付記する学位プログラム名: 京都大学卓越大学院プログラム「先端光・電子デバイス創成学」 / 京都大学 / 新制・課程博士 / 博士(工学) / 甲第23905号 / 工博第4992号 / 新制||工||1779(附属図書館) / 京都大学大学院工学研究科電子工学専攻 / (主査)教授 木本 恒暢, 教授 白石 誠司, 准教授 小林 圭 / 学位規則第4条第1項該当 / Doctor of Philosophy (Engineering) / Kyoto University / DFAM

Neste trabalho foram fabricados e caracterizados capacitores MOS com camada dielétrica de oxinitreto de silício de diferentes composição química, depositada pela técnica de PECVD a baixa temperatura, com o intuito de estudar suas propriedades dielétricas e de interface visando à aplicação deste material em dispositivos MOS e de filme fino. Os capacitores foram fabricados sobre lâminas de silício do tipo p que passaram pelo processo de limpeza química inicial, seguida da deposição da camada dielétrica, fotogravação, metalização e sinterização. Os filmes de SiOxNy, utilizados como camada dielétrica, foram depositados pela técnica de PECVD à temperatura de 320ºC variando os fluxos dos gases precursores de forma a obter filmes com diferentes composições químicas. Os capacitores MOS foram caracterizados por medidas de capacitância e corrente em função da tensão, de onde foram extraídas a densidade de estados de interface, a densidade de carga efetiva, constante dielétrica e campo elétrico de ruptura dos filmes. Os resultados mostraram uma variação linear da constante dielétrica do filme em função da concentração de nitrogênio, indo do valor de 3,9, correspondente ao dióxido de silício estequiométrico (SiO2) à 7,2 correspondente ao nitreto de silício estequiométrico (Si3N4). Também observamos que o nitrogênio é uma barreira eficiente à difusão de impurezas através do dielétrico. Porém, notamos uma grande dispersão de duas ordens de grandeza nos valores da carga efetiva (Nss) e de densidade de estados de interface (Dit). Por outro lado, controlando algumas variáveis de forma a manter constante o valor de Nss ( ~1012 cm-2), observamos uma variação de Dit em função da concentração de nitrogênio no filme, esta variação porém é pequena comparada com a dispersão de duas ordens de grandeza observada, que atribuímos assim a fatores externos. O menor valor obtido de Dit foi de 4,55.1010 eV-1.cm-2, que é ótimo para um filme obtido por PECVD, sem nenhum tratamento térmico e melhor que os reportados na literatura para dielétricos obtidos por técnicas que utilizam altas temperaturas (LPCVD-800ºC e oxinitretação térmica – 1100ºC). Assim, podemos concluir que a técnica de PECVD é promissora para a obtenção de dielétricos a baixas temperaturas. / In this work, MOS capacitors with different chemical composition silicon oxynitride insulating layer, deposited by PECVD technique at low temperature were fabricated and characterized, in order to study its dielectric and interface properties, seeking its aplication as insulating layer in MOS and thin films devices. The MOS capacitors were fabricated onto p-silicion wafers previously cleaned by a standard process, followed by the insulating layer deposition, photolitography, metalization and sinterization. The SiOxNy insulating layer was deposited by the PECVD technique at 320ºC changing the precursor gases flows to obtain films with different chemical compositions. The MOS capacitors were characterized by capacitance and current vs. voltage measurements, from where the interface state density (Dit), the effective charge density (Nss), the dielectric constant (k) and the film electrical breakdown field (Ebd) were extracted. The results showed a dielectric constant varying linearly as a function of the films nitrogen concentration, going from a value of 3.9, corresponding to stoichiometric silicon dioxide (SiO2) to a value of 7.2, corresponding to stoichiometric silicon nitride film (Si3N4). We also observed that nitrogen is an efficient diffusion barrier against contaminants. However, a large dispersion, about two orders of magnitude, in the effective charge and in the interface state density was observed. On the other hand, controlling some variables so as to keep the Nss value constant (~1012 cm-2) we observed a Dit variation as a function of the film nitrogen concentration, this variation is small when compared with the observed dispersion of two orders of magnitude, thus attributed to external factors. The smallest obtained Dit was 4.55.1010 eV-1.cm-2, which is unexpected for a PECVD film without any anealing process and is better than the values reported in the literature for dielectrics obtained at high temperatures techniques (as LPCVD – 800ºC and thermal oxynitridation – 1100ºC). Therefore, we can conclude that the PECVD technique is promising for obtaining low temperature dielectrics.

