<p>An investigation was initiated, targeting snapshot 3D image sensors, with the objective to match the speed and resolution of a scanning sheet-of-light system, without using a scanning motion. The goal was a system capable of acquiring 25 snapshot images per second from a quadratic scene with a side from 50 mm to 1000 mm, sampled in 512×512 height measurement points, and with a depth resolution of 1 µm and beyond. </p><p>A wide search of information about existing 3D measurement techniques resulted in a list of possible schemes, each presented with its advantages and disadvantages. No single scheme proved successful in meeting all the requirements. Pulse modulated time-of-flight is the only scheme capable of depth imaging by using only one exposure. However, a resolution of 1 µm corresponds to a pulse edge detection accuracy of 6.67 fs when visible light or other electromagnetic waves are used. Sequentially coded light projections require a logarithmic number of exposures. By projecting several patterns at the same time, using for instance light of different colours, the required number of exposures is reduced even further. The patterns are, however, not as well focused as a laser sheet-of-light can be. </p><p>Using powerful architectural concepts such as matrix array picture processing (MAPP) and near-sensor image processing (NSIP) a sensor proposal was presented, designed to give as much support as possible to a large number of 3D imaging schemes. It allows for delayed decisions about details in the future implementation. </p><p>It is necessary to relax at leastone of the demands for this project in order to realise a working 3D imaging scheme using concurrent technology. One of the candidates for relaxation is the most obvious demand of snapshot behaviour. Furthermore, there are a number of decisions to make before designing an actual system using the recommendations presented in this thesis. The ongoing development of electronics, optics, and imaging schemes might be able to meet the 3D snapshot demands in a near future. The details of light sensing electronics must be carefully evaluated and the optical components such as lenses, projectors, and fibres should be studied in detail.</p>

An investigation was initiated, targeting snapshot 3D image sensors, with the objective to match the speed and resolution of a scanning sheet-of-light system, without using a scanning motion. The goal was a system capable of acquiring 25 snapshot images per second from a quadratic scene with a side from 50 mm to 1000 mm, sampled in 512×512 height measurement points, and with a depth resolution of 1 µm and beyond. A wide search of information about existing 3D measurement techniques resulted in a list of possible schemes, each presented with its advantages and disadvantages. No single scheme proved successful in meeting all the requirements. Pulse modulated time-of-flight is the only scheme capable of depth imaging by using only one exposure. However, a resolution of 1 µm corresponds to a pulse edge detection accuracy of 6.67 fs when visible light or other electromagnetic waves are used. Sequentially coded light projections require a logarithmic number of exposures. By projecting several patterns at the same time, using for instance light of different colours, the required number of exposures is reduced even further. The patterns are, however, not as well focused as a laser sheet-of-light can be. Using powerful architectural concepts such as matrix array picture processing (MAPP) and near-sensor image processing (NSIP) a sensor proposal was presented, designed to give as much support as possible to a large number of 3D imaging schemes. It allows for delayed decisions about details in the future implementation. It is necessary to relax at leastone of the demands for this project in order to realise a working 3D imaging scheme using concurrent technology. One of the candidates for relaxation is the most obvious demand of snapshot behaviour. Furthermore, there are a number of decisions to make before designing an actual system using the recommendations presented in this thesis. The ongoing development of electronics, optics, and imaging schemes might be able to meet the 3D snapshot demands in a near future. The details of light sensing electronics must be carefully evaluated and the optical components such as lenses, projectors, and fibres should be studied in detail.

This thesis presents a study on solutions to high-speed analog-to-digital conversion in CMOS image sensors using time-interpolation methods. Data conversion is one of the few remaining speed bottlenecks in conventional 2D imagers. At the same time, as pixel dark current continues to improve, the resolution requirements on imaging data converters impose very high system-level design challenges. The focus of the presented investigations here is to shed light on methods in Time-to-Digital Converter interpolation of single-slope ADCs. By using high-factor time-interpolation, the resolution of single-slope converters can be increased without sacrificing conversion time or power. This work emphasizes on solutions for improvement of multiphase clock interpolation schemes, following an all-digital design paradigm. Presented is a digital calibration scheme which allows a complete elimination of analog clock generation blocks, such as PLL or DLL in Flash TDC-interpolated single-slope converters. To match the multiphase clocks in time-interpolated single-slope ADCs, the latter are generated by a conventional open-loop delay line. In order to correct the process voltage and temperature drift of the delay line, a digital backend calibration has been developed. It is also executed online, in-column, and at the end of each sample conversion. The introduced concept has been tested in silicon, and has showed promising results for its introduction in practical mass-production scenarios. Methods for reference voltage generation in single-slope ADCs have also been looked at. The origins of error and noise phenomenona, which occur during both the discrete and continuous-time conversion phases in a single-slope ADC have been mathematically formalized. A method for practical measurement of noise on the ramp reference voltage has also been presented. Multiphase clock interpolation schemes are difficult for implementation when high interpolation factors are used, due to their quadratic clock phase growth with resolution. To allow high interpolation factors a time-domain binary search concept with error calibration has been introduced. Although the study being conceptual, it shows promising results for highly efficient implementations, if a solution to stable column-level unit delays can be found. The latter is listed as a matter of future investigations.

