The wide-bandgap (WBG) devices, like gallium nitride (GaN) and silicon carbide (SiC) devices have proven to be a driving force of the development of the power conversion technology. Thanks to their distinct advantages over silicon (Si) devices including the faster switching speed and lower switching losses, WBG-based power converter can adopt a higher switching frequency and pursue higher power density and higher efficiency. As a trade-off of the advantages, there also exist the high-frequency-oriented challenges in the adoption of the GaN HEMT under research, including narrow safe gate operating area, increased switching overshoot, increased electromagnetic interference (EMI) in the gate loop and the power stages, the lack of the modules of packages for high current application, high gate oscillation under parallel operation. The dissertation is developed to addressed the all the challenges above to fully explore the potential of the GaN HEMTs. Due to the increased EMI emission in the gate loop, a small isolated capacitor in the gate driver power supply is needed to build a high-impedance barrier in the loop to protect the gate driver from interference. A 2 W dual-output gate driver power supply with ultra-low isolation capacitor for 650 V GaN-based half bridge is presented, featuring a PCB-embedded transformer substrate, achieving 85% efficiency, 1.6 pF isolation capacitor with 72 W/in3 power density. The effectiveness of the EMI reduction using the proposed power supply is demonstrated. The design consideration to build a compact 650 V GaN switching cell is presented then to address the challenges in the PCB layout and the thermal management. With the switching cell, a compact 1 kW 400 Vdc three-phase inverter is built and can operate with 500 kHz switching frequency. With the inverter, the high switching frequency effects on the inverter efficiency, volume, EMI emission and filter design are assessed to demonstrate the tradeoff of the adoption of high switching frequency in the motor drive application. In order to reduce the inverter CM EMI emission above 10 MHz, an active gate driver for 650 V GaN HEMT is proposed to control the dv/dt during turn-on and turn-off independently. With the control strategy, the penalty from the switching loss can be reduced. To build a high current power converter, paralleling devices is a normal approach. The dissertation comes up with the switching cell design using paralleled two and four 650 V GaN HEMTs with minimized and symmetric gate and power loop. The commutation between the paralleled HEMTs is analyzed, based on which the effects from the passive components on the gate oscillation are quantified. With the switching cell using paralleled GaN HEMTs, a 10 kW LLC resonant converter with the integrated litz-wire transformer is designed, achieving 97.9 % efficiency and 131 W/in3 power density. The design consideration to build the novel litz-wire transformer operated at 400 kHz switching frequency is also presented. In all, this work focuses on providing effective solutions or guidelines to adopt the 650 V GaN HEMT in the high frequency, high power density, high efficiency power conversion and demonstrates the advance of the GaN HEMTs in the hard-switched and soft-switched power converters. / Ph. D. / Silicon (Si) -based power semiconductor has developed several decades and achieved numerous outstanding performances, contributing a fast development of the power electronics. While the theatrical limit of the silicon semiconductor is almost reached limiting the progress speed to purse the high-efficiency, high-density high-reliability power conversion, the new material, including gallium-nitride (GaN) and silicon-carbide (SiC), based semiconductor, becomes the driven force to retain the development. Compared with Si-based device, GaN and SiC device own a faster switching speed and a lower on-resistance, enabling the adoption of high switching frequency and the possibility to increase the efficiency, power density and dynamic response. The GaN-based semiconductor is explored to be an even promising game changer than SiC device thanks to a higher theoretical ceiling. However, to adopt GaN-based semiconductors and fully utilize its benefits with high switching frequency, there are numerous high-frequency-oriented challenges, including high frequency oscillation at device termination, increased electromagnetic interference (EMI), the lack of the modules of packages for high current application, high frequency oscillation under parallel operation. The dissertation is developed to address the key high-frequency-oriented challenges to adopt GaN-based semiconductors in the power conversion and come up with the novel design strategy and analysis for high-switching-frequency power conversion using GaN devices. To the reduce the increased EMI emission in the gate loop, a novel PCB-embedded transformer structure is proposed to maintain a low isolation capacitor in the gate driver power supply for the GaN phase leg. With the proposed technique, the dual-output gate driver power supply can achieve high efficiency (85%), ultra-low isolation capacitor (1.6 pF) with high power density (72 W/in³ ). To reduce the high frequency oscillation at the GaN device termination, the strategy to layout GaN devices and its gate driver is proposed with corresponding thermal management. A compact structure for three-phase inverter is then presented, operating with a very high switching frequency (500 kHz). Within the inverter, the high switching frequency effects on the inverter performances are assessed to demonstrate the tradeoff and bottle neck to adopt high switching frequency in the motor drive application. In order to reduce the inverter EMI emission at high frequency ( >10 MHz), an active gate driver for GaN device is proposed for the active dv/dt control strategy. To build a high current power converter, the strategy to parallel GaN devices is proposed in the dissertation with the analysis on the commutation between the paralleled GaN devices. A high-frequency high-current litz-wire transformer structure for LLC resonant converter is presented with modeling and optimization. With the technique, a 10 kW LLC resonant converter achieves high efficiency (97.9 %) and high power density (131 W/in³).

