The interaction of radiation with integrated circuits can provoke transient faults due to the deposit of charge in sensitive nodes of transistors. Because of the decrease the size in the process technology, charge sharing between transistors placed close to each other has been more and more observed. This phenomenon can lead to multiple transient faults. Therefore, it is important to analyze the effect of multiple transient faults in integrated circuits and investigate mitigation techniques able to cope with multiple faults. This work investigates the effect known as single-event-induced charge sharing in integrated circuits. Two main techniques are analyzed to cope with this effect. First, a placement constraint methodology is proposed. This technique uses placement constraints in standard cell based circuits. The objective is to achieve a layout for which the Soft-Error Rate (SER) due charge shared at adjacent cell is reduced. A set of fault injection was performed and the results show that the SER can be minimized due to single-event-induced charge sharing in according to the layout structure. Results show that by using placement constraint, it is possible to reduce the error rate from 12.85% to 10.63% due double faults. Second, Triple Modular Redundancy (TMR) schemes with different levels of granularities limited by majority voters are analyzed under multiple faults. The TMR versions are implemented using a standard design flow based on a traditional commercial standard cell library. An extensive fault injection campaign is then performed in order to verify the softerror rate due to single-event-induced charge sharing in multiple nodes. Results show that the proposed methodology becomes crucial to find the best trade-off in area, performance and soft-error rate when TMR designs are considered under multiple upsets. Results have been evaluated in a case-study circuit Advanced Encryption Standard (AES), synthesized to 90nm Application Specific Integrated Circuit (ASIC) library, and they show that combining the two techniques, the error rate resulted from multiple faults can be minimized or masked. By using TMR with different granularities and placement constraint methodology, it is possible to reduce the error rate from 11.06% to 0.00% for double faults. A detailed study of triple, four and five multiple faults combining both techniques are also described. We also tested the TMR with different granularities in SRAM-based FPGA platform. Results show that the versions with a fine grain scheme (FGTMR) were more effectiveness in masking multiple faults, similarly to results observed in the ASICs. In summary, the main contribution of this master thesis is the investigation of charge sharing effects in ASICs and the use of a combination of techniques based on TMR redundancy and placement to improve the tolerance under multiple faults.

Microelectronic devices and systems have been extensively utilized in a variety of radiation environments, ranging from the low-earth orbit to the ground level. A high-energy particle from such an environment may cause voltage/current transients, thereby inducing Single Event Effect (SEE) errors in an Integrated Circuit (IC). Ever since the first SEE error was reported in 1975, this community has made tremendous progress in investigating the mechanisms of SEE and exploring radiation tolerant techniques. However, as the IC technology advances, the existing hardening techniques have been rendered less effective because of the reduced spacing and charge sharing between devices. The Semiconductor Industry Association (SIA) roadmap has identified radiation-induced soft errors as the major threat to the reliable operation of electronic systems in the future. In digital systems, hardening techniques of their core components, such as latches, logic, and clock network, need to be addressed. Two single event tolerant latch designs taking advantage of feedback transistors are presented and evaluated in both single event resilience and overhead. These feedback transistors are turned OFF in the hold mode, thereby yielding a very large resistance. This, in turn, results in a larger feedback delay and higher single event tolerance. On the other hand, these extra transistors are turned ON when the cell is in the write mode. As a result, no significant write delay is introduced. Both designs demonstrate higher upset threshold and lower cross-section when compared to the reference cells. Dynamic logic circuits have intrinsic single event issues in each stage of the operations. The worst case occurs when the output is evaluated logic high, where the pull-up networks are turned OFF. In this case, the circuit fails to recover the output by pulling the output up to the supply rail. A capacitor added to the feedback path increases the node capacitance of the output and the feedback delay, thereby increasing the single event critical charge. Another differential structure that has two differential inputs and outputs eliminates single event upset issues at the expense of an increased number of transistors. Clock networks in advanced technology nodes may cause significant errors in an IC as the devices are more sensitive to single event strikes. Clock mesh is a widely used clocking scheme in a digital system. It was fabricated in a 28nm technology and evaluated through the use of heavy ions and laser irradiation experiments. Superior resistance to radiation strikes was demonstrated during these tests. In addition to mitigating single event issues by using hardened designs, built-in current sensors can be used to detect single event induced currents in the n-well and, if implemented, subsequently execute fault correction actions. These sensors were simulated and fabricated in a 28nm CMOS process. Simulation, as well as, experimental results, substantiates the validity of this sensor design. This manifests itself as an alternative to existing hardening techniques. In conclusion, this work investigates single event effects in digital systems, especially those in deep-submicron or advanced technology nodes. New hardened latch, dynamic logic, clock, and current sensor designs have been presented and evaluated. Through the use of these designs, the single event tolerance of a digital system can be achieved at the expense of varying overhead in terms of area, power, and delay.