Ce mémoire de thèse traite des effets singuliers produits par les milieux radiatifs sur les capteurs d’images CMOS. Le travail se concentre sur les effets provoqués par les ions lourds sur les capteurs utilisant des pixels 3T à photodiode standard et des pixels 4T et 5T à photodiodes pincées. Dans un premier temps, l’étude se concentre sur l’environnement spatial et l’architecture des capteurs. La comparaison avec la littérature met en évidence les effets les plus critiques sur les capteurs : le SEL et les SET. Les capteurs testés expérimentalement valident les travaux théoriques. Les SET sont comparés aux simulations de l’outil de modélisation STARDUST, et montrent un bon accord pour toutes les puces et les ions. Il est expliqué pourquoi les SET sur les puces 3T sont insensibles aux variations de conception de la photodiode, et pourquoi l’utilisation d’un substrat épitaxié diminue grandement les SET. Une méthode de réduction des SET est implémentée avec succès sur les puces 4T et 5T, et le composant responsable du latchup est identifié. L’ensemble des mécanismes explorés permet de connaitre les paramètres importants pour durcir les imageurs. / This thesis studies the single event effects of space environment in CMOS image sensors (CIS). This work focuses on the effects of heavy ions on 3T standard photodiode pixels, and 4T and 5T pinned photodiode pixels. The first part describes the space radioactive environment and the sensor architecture. The most harmful events (SEL and SETs) are identified thanks to the scientific literature. The experimentally tested sensors agree with the theoretical work. SETs are compared to STARDUST simulations with a good agreement for all ions and sensors. The work explains why the SETs on 3T pixels are insensitive to the various photodiode designs, and they are decreased when an epitaxial substrate is used. A method using anti-blooming was successfully used in 4T and 5T pixels to prevent the spread of the SETs. The mechanism of latchup in 4T pixel sensors is described. All the identified mechanisms are very useful to provide hardening methods for the CISs.

Ce travail a montré que l’apport de la technologie d’intégration 3D, permet de surmonter les limites imposées par la technologie monolithique sur les performances électriques (« coupling » et consommation) et sur l’implémentation physique (aire du pixel) des imageurs. Grâce à l’analyse approfondie sur la technologie d’intégration 3D, nous avons pu voir que les technologies d’intégration 3D les plus adaptées pour l’intégration des circuits dans le pixel sont : 3D wafer level et 3D construction séquentielle. La technologie choisie pour cette étude, est la technologie d'intégration 3D wafer level. Cela nous a permis de connecter 2 wafers par thermocompression et d’avoir une interconnexion par pixel entre wafers. L’étude de l’architecture CAN dans le pixel a montré qu’il existe deux limites dans le pixel : l’espace de construction et le couplage entre la partie analogique et numérique « digital coupling ». Son implémentation dans la technologie 3D autorise l’augmentation de 100% l’aire de construction et la réduction du « digital coupling » de 70%. Il a été implémenté un outil de calcul des éléments parasites des structures 3D. L’étude des imageurs rapides, a permis d’étendre l’utilisation de cette technologie. L’imageur rapide type « burst » a été étudié principalement. Cet imageur permet de dissocier la partie d’acquisition des images de la sortie. La limite principale, dans la technologie monolithique, est la taille des colonnes (pixels vers mémoires). Pour une haute cadence d’acquisition des images, il faut une grande consommation de courant. Son implémentation dans la technologie 3D a autorisé à mettre les mémoires au-dessous des pixels. Les études effectuées pour ce changement (réduction de la colonne à une interconnexion entre wafers), ont réduit la consommation totale de 90% et augmenté le temps d’acquisition des images de 184%, en comparaison à son pair monolithique. / This work has shown that the contribution of 3D integration technology allows to overcome the limitations imposed by monolithic technology on the electrical performances (coupling and consumption) and on the physical implementation (area of the pixel) of imagers. An in-depth analysis of the 3D integration technology has shown that the most suitable 3D integration technologies for the integration of the circuits at the pixel level are: 3D wafer level and 3D sequential construction. The technology chosen for this study is the 3D wafer level integration technology. This allows us to connect 2 wafers by thermocompression bonding and to have an interconnection or “bonding point” par pixel between wafers. The study of the architecture CAN at the pixel level showed that there are two limits in the pixel: the construction area and the coupling between the analog and digital part «digital coupling». Its implementation in 3D technology allows the construction area to be increased by 100% and the digital coupling reduced by 70%. It has been implemented a tool for computing the parasitic elements of 3D structures. The study of high speed imagers has allowed the use of this technology to be extended. The "burst" imager was mainly studied. This kind of imager’s architecture can dissociate the image acquisition from the output part. The main limit, in monolithic technology, is the size of the columns (pixels to memories). For a high rate of image acquisition, a high current consumption is required. Its implementation in 3D technology allowed to put the memories below the pixels. The studies carried out for this change (reduction of the column to an interconnection between wafers) reduced the total consumption by 90% and increased the acquisition time of the images by 184%, compared to its monolithic peer.