Today, every microprocessor is powered with a Voltage Regulator (VR), which is also known as a high current Point-of-Load converter (POL). These circuits are mostly constructed using discrete components, and populated on the motherboard. With this solution, the passive components such as inductors and capacitors are bulky. They occupy a considerable footprint on the motherboard. The problem is exacerbated with the current trend of reducing the size of all forms of portable computing equipment from laptop to netbook, increasing functionalities of PDA and smart phones. In order to solve this problem, a high power density POL needs to be developed. An integration solution was recently proposed to incorporate passive components, especially magnetic components, with active components in order to realize the needed power density for the POL. Today's discrete VR only has around 100W/in3 power density. The 3D integration concept is widely used for low current integrated POL. With this solution, a very low profile planar inductor is built as a substrate for the active components of the POL. By doing so, the POL footprint can be dramatically saved, and the available space is also fully utilized. This 3D integrated POL can achieve 300-1000W/in3 power density, however, with considerably less current. This might address the needs of small hand-held equipment such as PDA and Smart phone type of applications. It does not, however, meet the needs for such applications as netbook, laptop, desk-top and server applications where tens and hundreds of amperes are needed. So, although the high density integrated POL has been demonstrated at low current level, magnetic integration is still one of the toughest barriers for integration, especially for high current POL. In order to alleviate the intense thirst from the computing and telecom industry for high power density POL, the 3D integration concept needs be extended from low current applications to high current applications. The key technology for 3D integration is the low profile planar inductor design. Before this research, there was no general methodology to analyze and design a low profile planar inductor due to its non-uniform flux distribution, which is totally different as a conventional bulky inductor. A Low Temperature Co-fired Ceramic (LTCC) inductor is one of the most promising candidates for 3D integration for high current applications. For the LTCC inductor, besides the non-uniform flux, it also has non-linear permeability, which makes this problem even more complicated. This research focuses on penetrating modeling and design barriers for planar magnetic to develop high current 3D integrated POL with a power density dramatically higher than today's industry products in the same current level. In the beginning, a general analysis method is proposed to classify different low profile inductor structures into two types according to their flux path pattern. One is a vertical flux type; another one is a lateral flux type. The vertical flux type means that the magnetic flux path plane is perpendicular with the substrate. The lateral flux type means that the magnetic flux path plane is parallel with the substrate. This analysis method allows us to compare different inductor structures in a more general way to reveal the essential difference between them. After a very thorough study, it shows that a lateral flux structure is superior to a vertical flux structure for low profile high current inductor design from an inductance density point of view, which contradicts conventional thinking. This conclusion is not only valid for the LTCC planar inductor, which has very non-linear permeability, but is also valid for the planar inductor with other core material, which has constant permeability. Next, some inductance and loss models for a planar lateral flux inductor with a non-uniform flux are also developed. With the help of these models, different LTCC lateral flux inductor structures (single-turn structure and multi-turn structures) are compared systematically. In this comparison, the inductance density, winding loss and core loss are all considered. The proposed modeling methodology is a valuable extension of previous uniform flux inductor modeling, and can be used to solve other modeling problems, such as non-uniform flux transformer modeling. After that, a design method is proposed for the LTCC lateral flux inductor with non-uniform flux distribution. In this design method, inductor volume, core thickness, winding loss, core loss are all considered, which has not been achieved in previous conventional inductor design methods. With the help of this design method, the LTCC lateral flux inductor can be optimized to achieve small volume, small loss and low profile at the same time. Several LTCC inductor substrates are also designed and fabricated for the 3D integrated POL. Comparing the vertical flux inductor substrate with the lateral flux inductor substrate, we can see a savings of 30% on the footprint, and a much simpler fabrication process. A 1.5MHz, 5V to 1.2V, 15A 3D integrated POL converter with LTCC lateral