abstract: Silicon carbide (SiC) has always been considered as an excellent material for high temperature and high power devices. Since SiC is the only compound semiconductor whose native oxide is silicon dioxide (SiO2), it puts SiC in a unique position. Although SiC metal oxide semiconductor (MOS) technology has made significant progress in recent years, there are still a number of issues to be overcome before more commercial SiC devices can enter the market. The prevailing issues surrounding SiC MOSFET devices are the low channel mobility, the low quality of the oxide layer and the high interface state density at the SiC/SiO2 interface. Consequently, there is a need for research to be performed in order to have a better understanding of the factors causing the poor SiC/SiO2 interface properties. In this work, we investigated the generation lifetime in SiC materials by using the pulsed metal oxide semiconductor (MOS) capacitor method and measured the interface state density distribution at the SiC/SiO2 interface by using the conductance measurement and the high-low frequency capacitance technique. These measurement techniques have been performed on n-type and p-type SiC MOS capacitors. In the course of our investigation, we observed fast interface states at semiconductor-dielectric interfaces in SiC MOS capacitors that underwent three different interface passivation processes, such states were detected in the nitrided samples but not observed in PSG-passivated samples. This result indicate that the lack of fast states at PSG-passivated interface is one of the main reasons for higher channel mobility in PSG MOSFETs. In addition, the effect of mobile ions in the oxide on the response time of interface states has been investigated. In the last chapter we propose additional methods of investigation that can help elucidate the origin of the particular interface states, enabling a more complete understanding of the SiC/SiO2 material system. / Dissertation/Thesis / Doctoral Dissertation Electrical Engineering 2015

Neste trabalho foram fabricados e caracterizados capacitores MOS com camada dielétrica de oxinitreto de silício de diferentes composição química, depositada pela técnica de PECVD a baixa temperatura, com o intuito de estudar suas propriedades dielétricas e de interface visando à aplicação deste material em dispositivos MOS e de filme fino. Os capacitores foram fabricados sobre lâminas de silício do tipo p que passaram pelo processo de limpeza química inicial, seguida da deposição da camada dielétrica, fotogravação, metalização e sinterização. Os filmes de SiOxNy, utilizados como camada dielétrica, foram depositados pela técnica de PECVD à temperatura de 320ºC variando os fluxos dos gases precursores de forma a obter filmes com diferentes composições químicas. Os capacitores MOS foram caracterizados por medidas de capacitância e corrente em função da tensão, de onde foram extraídas a densidade de estados de interface, a densidade de carga efetiva, constante dielétrica e campo elétrico de ruptura dos filmes. Os resultados mostraram uma variação linear da constante dielétrica do filme em função da concentração de nitrogênio, indo do valor de 3,9, correspondente ao dióxido de silício estequiométrico (SiO2) à 7,2 correspondente ao nitreto de silício estequiométrico (Si3N4). Também observamos que o nitrogênio é uma barreira eficiente à difusão de impurezas através do dielétrico. Porém, notamos uma grande dispersão de duas ordens de grandeza nos valores da carga efetiva (Nss) e de densidade de estados de interface (Dit). Por outro lado, controlando algumas variáveis de forma a manter constante o valor de Nss ( ~1012 cm-2), observamos uma variação de Dit em função da concentração de nitrogênio no filme, esta variação porém é pequena comparada com a dispersão de duas ordens de grandeza observada, que atribuímos assim a fatores externos. O menor valor obtido de Dit foi de 4,55.1010 eV-1.cm-2, que é ótimo para um filme obtido por PECVD, sem nenhum tratamento térmico e melhor que os reportados na literatura para dielétricos obtidos por técnicas que utilizam altas temperaturas (LPCVD-800ºC e oxinitretação térmica – 1100ºC). Assim, podemos concluir que a técnica de PECVD é promissora para a obtenção de dielétricos a baixas temperaturas. / In this work, MOS capacitors with different chemical composition silicon oxynitride insulating layer, deposited by PECVD technique at low temperature were fabricated and characterized, in order to study its dielectric and interface properties, seeking its aplication as insulating layer in MOS and thin films devices. The MOS capacitors were fabricated onto p-silicion wafers previously cleaned by a standard process, followed by the insulating layer deposition, photolitography, metalization and sinterization. The SiOxNy insulating layer was deposited by the PECVD technique at 320ºC changing the precursor gases flows to obtain films with different chemical compositions. The MOS capacitors were characterized by capacitance and current vs. voltage measurements, from where the interface state density (Dit), the effective charge density (Nss), the dielectric constant (k) and the film electrical breakdown field (Ebd) were extracted. The results showed a dielectric constant varying linearly as a function of the films nitrogen concentration, going from a value of 3.9, corresponding to stoichiometric silicon dioxide (SiO2) to a value of 7.2, corresponding to stoichiometric silicon nitride film (Si3N4). We also observed that nitrogen is an efficient diffusion barrier against contaminants. However, a large dispersion, about two orders of magnitude, in the effective charge and in the interface state density was observed. On the other hand, controlling some variables so as to keep the Nss value constant (~1012 cm-2) we observed a Dit variation as a function of the film nitrogen concentration, this variation is small when compared with the observed dispersion of two orders of magnitude, thus attributed to external factors. The smallest obtained Dit was 4.55.1010 eV-1.cm-2, which is unexpected for a PECVD film without any anealing process and is better than the values reported in the literature for dielectrics obtained at high temperatures techniques (as LPCVD – 800ºC and thermal oxynitridation – 1100ºC). Therefore, we can conclude that the PECVD technique is promising for obtaining low temperature dielectrics.