Les capteurs d'images sont utilisés dans diverses applications spatiales : observation spatiale, calcul d'attitude etc. Ces capteurs évoluent dans l’environnement spatial dont les rayonnements entraînent une dégradation de leurs performances. Parmi les paramètres impactés, nous nous intéressons au courant d'obscurité des pixels. Ce courant parasite correspond à la génération de porteurs de charges sans lumière par simple excitation thermique, induisant l'augmentation du bruit de fond des images. Les pixels fortement dégradés sont particulièrement pénalisants pour les missions spatiales. Cet effet pousse donc la communauté spatiale à développer des méthodes de prédiction performantes. L'ONERA a développé une méthode originale de prédiction des courants d'obscurité basée sur la méthode de Monte Carlo et la librairie GEANT4. L’objectif de la thèse est d’améliorer la prédiction de l’outil. Dans un premier temps, nous avons modifié l'outil numérique pour des cas extrêmes de modélisations pour lesquels les modélisations Monte Carlo sont trop longues. Pour cela, nous avons développé des méthodes utilisant des simplifications statistiques. Dans un second temps, nous avons étudié l’influence de la géométrie du pixel sur le courant d'obscurité. L’idée est de suivre les cascades de dégradations générées par les particules spatiales et de déterminer si ces cascades restent confinées au sein du pixel impacté ou si elles se propagent dans les pixels voisins. Enfin, nous avons élaboré dans notre outil un modèle simulant les mécanismes liés au champ électrique potentiellement responsables des dégradations les plus élevées, les effets Poole-Frenkel et tunnel assisté par phonons. / Image sensors are used in various space applications: space and earth observations, attitude calculation etc. Those sensors are very sensitive to the space environment whose radiations lead to a degradation of their performances. Among the different impacted parameters, we are interested in the increase of dark current in the pixels. This parasitic current is caused by the thermal generation of charge carriers without any light excitation inducing the increase of the background noise on the images. Some pixels exhibiting the highest degradation are particularly disadvantageous for space missions. They can be critical for some missions and impose to the space community to develop effective prediction methods. ONERA developed an original method to predict dark current induce by the space radiations, based on a Monte Carlo method and the GEANT4 library. The objective of the PhD is to improve the performances of the tool. The approach of this work is first to modify the numerical tool for extreme cases of modelling (i.e. high fluencies or huge pixel volume) for which the Monte Carlo simulations are too long. In order to reduce this computation time, we developed calculation methods using statistical simplifications. In a second part, we studied the influence of the pixel geometry on the dark current. The idea is to follow the degradation cascades created by space particles and to determine if those cascades are contained in the impacted pixel or if they reach neighbor pixels. Finally, we modelled in our tool the physical mechanisms potentially responsible of the highest degradations linked to the electric field, the Poole-Frenkel effect and the phonon assisted tunneling.