flux inductor substrate is demonstrated with 300W/in3 power density, which has a factor of 3 improvements when compared to today's industry products. Furthermore, the LTCC lateral flux coupled inductor is proposed to further increase power density of the 3D integrated POL converter. Due to the DC flux cancelling effect, the size of LTCC planar coupled inductor can be dramatically reduced to only 50% of the LTCC planar non-coupled inductor. Compared to previous vertical flux coupled inductor prototypes, a lateral flux coupled inductor prototype is demonstrated to have a 50% core thickness reduction. A 1.5MHz, 5V to 1.2V, 40A 3D integrated POL converter with LTCC lateral flux coupled inductor substrate is demonstrated with 700W/in3 power density, which has a factor of 7 improvements when compared to today's industry POL products in the same current level. In conclusion, this research not only overcame some major academia problems about analysis and design for planar magnetic components, but also made significant contributions to the industry by successfully scaling the integrated POL from today's 1W-5W case to a 40W case. This level of integration would significantly save the cost, and valuable motherboard real estate for other critical functions, which may enable the next technological innovation for the whole computing and telecom industry. / Ph. D.

Rapid expansion of the information technology (IT) sector, market size and consumer interest for off-line power supply continue to rise, particularly for computers, flat-panel TVs, servers, telecom, and datacenter applications. Normal components of an off-line power supply include an electromagnetic interference (EMI) filter, a power factor correction (PFC) circuit, and an isolated DC-DC converter. For off-line power supply, an isolated DC-DC converter offers isolation and output voltage adjustment. For an off-line power supply, it takes up significantly more room than the rest; thus, an isolated DC-DC converter is essential for enhancing the overall performance and lowering the total cost of an off-line power supply. In contrast, data center server power supplies are the most performance-driven, energy-efficient, and cost-aware of any industrial application power supply. The full extent of data centers' energy consumption is coming into focus. By 2030, it is anticipated that data centers will require around 30,000 TWh, or 7.6% of world power usage. In addition, with the rise of cloud computing and big data, the energy consumption of data centers is anticipated to continue rising rapidly in the near future. In data centers, isolated DC-DC converters are expected to supply even higher power levels without expanding their size and with much greater efficiency than the present standard, which makes their design even more challenging. LLC resonant converters are frequently utilized as DC-DC converters in off-line power supply and data centers because of their high efficiency and hold-up capabilities. LLC converters may reduce electromagnetic interference because the primary switches and secondary synchronous rectifiers (SRs) both feature zero-voltage-switching (ZVS) and zero-current-switching (ZCS) for the SRs. Almost every state-of-the-art off-line power supply uses LLC converters in their DC-DC transformations. However, LLC converters face three important challenges. First, the excessive core loss caused by the uneven flux distribution in planar magnetics, owing to the huge size and high-frequency operation of the core. These factors led to the observation of dimensional resonance within the core and an excessive amount of eddy current circulating within the core, which resulted in the generation of high eddy loss within the ferrite material. This was normally assumed to be negligible for small core sizes and lower frequencies. This dissertation proposes methods to help redistribute the flux in the core, particularly in the plates where the majority of core losses are concentrated, and to provide more paths for the flux to flow so that the plates' thickness can effectively be reduced by half and core losses, particularly eddy loss, are reduced significantly. Second, the majority of power supplies in the IT sector are needed to deliver high-current output, but the transformer is cumbersome and difficult to build because of its high conduction losses. In addition, establishing a modular solution that can be scaled up to greater power levels while attaining a superior performance relative to best practices is quite difficult. By increasing the switching frequency to several hundred kilohertz using wide-band-gap (WBG) transistors, printed circuit board (PCB) windings may include magnetics. This dissertation offers a modular and scalable matrix transformer structure and its design technique, allowing any number of elemental transformers to be integrated into a single magnetic core with significantly reduced winding loss and core loss. It has been shown that the ideal power limitations per transformer for PCB-based magnetics beat the typical litz wire design in all design areas, in addition to the unique