京都大学 / 0048 / 新制・課程博士 / 博士(工学) / 甲第21110号 / 工博第4474号 / 新制||工||1695(附属図書館) / 京都大学大学院工学研究科電子工学専攻 / (主査)教授 木本 恒暢, 教授 藤田 静雄, 教授 白石 誠司 / 学位規則第4条第1項該当 / Doctor of Philosophy (Engineering) / Kyoto University / DFAM

No description available.

The development and characterization of experimental setups for angle-resolved photoelectron spectroscopy (ARPES) and spin- and angle-resolved photoelectron spectroscopy (SARPES) is described. Subsequently, the two techniques are applied to studies of the electronic band structure in topologically non-trivial materials. The laser-based ARPES setup works at a photon energy of 10.5 eV and a typical repetition rate in the range 200 kHz to 800 kHz. By using a time-of-flight electron energy analyzer electrons emitted from the sample within a solid angle of up to ±15 degrees can be collected and analyzed simultaneously. The SARPES setup is equipped with a traditional hemispherical electron energy analyzer in combination with a mini-Mott electron polarimeter. The system enables software-controlled switching between angle-resolved spin-integrated and spin-resolved measurements, thus providing the possibility to orient the sample by mapping out the electronic band structure using ARPES before performing spin-resolved measurements at selected points in the Brillouin zone. Thin films of the topological insulators (TIs) Bi2Se3, Bi2Te3 and Sb2Te3 are grown using e-beam evaporation and their surface states are observed by means of ARPES. By using a combination of low photon energies and cryogenic sample temperatures the topological states originating from both the vacuum interface (surface) and the substrate interface are observed in Bi2Se3 films and Bi2Se3/Bi2Te3 heterostructures, with total thicknesses in the ultra-thin limit (six to eight quintuple layers), grown on Bi-terminated Si(111) substrates. Band alignment between Si and Bi2Se3 at the interface creates a band bending through the films. The band bending is found to be independent of the Fermi level (EF) position in the bulk of the substrate, suggesting that the surface pinning of EF in the Si(111) substrate remains unaltered after deposition of the TI films. Therefore, the type and level of doping of the substrate does not show any large influence on the size of the band bending. Further, we provide experimental evidence for the realization of a topological crystalline insulator (TCI) phase in the narrow-band semiconductor Pb1−xSnxSe. The TCI phase exists for temperatures below the transition temperature Tc and is characterized by an inverted bulk band gap accompanied by the existence of non-gapped surface states crossing the band gap. Above Tc the material is in a topologically trivial phase where the surface states are gapped. Thus, when lowering the sample temperature across Tc a topological phase transition from a trivial insulator to a TCI is observed. SARPES studies indicate a helical spin structure of the surface states both in the topologically trivial and the TCI phase. / <p>QC 20130507</p>