The interaction of radiation with integrated circuits can provoke transient faults due to the deposit of charge in sensitive nodes of transistors. Because of the decrease the size in the process technology, charge sharing between transistors placed close to each other has been more and more observed. This phenomenon can lead to multiple transient faults. Therefore, it is important to analyze the effect of multiple transient faults in integrated circuits and investigate mitigation techniques able to cope with multiple faults. This work investigates the effect known as single-event-induced charge sharing in integrated circuits. Two main techniques are analyzed to cope with this effect. First, a placement constraint methodology is proposed. This technique uses placement constraints in standard cell based circuits. The objective is to achieve a layout for which the Soft-Error Rate (SER) due charge shared at adjacent cell is reduced. A set of fault injection was performed and the results show that the SER can be minimized due to single-event-induced charge sharing in according to the layout structure. Results show that by using placement constraint, it is possible to reduce the error rate from 12.85% to 10.63% due double faults. Second, Triple Modular Redundancy (TMR) schemes with different levels of granularities limited by majority voters are analyzed under multiple faults. The TMR versions are implemented using a standard design flow based on a traditional commercial standard cell library. An extensive fault injection campaign is then performed in order to verify the softerror rate due to single-event-induced charge sharing in multiple nodes. Results show that the proposed methodology becomes crucial to find the best trade-off in area, performance and soft-error rate when TMR designs are considered under multiple upsets. Results have been evaluated in a case-study circuit Advanced Encryption Standard (AES), synthesized to 90nm Application Specific Integrated Circuit (ASIC) library, and they show that combining the two techniques, the error rate resulted from multiple faults can be minimized or masked. By using TMR with different granularities and placement constraint methodology, it is possible to reduce the error rate from 11.06% to 0.00% for double faults. A detailed study of triple, four and five multiple faults combining both techniques are also described. We also tested the TMR with different granularities in SRAM-based FPGA platform. Results show that the versions with a fine grain scheme (FGTMR) were more effectiveness in masking multiple faults, similarly to results observed in the ASICs. In summary, the main contribution of this master thesis is the investigation of charge sharing effects in ASICs and the use of a combination of techniques based on TMR redundancy and placement to improve the tolerance under multiple faults.

The interaction of radiation with integrated circuits can provoke transient faults due to the deposit of charge in sensitive nodes of transistors. Because of the decrease the size in the process technology, charge sharing between transistors placed close to each other has been more and more observed. This phenomenon can lead to multiple transient faults. Therefore, it is important to analyze the effect of multiple transient faults in integrated circuits and investigate mitigation techniques able to cope with multiple faults. This work investigates the effect known as single-event-induced charge sharing in integrated circuits. Two main techniques are analyzed to cope with this effect. First, a placement constraint methodology is proposed. This technique uses placement constraints in standard cell based circuits. The objective is to achieve a layout for which the Soft-Error Rate (SER) due charge shared at adjacent cell is reduced. A set of fault injection was performed and the results show that the SER can be minimized due to single-event-induced charge sharing in according to the layout structure. Results show that by using placement constraint, it is possible to reduce the error rate from 12.85% to 10.63% due double faults. Second, Triple Modular Redundancy (TMR) schemes with different levels of granularities limited by majority voters are analyzed under multiple faults. The TMR versions are implemented using a standard design flow based on a traditional commercial standard cell library. An extensive fault injection campaign is then performed in order to verify the softerror rate due to single-event-induced charge sharing in multiple nodes. Results show that the proposed methodology becomes crucial to find the best trade-off in area, performance and soft-error rate when TMR designs are considered under multiple upsets. Results have been evaluated in a case-study circuit Advanced Encryption Standard (AES), synthesized to 90nm Application Specific Integrated Circuit (ASIC) library, and they show that combining the two techniques, the error rate resulted from multiple faults can be minimized or masked. By using TMR with different granularities and placement constraint methodology, it is possible to reduce the error rate from 11.06% to 0.00% for double faults. A detailed study of triple, four and five multiple faults combining both techniques are also described. We also tested the TMR with different granularities in SRAM-based FPGA platform. Results show that the versions with a fine grain scheme (FGTMR) were more effectiveness in masking multiple faults, similarly to results observed in the ASICs. In summary, the main contribution of this master thesis is the investigation of charge sharing effects in ASICs and the use of a combination of techniques based on TMR redundancy and placement to improve the tolerance under multiple faults.