advantages of PCB-magnetics, such as their low profile, high density, simplicity, and automated construction. Alternatively, shielding layers may be automatically put into the PCB windings between the main and secondary windings during the production process to reduce CM noise. A method of shielding is presented to reduce CM noise. The suggested transformer design and shielding method are used in the construction of a 3 kW 400V/48 V LLC converter, with a maximum efficiency of 99.06% and power density of 530W/in3. Thirdly, LLC converters with a matrix transformer encounter a hurdle for extending greater power, including the number of transformers needed and the magnetic size. In addition to the necessity of resonant inductors, which increase the complexity and size of the magnetic structure, there is a need for a resonant inductor. By interconnecting the three-phases in a certain manner, three-phase interleaved LLC converters may lower the circulating energy, but they have large and numerous magnetic components. In this dissertation, a new topology for three-phase LLC resonant converters is proposed. Three-phase systems have the advantage of flux cancellation, which may be used to further simplify the magnetic structure and decrease core loss. In addition, a study of the various three-phase topologies is offered, and a criterion for selecting the best suitable topology is shown. Compared to the single-phase LLC, the suggested topology has less winding loss and core loss. In addition, three-phase transformers have a lower volt-second rating, and smaller core sizes may be used to mitigate the impact of eddy loss in the ferrite material. In contrast, three-phase systems offer superior EMI performance, which is shown in the loss and size of the EMI filter, and much less output voltage ripple, which is reflected in the size of the output filter. Finally, several methods of integrating resonant inductors into transformer magnetics are presented in order to accomplish a simple, compact, and cost-effective magnetic architecture. By increasing the switching frequency to 500 kHz, all six transformers and six inductors may be achieved using four-layer PCB winding. To decrease CM noise, additional 2-layer shielding may be implemented. A 500 kHz, 6-8 kW, 400V/48V, three-phase LLC converter with the suggested magnetic structure achieves 99.1% maximum efficiency and a power density of 1000 W/in3. This dissertation addresses the issues of analysis, magnetic design, expansion to higher power levels, and electromagnetic interference (EMI) in high-frequency DC/DC converters used in off-line power supply and data centers. WBG devices may be effectively used to enable high-frequency DC/DC converters with a hundred kilohertz switching frequency to achieve high efficiency, high power density, simple yet high-performance, and automated manufacture. Costs will be minimized, and performance will be considerably enhanced. / Doctor of Philosophy / The IT industry, market size, and customer interest in off-line power supply continue to grow quickly, especially for computers, flat-panel TVs, servers, telecom, and datacenter applications. Off-line power supplies usually have a DC-DC converter, an EMI filter, and a PFC circuit. A DC-DC converter is needed for an off-line power supply. An isolated DC-DC converter makes an off-line power supply work better and cost less, even though it takes up more space than the rest. But power supplies for data center servers are the most performance-driven, energy-efficient, and cost-conscious industrial applications. It's becoming clear how much energy data centers use. By 2030, data centers will use 7.6% of the world's power, or 30,000 TWh. With the rise of cloud computing and big data, energy use in data centers is likely to go up by a lot. In data centers, isolated DC-DC converters are expected to have much more power without getting bigger and to be much more efficient than the current standard. This makes their design even harder. LLC resonant converters are often used as DC-DC converters in data centers and off-line power supplies because they are very efficient and easy to control. LLC converters may have less electromagnetic interference because both the primary switches and the secondary synchronous rectifiers (SRs) have zero-voltage-switching (ZVS) and zero-current-switching (ZCS). Almost every modern off-line power supply uses LLC converters for DC-DC stage. LLC converters have to deal with three big problems. Due to the large size of the core and the high frequency of operation, the uneven distribution of flux in planar magnetics causes too much core loss. This dissertation suggests ways to redistribute flux in the core, especially in the plates where most core losses are concentrated and provide more flux paths to reduce plate thickness by half and core losses, especially eddy loss. Second, most IT power supplies need to put out a lot of current, but transformers are bulky and hard to build because they lose a lot of current. It is hard to make a modular solution that can scale up to higher levels of power and perform better