La spintronique classique utilise généralement des matériaux magnétiques pour produire un courant de spin à partir d’un courant de charge. Un autre moyen, plus récemment étudié, consiste à utiliser le couplage spin-orbite (SOC). Il permet de produire un courant de spin pur selon une direction transverse au courant de charge en tenant compte des principes de la mécanique quantique relativiste. Dans les matériaux à fort couplage spin-orbite, les courants de spin ainsi produits sont suffisamment importants pour imaginer les utiliser pour la commutation magnétique dans les dispositifs spintroniques. Le couplage spin-orbite, correspondant à une correction relativiste dans les équations du mouvement de l’électron, particule de spin 1/2, peut être grand dans des matériaux contenant des atomes lourds. Cela signifie qu’une conversion du courant de charge en courant de spin peut être obtenue en utilisant les propriétés de systèmes à fort SOC tel que le platine (Pt), le tungstène (W) ou le tantale (Ta), par exemple. Depuis peu, des systèmes électroniques bidimensionnels (2DEG), obtenus au niveau d’interfaces ou de surfaces particulières, ont démontré des propriétés permettant des effets d’inter-conversion particulièrement efficaces. En particulier des états Rashba ou des systèmes d’isolants topologiques, suscitent actuellement un fort engouement dans la communauté de la spintronique pour cette faculté d’inter-conversion spin-charge.Dans ce cadre particulier, depuis une dizaine d’années, les isolants topologiques ont été étudiés pour leurs propriétés électroniques non conventionnelles qui prennent racine dans la définition théorique de l’effet Hall quantique entier donnée par Thouless, ainsi que dans les travaux de Haldane dans le graphène et de Kane dans des systèmes semi-conducteurs à faible bande interdite pourvus d’un SOC fort. Ces systèmes 2D présentent des propriétés électriques intrigantes : ils sont isolants en volume et conducteurs en surface. Ces états de conductions sont pourvus d’une dispersion linéaire en énergie en fonction du vecteur d’onde k, comme dans le cas du graphène, avec une hélicité en spin déterminée.De nombreuses questions restent néanmoins ouvertes quant à la compréhension des mécanismes à l’origine de ces états de conduction en surface, mais également quant à la manière la plus simple de détecter ces états topologiques. En vue de leur intégration dans des dispositifs spintroniques et de la réalisation d’interface TI/Matériaux ferromagnétiques un certain nombre de questions se posent : comment préserver la nature des états topologiques à l’interface ? Quels matériaux utiliser et quelle est la nature atomique de l’interface (diffusion atomique) ? Quels sont les échanges électroniques à l’interface ? Etc.L’une des applications utilisant les propriétés des isolants topologiques, est d’utiliser les propriétés de conversion du courant de charge en courant de spin (et vice versa) afin de modifier ou commuter l’aimantation d’un élément ou mémoire ferromagnétique déposé directement (ou séparé par une couche tampon) sur le matériau topologique lui-même. Un tel système de bicouches ou multi-couches devrait être capable de s’intégrer dans une mémoire vive magnétique (MRAM) ou d’accroître le potentiel des disques électroniques (SSD) en raison du caractère permanent et non volatile de l’état d’aimantation du matériau. C’est dans ce cadre que s’inscrit cette thèse. / Conventional spintronics generally uses magnetic materials to produce a spin current from a current of charge. Another means, more recently studied, is the use of spin-orbit coupling (SOC). It makes possible to produce a pure current of spin in a direction transverse to the charge current, taking into account the principles of relativistic quantum mechanics. In materials with strong spin-orbit coupling, the spin currents are large enough to imagine using them for magnetic switching in spintronic devices. The spin-orbit coupling, corresponding to a relativistic correction in the equations of motion of the electron, a spin 1/2 particle, can be large in materials containing heavy atoms. This means that a conversion from charge current to spin current can be obtained using the properties of SOC systems such as platinum (Pt), tungsten(W) or tantalum (Ta) for example. Recently 2 dimensionnal electronic gas (2DEG), obtained at particular interfaces or surfaces, have demonstrated properties allowing particularly effective inter-conversion effects. In particular Rashba states or topological insulator systems, are currently arousing a strong interest in the spintronics community for this faculty of spin-charge conversion.In this particular context, over the last ten years or so, topological insulators have been studied for their electronic properties which are rooted in the theoretical definition of the integer quantum Hall effect given by Thouless, as well as in the work of Haldane in graphene and Kane in low bandgap semiconductor systems with a strong SOC. These systems have intriguing electrical properties: they are insulating in volume and conductive on the surfaces. These conductivity states have a linear energy dispersion as a function of the k-wave vector, as in the case of the graphene, with a determined spin helicity.Nevertheless, many questions remain open as the understanding of the mechanisms at the origin of these states of surface conduction, but also as to the simplest way to detect these topological states. In order to integrate in spintronic devices and to realize TI/Ferromagnetic materials interface, a number of questions arise: how to preserve the nature of the topological states at the interface? What materials should be used and what is the atomic nature of the interface (inter-mixing) ? What are the electronic exchanges at the interface? Etc.One of the applications using the properties of topological insulators, is to use the conversion properties of the charge current to spin current in order to modify or switch the magnetization of a ferromagnetic element or memory deposited directly (or separated by a buffer layer) on the topological material itself. Such a two-layer system or multilayer should be capable of integration into a magnetic random access memory (MRAM) or of increasing the potential of disks (SSD) due to the permanent and non-volatile nature of the magnetisation state of the material. This is framework of this thesis.