Spectral computed tomography with energy-resolving detectors has a potential to improve the detectability of images and correspondingly reduce the radiation dose to patients by extracting and properly using the energy information in the broad x-ray spectrum. A silicon photon-counting detector has been developed for spectral CT and it has successfully solved the problem of high photon flux in clinical CT applications by adopting the segmented detector structure and operating the detector in edge-on geometry. The detector was evaluated by both the simulation and measurements. The effects of energy loss and charge sharing on the energy response of this segmented silicon strip detector with different pixel sizes were investigated by Monte Carlo simulation and a comparison to pixelated CdTe detectors is presented. The validity of spherical approximations of initial charge cloud shape in silicon detectors was evaluated and a more accurate statistical model has been proposed. A photon-counting energy-resolving application specific integrated circuit (ASIC) developed for spectral CT was characterized extensively by electrical pulses, pulsed laser and real x-ray photons from both the synchrotron and an x-ray tube. It has been demonstrated that the ASIC performs as designed. A noise level of 1.09 keV RMS has been measured and a threshold dispersion of 0.89 keV RMS has been determined. The count rate performance of the ASIC in terms of count loss and energy resolution was evaluated by real x-rays and promising results have been obtained. The segmented silicon strip detector was evaluated using synchrotron radiation. An energy resolution of 16.1% has been determined with 22 keV photons in the lowest flux limit, which deteriorates to 21.5% at an input count rate of 100 Mcps mm−2. The fraction of charge shared events has been estimated and found to be 11.1% for 22 keV and 15.3% for 30 keV. A lower fraction of charge shared events and an improved energy resolution can be expected by applying a higher bias voltage to the detector. / <p>QC 20121123</p>

<p>This licentiate thesis concerns the development and characterisation of X-ray imaging detector systems. “Colour” X-ray imaging opens up new perspectives within the fields of medical X-ray diagnosis and also in industrial X-ray quality control. The difference in absorption for different “colours” can be used to discern materials in the object. For instance, this information might be used to identify diseases such as brittle-bone disease. The “colour” of the X-rays can be identified if the detector system can process each X-ray photon individually. Such a detector system is called a “single photon processing” system or, less precise, a “photon counting system”.</p><p>With modern technology it is possible to construct photon counting detector systems that can resolve details to a level of approximately 50 µm. However with such small pixels a problem will occur. In a semiconductor detector each absorbed X-ray photon creates a cloud of charge which contributes to the picture achieved. For high photon energies the size of the charge cloud is comparable to 50 µm and might be distributed between several pixels in the picture. Charge sharing is a key problem since, not only is the resolution degenerated, but it also destroys the “colour” information in the picture.</p><p>The problem involving charge sharing which limits “colour” X-ray imaging is discussed in this thesis. Image quality, detector effectiveness and “colour correctness” are studied on pixellated detectors from the MEDIPIX collaboration. Characterisation measurements and simulations are compared to be able to understand the physical processes that take place in the detector. Simulations can show pointers for the future development of photon counting X-ray systems. Charge sharing can be suppressed by introducing 3D-detector structures or by developing readout systems which can correct the crosstalk between pixels.</p>