than best practices. With wide-band-gap (WBG) transistors, the switching frequency can be raised to several hundred kilohertz so that magnetics can be added to PCB windings. This dissertation describes a modular and scalable matrix transformer structure and design method that lets any number of elemental transformers be put into a single magnetic core with much less winding loss and core loss. PCB-based magnetics have a low profile, a high density, are easy to build, and can be built automatically. Their ideal power limits per transformer beat the typical litz wire design in every way. Shielding layers can be added automatically between the main and secondary PCB windings to cut down on CM noise. CM noise is lessened by shielding. The suggested transformer design and shielding method are used to build a 3 kW 400V/48 V LLC converter with a maximum efficiency of 99.06% and a power density of 530W/in3. Third, LLC converters with matrix transformers can't get more power without more transformers and a bigger magnetic size. Resonant inductors, which add to the size and complexity of a magnetic structure, are also needed. By connecting the three phases, three-phase interleaved LLC converters use less energy, but they have a lot of magnetic parts. In this paper, a three-phase LLC resonant converter topology is proposed. In three-phase systems, flux cancellation makes magnetic structures easier to understand and reduces core loss. There is also a study of three-phase topologies and a set of criteria for choosing one. Compared to the single-phase LLC, the topology cuts down on winding and core loss. Three-phase transformers have a lower volt-second rating, and ferrite material eddy loss can be reduced by making the core smaller. The size and loss of the EMI filter show that three-phase systems have less output voltage ripple and better EMI performance. Finally, several ways of putting resonant inductors into the magnetics of a transformer are shown to make a magnetic architecture that is simple, small, and cheap. At 500 kHz, all six transformers and all six inductors can be wound on a four-layer PCB. CM noise can be cut down with 2-layer shielding. With the suggested magnetic structure, a 500 kHz, 6-8 kW, 400V/48V, three-phase LLC converter can reach 99.1% maximum efficiency and 1000 W/in3. This dissertation presents analysis, magnetic design, expanding to higher power levels, and electromagnetic interference (EMI) in high-frequency DC/DC converters used in off-line power supplies and data centers. WBG devices can be used to make high-frequency DC/DC converters with a switching frequency of a few hundred kilohertz that are powerful, easy to use, and can be automated. Both cost and performance will get better.

The emergence of silicon-carbide (SiC) devices has been a 'game changer' in the field of power electronics. With desirable material properties such as low-loss characteristics, high blocking voltage, and high junction temperature operation, they are expected to drastically increase the power density of power electronics systems. Recent state-of-the-art designs show the power density over 17 ; however, certain factors limit the power density to increase beyond this limit. In this dissertation, three key factors are selected to increase the power density of SiC-based grid-connected three-phase converters. Throughout this dissertation, the techniques and strategies to increase the power density of SiC three-phase converters were investigated. Firstly, a magnetic integration method was introduced for the coupled inductors in the interleaved three-phase converters. Due to limited current-capacity compared to the silicon insulated-gate bipolar transistors (Si-IGBTs), discrete SiC devices or SiC modules, operate in parallel to handle a large current. When three-phase inverters are paralleled, interleaving can be used, and coupled inductors are employed to limit the circulating current. In Chapter 2, the conventional integration method was extended to integrate three coupled inductors into two; one for differential-mode circulating current and the other for common-mode circulating current. By comparing with prior research work, a 20% reduction in size and weight is demonstrated. From Chapter 3 to Chapter 5, a full-SiC uninterruptible power supply (UPS) was investigated. With the high switching frequency and fast switching dynamics of SiC devices, strategies on electromagnetic inference become more important, compared to Si-IGBT based inverters. Chapter 3 focuses on a common-mode equivalent circuit model for a topology and pulse width modulation (PWM) scheme selection, to set a noise mitigation strategy in the design phase. A three terminal common-mode electromagnetic interference (EMI) model is proposed, which predicts the impact of the dc-dc stage and a large battery-rack on the output CM noise. Based on the model, severe deterioration of noise by the dc-dc stage and battery-rack can be predicted. Special attention was paid on the selection of the dc-dc stage's topology and the PWM scheme to minimize the impact. With the mitigation strategy, a maximum 16 