theory. Significant results of this dissertation demonstrate the effect of nonlinear electrokinetic phenomena and extend the present electrokinetic theory. The calculation of nonlinear electrophoretic mobility of a dilute colloidal dispersion, which is valid for arbitrary particle surface charge or zeta potential, applied (AC) electric field strength, and applied AC electric field frequency. Also, the adsorption isotherm used by the generalized dynamic Stern layer theory is extended to include non-equilibrium reaction kinetics. This results in a model for Stern layer conduction which is valid for frequencies above 1 MHz. The utilization of the Maxwell stress tensor method results in a finite element model which is valid for arbitrary electric field strength and includes the effects of traveling-wave dielectrophoresis a nonlinear electrokinetic phenomena resulting from non-uniform electric field phase.

The ballistic impact of Twaron CT709® plain weave fabrics is studied using an explicit finite element method. Many existing approximations pertaining to woven fabrics cannot adequately represent strain rate-dependent behavior exhibited by the Twaron fabrics. One-dimensional models based on linear viscoelasticity can account for rate dependency but are limited by the simplifying assumptions on the fabric architecture and stress state. In the current study, a three-dimensional fabric model is developed by treating each individual yarn as a continuum. The yarn behavior is phenomenologically described using a three-dimensional linear viscoelastic constitutive relation. A user subroutine VUMAT for ABAQUS/Explicit® is developed to incorporate the constitutive behavior. By using the newly developed viscoelasticity model, a parametric study is carried out to analyze the effects of various parameters on the impact behavior of the Twaron fabrics, which include projectile shape and mass, gripping conditions, inter-yarn friction, and the number of fabric layers. The study leads to the determination of the optimal number of fabric layers and the optimized level of inter-yarn friction that are needed to achieve the maximum energy absorption at specified impact speeds. The present study successfully utilizes the combination of 3D weave architecture and the strain rate dependent material behavior. Majority of the existing work is based either on geometry simplification or assumption of elastic material behavior. Another significant advantage with the present approach is that the mechanical constitutive relation, coded in FORTRAN®, is universal in application. The desired material behavior can be obtained by just varying the material constants in the code. This allows for the extension of this work to any fabric material which exhibits a strain-rate dependent behavior in addition to Twaron®. The results pertaining to optimal number of fabric layers and inter-yarn friction levels can aid in the manufacturing of fabric with regard to the desired level of lubrication/additives to improve the fabric performance under impact.

Aluminum bond pads on semiconductor chips play an important role in IC device reliability and yield. In the paper, the vertical tension loading transferred from the capillary is clarified as the direct driving force for bond pad metal peeling. The crack on the bonding pad is identified as the root cause of the pad peeling. It is simulated by finite element method to find the effect of driving force resulting in the crack during the ultrasonic wire bonding process. It indicated that the horizontal vibration of the capillary controlled by ultrasonic power of the bonding machine was the main factors led to the crack on the bonding pad as well as its propagation into the oxide layers in chip. The degradation of Au wire/Al bond pad has become a major bonding failure problem. It is because that the molding resin with low thermal stability (e.g. bi-phenyl epoxy resin) and the IC devices under high thermal environments were used in packaging process. For the lifetime to bond failure, the bi-phenyl epoxy molding becomes shorter than that for cresol novolac epoxy due to the corrosion reaction of Au-Al intermetallics with bromine (Br) contained in the resin compounds. It was clarified that the reactive intermetallic was Au4Al phase formed in the bond interface. In addition, by utilizing the SEM, AES, EDS and XPS techniques, it could be carried out to reveal and identify defects underneath Al layer, and the contaminated Al bond pads could cause poor intermetallic growths led to the failed or unreliable connections from the chip to the outside world.