A new high-k dielectric material, i.e., zirconium-doped tantalum oxide (Zr-doped TaOx), in the form of a sputter-deposited thin film with a thickness range of 5-100 nm, has been studied. Important applications of this new dielectric material include the gate dielectric layer for the next generation metal-oxide-semiconductor field effect transistor (MOSFET). Due to the aggressive device scaling in ultra-large-scale integrated circuitry (ULSI), the ultra-thin conventional gate oxide (SiO2) is unacceptable for many practical reasons. By replacing the SiO2 layer with a high dielectric constant material (high-k), many of the problems can be solved. In this study, a novel high-k dielectric thin film, i.e., TaOx doped with Zr, was deposited and studied. The film’s electrical, chemical, and structural properties were investigated experimentally. The Zr dopant concentration and the thermal treatment condition were studied with respect to gas composition, pressure, temperature, and annealing time. Interface layer formation and properties were studied with or without an inserted thin tantalum nitride (TaNx) layer. The gate electrode material influence on the dielectric properties was also investigated. Four types of gate materials, i.e., aluminum (Al), molybdenum (Mo), molybdenum nitride (MoN), and tungsten nitride (WN), were used in this study. The films were analyzed with ESCA, XRD, SIMS, and TEM. Films were made into MOS capacitors and characterized using I-V and C-V curves. Many promising results were obtained using this kind of high-k film. It is potentially applicable to future MOS devices.

A new high-k dielectric material, i.e., zirconium-doped tantalum oxide (Zr-doped TaOx), in the form of a sputter-deposited thin film with a thickness range of 5-100 nm, has been studied. Important applications of this new dielectric material include the gate dielectric layer for the next generation metal-oxide-semiconductor field effect transistor (MOSFET). Due to the aggressive device scaling in ultra-large-scale integrated circuitry (ULSI), the ultra-thin conventional gate oxide (SiO2) is unacceptable for many practical reasons. By replacing the SiO2 layer with a high dielectric constant material (high-k), many of the problems can be solved. In this study, a novel high-k dielectric thin film, i.e., TaOx doped with Zr, was deposited and studied. The film’s electrical, chemical, and structural properties were investigated experimentally. The Zr dopant concentration and the thermal treatment condition were studied with respect to gas composition, pressure, temperature, and annealing time. Interface layer formation and properties were studied with or without an inserted thin tantalum nitride (TaNx) layer. The gate electrode material influence on the dielectric properties was also investigated. Four types of gate materials, i.e., aluminum (Al), molybdenum (Mo), molybdenum nitride (MoN), and tungsten nitride (WN), were used in this study. The films were analyzed with ESCA, XRD, SIMS, and TEM. Films were made into MOS capacitors and characterized using I-V and C-V curves. Many promising results were obtained using this kind of high-k film. It is potentially applicable to future MOS devices.