dB reduction on CM EMI can be achieved for a wide frequency range. In Chapter 4, an active PWM scheme for a full-SiC three-level back-to-back converter was proposed. The PWM scheme targets the size reduction of two key components: dc-link capacitors and a common-mode EMI filter. The increase in switching frequency calls for a large common-mode EMI filter, and dc-link capacitors in the three-level topology may take a considerable portion in the total volume. To reduce the common-mode noise emission, different combinations of the voltage vectors are investigated to generate center-aligned single pulse common-mode voltage. By such an alignment of common-mode voltage with different vector combinations, noise cancellation between the rectifier and the inverter can be maximally utilized, while the balancing of neutral point voltage can be achieved by the transition between the combinations. Also, to reduce the size of the dc-link capacitor for the three-level back-to-back converter, a compensation algorithm for neutral point voltage unbalance was developed for both differential-mode voltage and the common-mode voltage of the ac-ac stage. The experimental results show a 4 dB reduction on CM EMI, which leads to a 30% reduction on the required CM inductance value. When a 10% variation of neutral point voltage can be handled, the dc-link capacitance can be reduced by 56%. In Chapter 5, a 20 kW full-SiC UPS prototype was built to demonstrate a possible size-reduction with the proposed PWM scheme, as well as a selection of topologies and PWM schemes based on the model. The power density and efficiency are compared with the state-of-the-art Si-IGBT based UPSs. Chapter 6 seeks to improve power density by a change in a modulation method. Triangular conduction mode (TCM) operation of the three-level full-SiC inverter was investigated. The switching loss of SiC devices is reported to be concentrated on the turn-on instant. With zero-voltage turn-on of all switches, the switching frequency of a three-level three-phase SiC inverter can be drastically increased, compared to the hard-switching operation. This contributes to the size-reduction of the filter inductors and EMI filters. Based on the design to achieve a 99% peak efficiency, a comparison was made with a full-SiC three-level inverter, operating in continuous conduction mode (CCM), to verify the benefit of the soft switching scheme on the power density. A design procedure for an LCL filter of paralleled TCM inverters was developed. With 3.5 times high switching frequency, the total weight of the filter stage of the TCM inverter can be reduced by 15%, compared to that of the CCM inverter. Throughout this dissertation, techniques for size reduction of key components are introduced, including coupled inductors in parallel inverters, an EMI filter, dc-link capacitors, and the main boost inductor. From Chapter 2 to 5, the physical size or required value of these key components could be reduced by 20% to 56% by different schemes such as magnetic integration, EMI mitigation strategy through modeling, and an active PWM scheme. An optimization result for a full-SiC UPS showed a 40% decrease in the total volume, compared to the state-of-the-art Si-IGBT solution. Soft-switching modulation for SiC-based three-phase inverters can bring a significant increase in the switching frequency and has the potential to enhance power-density notably. A three-level three-phase full-SiC 40 kW PV inverter with TCM operation contributed to a 15% reduction on the filter weight. / Doctor of Philosophy / The power density of a power electronics system is regarded as an indicator of technological advances. The higher the power density of the power supply, the more power it can generate with the given volume and weight. The size requirement on power electronics has been driven towards tighter limits, as the dependency on electric energy increases with the electrification of transportation and the emergence of grid-connected renewable energy sources. However, the efficiency of a power electronics system is an essential factor and is regarded as a trade-off with the power density. The size of power electronics systems is largely impacted by its magnetic components for filtering, as well as its cooling system, such as a heatsink. Once the switching frequency of power semiconductors is increased to lower the burden on filtering, more loss is generated from filters and semiconductors, thus enlarging the size of the cooling system. Therefore, considering the efficiency has to be maintained at a reasonable value, the power density of Si-based converters appears to be saturated. With the emergence of wide-bandgap devices such as silicon carbide (SiC) or gallium nitride (GaN), the switching frequency of power devices can be significantly increased. This is a result of superior material properties, compared to Si-based power semiconductors. For grid-connected applications, SiC devices are adopted, due to the limitations of voltage ratings in GaN devices. Before commercial SiC devices were available, the power density of SiC- based three-phase