Les détecteurs à pixels Medipix ont été développés par la collaboration Medipix et permettent de faire de l'imagerie en temps réel. Leur surface active de près de $2\cm^2$ est divisée en 65536~pixels de $55\times 55\um^2$ chacun. Seize de ces détecteurs, les Medipix2, sont installés dans l'expérience ATLAS au CERN afin de mesurer en temps réel les champs de radiation produits par les collisions de hadrons au LHC. Ils seront prochainement remplacés par des Timepix, la plus récente version de ces détecteurs, qui permettent de mesurer directement l'énergie déposée dans chaque pixel en mode \textit{time-over-threshold} (TOT) lors du passage d'une particule dans le semi-conducteur. En vue d'améliorer l'analyse des données recueillies avec ces détecteurs Timepix dans ATLAS, un projet de simulation Geant4 a été amorcé par John Id\'rraga à l'Université de Montréal. Dans le cadre de l'expérience ATLAS, cette simulation pourra être utilisée conjointement avec Athena, le programme d'analyse d'ATLAS, et la simulation complète du détecteur ATLAS. Sous l'effet de leur propre répulsion, les porteurs de charge créés dans le semi-conducteur sont diffusés vers les pixels adjacents causant un dépôt d'énergie dans plusieurs pixels sous l'effet du partage de charges. Un modèle effectif de cette diffusion latérale a été développé pour reproduire ce phénomène sans résoudre d'équation différentielle de transport de charge. Ce modèle, ainsi que le mode TOT du Timepix, qui permet de mesurer l'énergie déposée dans le détecteur, ont été inclus dans la simulation afin de reproduire adéquatement les traces laissées par les particules dans le semi-conducteur. On a d'abord étalonné le détecteur pixel par pixel à l'aide d'une source de $\Am$ et de $\Ba$. Ensuite, on a validé la simulation à l'aide de mesures d'interactions de protons et de particules $\alpha$ produits au générateur Tandem van de Graaff du Laboratoire René-J.-A.-Lévesque de l'Université de Montréal. / The pixelated Medipix detectors have been developed by the Medipix Collaboration to perform real-time imaging. The semiconducting chip is divided into 65536 pixels of $55\times 55\um^2$ for a total active area of nearly $2\cm^2$. Because of their sensitivity to all kinds of particles, sixteen Medipix2 detectors (ATLAS-MPX) have been placed in the ATLAS detector and its cavern to measure for the radiation produced by the head-on proton collisions produced at the LHC. At the next ATLAS upgrade, the ATLAS-MPX network will be extended to include the Timepix detectors, the latest version that allows one to measure the total energy deposited in the semiconductor. To improve data analysis, a Geant4 simulation project of a Timepix detector was initiated by John Id\'arraga at the Université de Montréal. In the framework of the ATLAS experiment, this simulation could be used with Athena, the ATLAS analysis software, and the full ATLAS simulation. Due to their repulsivity, the charge carriers created by an incoming particle in the pixelated detector are spread over the surrounding pixels causing a charge sharing effect. An effective model has been developed to reproduce this effect without resolving the charge drift's differential equation. This model and the \textit{time-over-threshold} mode of the Timepix have been included in the simulation to reproduce the tracks left by the striking particles. First, one had to individually calibrate each pixel of the device with $\Am$ and $\Ba$ sources. The simulation's validation has been performed with low energy protons and $\alpha$ particles delivered by the van de Graaff Tandem at the Laboratoire René-J.-A.-Lévesque of the Université de Montréal.