Résumé confidentiel / Résumé confidentiel

Vision has always been one of the most important cognitive tools of human beings. In this regard, the development of image sensors opens up the potential to view objects that our eyes cannot see. One of the most promising capability in some image sensors is their single-photon sensitivity that provides information at the ultimate fundamental limit of light. Time-resolved single-photon avalanche diode (SPAD) image sensors bring a new dimension as they measure the arrival time of incident photons with a precision in the order of hundred picoseconds. In addition to this characteristic, they can be fabricated in complementary metal-oxide-semiconductor (CMOS) technology enabling the integration of complex signal processing blocks at the pixel level. These unique features made CMOS SPAD sensors a prime candidate for a broad spectrum of applications. This thesis is dedicated to the optimization and characterization of quantum imagers based on the SPADs as part of the E.U. funded SUPERTWIN project to surpass the fundamental diffraction limit known as the Rayleigh limit by exploiting the spatio-temporal correlation of entangled photons. The first characterized sensor is a 32×32-pixel SPAD array, named “SuperEllen”, with in-pixel time-to-digital converters (TDC) that measure the spatial cross-correlation functions of a flux of entangled photons. Each pixel features 19.48% fill-factor (FF) in 44.64-μm pitch fabricated in a 150-nm CMOS standard technology. The sensor is fully characterized in several electro-optical experiments, in order to be used in quantum imaging measurements. Moreover, the chip is calibrated in terms of coincidence detection achieving the minimal coincidence window determined by the SPAD jitter. The second developed sensor in the context of SUPERTWIN project is a 224×272-pixel SPAD-based array called “SuperAlice”, a multi-functional image sensor fabricated in a 110-nm CMOS image sensor technology. SuperAlice can operate in multiple modes (time-resolving or photon counting or binary imaging mode). Thanks to the digital intrinsic nature of SPAD imagers, they have an inherent capability to achieve a high frame rate. However, running at high frame rate means high I/O power consumption and thus inefficient handling of the generated data, as SPAD arrays are employed for low light applications in which data are very sparse over time and space. Here, we present three zero-suppression mechanisms to increase the frame rate without adversely affecting power consumption. A row-skipping mechanism that is implemented in both SuperEllen and SuperAlice detects the absence of SPAD activity in a row to increase the duty cycle. A current-based mechanism implemented in SuperEllen ignores reading out a full frame when the number of triggered pixels is less than a user-defined value. A different zero-suppression technique is developed in the SuperAlice chip that is based on jumping through the non-zero pixels within one row. The acquisition of TDC-based SPAD imagers can be speeded up further by storing and processing events inside the chip without the need to read out all data. An on-chip histogramming architecture based on analog counters is developed in a 150-nm CMOS standard technology. The test structure is a 16-bin histogram with 9 bit depth for each bin. SPAD technology demonstrates its capability in other applications such as automotive that demands high dynamic range (HDR) imaging. We proposed two methods based on processing photon arrival times to create HDR images. The proposed methods are validated experimentally with SuperEllen obtaining &gt;130 dB dynamic range within 30 ms of integration time and can be further extended by using a timestamping mechanism with a higher resolution.

Biologically inspired logarithmic CMOS sensors offer high dynamic range imaging capabilities without the difficulties faced by linear imagers. By compressing dynamic range while encoding contrast information, they mimic the human visual system’s response to photo stimuli in fewer bits than those used in linear sensors. Despite this prospect, logarithmic sensors suffer poor image quality due to illumination dependent fixed pattern noise (FPN), making individual pixels appear up to 100 times brighter or darker. This thesis is primarily concerned with alleviating FPN in logarithmic imagers in a simple and convenient way while undertaking a system approach to its origin, distribution and effect on the quality of monochrome and colour images, after FPN correction. Using the properties of the Human visual system, I propose to characterise the errors arising from FPN in a perceptually significant manner by proposing an error measure, never used before. Logarithmic operation over a wide dynamic range is first characterised using a new model; yi j =aj +bj ln(exp sqrt(cj +djxi)−1), where yi j is the response of the sensor to a light stimulus xi and aj, bj, cj and dj are pixel dependent parameters. Using a proposed correction procedure, pixel data from a monochromatic sensor array is FPN corrected to approximately 4% error over 5 decades of illumination even after digitisation - accuracy equivalent to four times the human eyes ability to just notice an illumination difference against a uniform background. By evaluating how error affects colour, the possibility of indiscernible residual colour error after FPN correction, is analytically explored using a standard set of munsell colours. After simulating the simple FPN correction procedure, colour quality is analysed using a Delta E76 perceptual metric, to check for perceptual discrepancies in image colour. It is shown that, after quantisation, the FPN correction process yields 1−2 Delta E76 error units over approximately 5 decades of illumination; colour quality being imperceptibly uniform in this range. Finally, tone-mapping techniques, required to compress high dynamic range images onto the low range of standard screens, have a predominantly logarithmic operation during brightness compression. A new Logr'Gb' colour representation is presented in this thesis, significantly reducing computational complexity, while encoding contrast information. Using a well-known tone mapping technique, images represented in this new format are shown to maintain colour accuracy when the green colour channel is compressed to the standard display range, instead of the traditional luminance channel. The trade off between colour accuracy and computation in this tone mapping approach is also demonstrated, offering a low cost alternative for applications with low display specifications.