inverters was expected to go over 20 𝑘𝑊 𝑑𝑚3 ⁄ . However, the state-of-the art designs shows the power density around 3 ~ 4 𝑘𝑊 𝑑𝑚3 ⁄ , and at most 17 𝑘𝑊 𝑑𝑚3 ⁄ . The SiC devices could increase the power density, but they have not reached the level expected. The adoption of SiC devices with faster switching was not a panacea for power density improvement. This dissertation starts with an analysis of the factors that prevent power density improvement of SiC-based, grid-connected, three-phase inverters. Three factors were identified: a limited increase in the switching frequency, large high-frequency noise generation to be filtered, and smaller but still significant magnetic components. Using a generic design procedure for three-phase inverters, each chapter seeks to frame a strategy and develop techniques to enhance the power density. For smaller magnetic components, a magnetic integration scheme is proposed for paralleled ac-dc converters. To reduce the size of the noise filter, an accurate modeling approach was taken to predict the noise phenomena during the design phase. Also, a modulation scheme to minimize the noise generation of the ac-ac stage is proposed. The validity of the proposed technique was verified by a full-SiC three-phase uninterruptible power supply with optimized hardware design. Lastly, the benefit of soft-switching modulation, which leads to a significant increase in switching frequency, was analyzed. The hardware optimization procedure was developed and compared to hard-switched three-phase inverters.

The telecommunications market is one of the large rapidly growing fields in today’s power supply industry due to the increasing demand for telecom distributed power supply (DPS) systems. The half-bridge LLC (Inductor-Inductor-Capacitor) resonant converter is currently the most attractive topology for the design and implementation of 24V/48V DC telecom power converters. The current doubler rectifier (CDR) converter topology was invented and described in the early 1950s which can offer the unique characteristic of halving the output voltage while doubling the output current compared to a standard rectifier. In this thesis, the current doubler converter topology with its unique characteristic is evaluated as a complementary solution to improve the LLC resonant converter performance, especially for the low output voltage and high output current telecommunication applications. A novel half-bridge LLC resonant current doubler converter (LLC-CDR) is proposed in this thesis which can offer several performance benefits compared to conventional LLC-standard rectifier design . The unique characteristics of the LLC-CDR topology can offer significant improvements by transformation of a 48V converter into a 24V converter with the same power density. This thesis introduces a new SPICE-based simulation model to analyse the operation of this novel LLC-CDR converter circuit design. This model can be used to define the critical component parameters for the LLC -CDR circuit output inductor values. It can also be used to predict the circuit overall performance under different load conditions. Both time-domain based transient simulation analysis and frequency-domain based AC analysis provided by this simulation model showed favourable results in comparison to bench measurement results on a prototype. The model provides a valuable insight to reveal some of the unique characteristics of this LLC -CDR topology. It demonstrates a proof of concept that the conventional LLC resonant converter can be easily redesigned for low voltage, high current applications by using the LLC-CDR topology without requiring a new design for the LLC resonant stage components and the power transformer. A new magnetic integration solution was proposed to significantly improve the overall performance in the LLC-CDR topology that had not been published before. The LLC-CDR converter hardware prototypes with two output inductors coupled and uncoupled configurations were extensively modelled, constructed and bench tested.Test results demonstrated the suitability of an integrated coupled inductors design for the novel LLC-CDR converter application. The integrated coupled inductors design can significantly improve the LLC-CDR converter frequency-domain based AC simulation analysis results. In addition, these results also illustrate the potential benefit of how the magnetic integration design in general could reduce the magnetic component size, cost, and weight compared to the uncoupled inductors design. Finally, a hardware prototype circuit was constructed based on a commercial 1800 W single phase telecom power converter to verify the operation of this novel half bridge LLC-CDR topology. The converter prototype successfully operated at both no load and full load conditions with the nominal output voltage halved from 48VDC to 24VDC, and doubled the output current to match the same output power density. It also demonstrates that the efficiency of this novel half bridge LLC –CDR is 92% compares to 90% of EATON’s commercial 24VDC LLC resonant converter, which can fulfill the research goals.