This thesis concerns the development and characterisation of X-ray imaging systems based on single photon processing. “Colour” X-ray imaging opens up new perspectives within the fields of medical X-ray diagnosis and also in industrial X-ray quality control. The difference in absorption for different “colours” can be used to discern materials in the object. For instance, this information might be used to identify diseases such as brittle-bone disease. The “colour” of the X-rays can be identified if the detector system can process each X-ray photon individually. Such a detector system is called a “single photon processing” system or, less precise, a “photon counting system”. With modern technology it is possible to construct photon counting detector systems that can resolve details to a level of approximately 50 µm. However with such small pixels a problem will occur. In a semiconductor detector each absorbed X-ray photon creates a cloud of charge which contributes to the image. For high photon energies the size of the charge cloud is comparable to 50 µm and might be distributed between several pixels in the image. Charge sharing is a key problem since, not only is the resolution degenerated, but it also destroys the “colour” information in the image. This thesis presents characterisation and simulations to provide a detailed understanding of the physical processes concerning charge sharing in detectors from the MEDIPIX collaboration. Charge summing schemes utilising pixel to pixel communications are proposed. Charge sharing can also be suppressed by introducing 3D-detector structures. In the next generation of the MEDIPIX system, Medipix3, charge summing will be implemented. This system, equipped with a 3D-silicon detector, or a thin planar high-Z detector of good quality, has the potential to become a commercial product for medical imaging. This would be beneficial to the public health within the entire European Union. / Denna avhandling berör utveckling och karaktärisering av fotonräknande röntgensystem. ”Färgröntgen” öppnar nya perspektiv för medicinsk röntgendiagnostik och även för materialröntgen inom industrin. Skillnaden i absorption av olika ”färger” kan användas för att särskilja olika material i ett objekt. Färginformationen kan till exempel användas i sjukvården för att identifiera benskörhet. Färgen på röntgenfotonen kan identifieras om detektorsystemet kan detektera varje foton individuellt. Sådana detektorsystem kallas ”fotonräknande” system. Med modern teknik är det möjligt att konstruera fotonräknande detektorsystem som kan urskilja detaljer ner till en upplösning på circa 50 µm. Med så små pixlar kommer ett problem att uppstå. I en halvledardetektor ger varje absorberad foton upphov till ett laddningsmoln som bidrar till den erhållna bilden. För höga fotonenergier är storleken på laddningsmolnet jämförbar med 50 µm och molnet kan därför fördelas över flera pixlar i bilden. Laddningsdelning är ett centralt problem delvis på grund av att bildens upplösning försämras, men framför allt för att färginformationen i bilden förstörs. Denna avhandling presenterar karaktärisering och simulering för att ge en mer detaljerad förståelse för fysikaliska processer som bidrar till laddningsdelning i detektorer från MEDIPIX-projekter. Designstrategier för summering av laddning genom kommunikation från pixel till pixel föreslås. Laddningsdelning kan också begränsas genom att introducera detektorkonstruktioner i 3D-struktur. I nästa generation av MEDIPIX-systemet, Medipix3, kommer summering av laddning att vara implementerat. Detta system, utrustat med en 3D-detektor i kisel, eller en tunn plan detektor av högabsorberande material med god kvalitet, har potentialen att kunna kommersialiseras för medicinska röntgensystem. Detta skulle bidra till bättre folkhälsa inom hela Europeiska Unionen.