This thesis concerns the development and characterisation of X-ray imaging systems based on single photon processing. “Colour” X-ray imaging opens up new perspectives within the fields of medical X-ray diagnosis and also in industrial X-ray quality control. The difference in absorption for different “colours” can be used to discern materials in the object. For instance, this information might be used to identify diseases such as brittle-bone disease. The “colour” of the X-rays can be identified if the detector system can process each X-ray photon individually. Such a detector system is called a “single photon processing” system or, less precise, a “photon counting system”. With modern technology it is possible to construct photon counting detector systems that can resolve details to a level of approximately 50 µm. However with such small pixels a problem will occur. In a semiconductor detector each absorbed X-ray photon creates a cloud of charge which contributes to the image. For high photon energies the size of the charge cloud is comparable to 50 µm and might be distributed between several pixels in the image. Charge sharing is a key problem since, not only is the resolution degenerated, but it also destroys the “colour” information in the image. This thesis presents characterisation and simulations to provide a detailed understanding of the physical processes concerning charge sharing in detectors from the MEDIPIX collaboration. Charge summing schemes utilising pixel to pixel communications are proposed. Charge sharing can also be suppressed by introducing 3D-detector structures. In the next generation of the MEDIPIX system, Medipix3, charge summing will be implemented. This system, equipped with a 3D-silicon detector, or a thin planar high-Z detector of good quality, has the potential to become a commercial product for medical imaging. This would be beneficial to the public health within the entire European Union. / Denna avhandling berör utveckling och karaktärisering av fotonräknande röntgensystem. ”Färgröntgen” öppnar nya perspektiv för medicinsk röntgendiagnostik och även för materialröntgen inom industrin. Skillnaden i absorption av olika ”färger” kan användas för att särskilja olika material i ett objekt. Färginformationen kan till exempel användas i sjukvården för att identifiera benskörhet. Färgen på röntgenfotonen kan identifieras om detektorsystemet kan detektera varje foton individuellt. Sådana detektorsystem kallas ”fotonräknande” system. Med modern teknik är det möjligt att konstruera fotonräknande detektorsystem som kan urskilja detaljer ner till en upplösning på circa 50 µm. Med så små pixlar kommer ett problem att uppstå. I en halvledardetektor ger varje absorberad foton upphov till ett laddningsmoln som bidrar till den erhållna bilden. För höga fotonenergier är storleken på laddningsmolnet jämförbar med 50 µm och molnet kan därför fördelas över flera pixlar i bilden. Laddningsdelning är ett centralt problem delvis på grund av att bildens upplösning försämras, men framför allt för att färginformationen i bilden förstörs. Denna avhandling presenterar karaktärisering och simulering för att ge en mer detaljerad förståelse för fysikaliska processer som bidrar till laddningsdelning i detektorer från MEDIPIX-projekter. Designstrategier för summering av laddning genom kommunikation från pixel till pixel föreslås. Laddningsdelning kan också begränsas genom att introducera detektorkonstruktioner i 3D-struktur. I nästa generation av MEDIPIX-systemet, Medipix3, kommer summering av laddning att vara implementerat. Detta system, utrustat med en 3D-detektor i kisel, eller en tunn plan detektor av högabsorberande material med god kvalitet, har potentialen att kunna kommersialiseras för medicinska röntgensystem. Detta skulle bidra till bättre folkhälsa inom hela Europeiska Unionen.