Les détecteurs à pixels Medipix ont été développés par la collaboration Medipix et permettent de faire de l'imagerie en temps réel. Leur surface active de près de $2\cm^2$ est divisée en 65536~pixels de $55\times 55\um^2$ chacun. Seize de ces détecteurs, les Medipix2, sont installés dans l'expérience ATLAS au CERN afin de mesurer en temps réel les champs de radiation produits par les collisions de hadrons au LHC. Ils seront prochainement remplacés par des Timepix, la plus récente version de ces détecteurs, qui permettent de mesurer directement l'énergie déposée dans chaque pixel en mode \textit{time-over-threshold} (TOT) lors du passage d'une particule dans le semi-conducteur. En vue d'améliorer l'analyse des données recueillies avec ces détecteurs Timepix dans ATLAS, un projet de simulation Geant4 a été amorcé par John Id\'rraga à l'Université de Montréal. Dans le cadre de l'expérience ATLAS, cette simulation pourra être utilisée conjointement avec Athena, le programme d'analyse d'ATLAS, et la simulation complète du détecteur ATLAS. Sous l'effet de leur propre répulsion, les porteurs de charge créés dans le semi-conducteur sont diffusés vers les pixels adjacents causant un dépôt d'énergie dans plusieurs pixels sous l'effet du partage de charges. Un modèle effectif de cette diffusion latérale a été développé pour reproduire ce phénomène sans résoudre d'équation différentielle de transport de charge. Ce modèle, ainsi que le mode TOT du Timepix, qui permet de mesurer l'énergie déposée dans le détecteur, ont été inclus dans la simulation afin de reproduire adéquatement les traces laissées par les particules dans le semi-conducteur. On a d'abord étalonné le détecteur pixel par pixel à l'aide d'une source de $\Am$ et de $\Ba$. Ensuite, on a validé la simulation à l'aide de mesures d'interactions de protons et de particules $\alpha$ produits au générateur Tandem van de Graaff du Laboratoire René-J.-A.-Lévesque de l'Université de Montréal. / The pixelated Medipix detectors have been developed by the Medipix Collaboration to perform real-time imaging. The semiconducting chip is divided into 65536 pixels of $55\times 55\um^2$ for a total active area of nearly $2\cm^2$. Because of their sensitivity to all kinds of particles, sixteen Medipix2 detectors (ATLAS-MPX) have been placed in the ATLAS detector and its cavern to measure for the radiation produced by the head-on proton collisions produced at the LHC. At the next ATLAS upgrade, the ATLAS-MPX network will be extended to include the Timepix detectors, the latest version that allows one to measure the total energy deposited in the semiconductor. To improve data analysis, a Geant4 simulation project of a Timepix detector was initiated by John Id\'arraga at the Université de Montréal. In the framework of the ATLAS experiment, this simulation could be used with Athena, the ATLAS analysis software, and the full ATLAS simulation. Due to their repulsivity, the charge carriers created by an incoming particle in the pixelated detector are spread over the surrounding pixels causing a charge sharing effect. An effective model has been developed to reproduce this effect without resolving the charge drift's differential equation. This model and the \textit{time-over-threshold} mode of the Timepix have been included in the simulation to reproduce the tracks left by the striking particles. First, one had to individually calibrate each pixel of the device with $\Am$ and $\Ba$ sources. The simulation's validation has been performed with low energy protons and $\alpha$ particles delivered by the van de Graaff Tandem at the Laboratoire René-J.-A.-Lévesque of the Université de Montréal.

L’apparition de la segmentation électrique des détecteurs au GeHP et de l’électronique numérique a ouvert la voie à des applications prometteuses, telles que le tracking γ, l’imagerie γ ou la mesure bas bruit de fond, pour lesquelles une connaissance fine de la réponse du détecteur est un atout. L’IPHC a développé une table de scan utilisant un faisceau collimaté, qui sonde la réponse d’un détecteur dans tout son volume en fonction de la localisation de l’interaction. Elle est conçue pour utiliser une technique innovante de scan 3D, le Pulse Shape Comparison Scan, qui a été d’abord simulée afin de démontrer son efficacité. Un détecteur AGATA a été scanné de manière approfondie. Des scan 2D classiques ont permis, entre autres, de mettre en évidence des effets locaux de modification de la collection des charges, liés à la segmentation. Pour la première fois, une base de données 3D, complète, de formes d’impulsions fonction de la position d’interaction a été établie. Elle permettra notamment d’améliorer les performances du spectromètre AGATA. / Recent developments of electrical segmentation of HPGe detectors, coupled with digital electronics have led to promising applications such as γ-ray tracking, γ-ray imaging or low-background measurements which will benefit from a fine knowledge of the detector response. The IPHC has developed a new scanning table which uses a collimated γ-ray beam to investigate the detector response as a function of the location of the γ-ray interaction. It is designed to use the Pulse Shape Comparison Scan technique, which has been simulated in order to prove its efficiency. An AGATA detector has been thoroughly scanned. 2D classical scans brought out, for example, local charge collection modification effects such as charge sharing, due to the segmentation. For the first time, a 3D, complete pulse-shape database has been established. It will especially allow to improve the overall AGATA array performances.