This diploma thesis deals with the development, disign and manufacturing inspection device that is able to detect the presence of components in the assembly of the plastic molding. Evaluation of information are indicated by the operator device and sent for further processing. Rechecked product will be marked with a uniquemark.

Renewable lignocellulosic materials are promising green plastic alternatives to fossil fuel-based plastics. However, the hydrophilic nature and poor water resistance of lignocellulosic materials have hindered their practical applications. This study reports a facile metal-ion-modification (MIM) route, swelling with aqueous metal ion solutions, and drying to convert conventional hydrophilic paper and wood pulp into biodegradable hydrophobic paper and tableware without the addition of hydrophobic sizing chemicals/materials. Metal ions such as Fe3+ and Zr4+ can coordinate with pulp fibers’ polar groups (i.e., O.H., C=O, and COOH) that induce self-assembly of their surface fibrillated “hairy” cellulose nanofibrils to form a more compact structure with fewer available O.H. groups for water sorption. The formation of coordination bonds with polar groups (i.e., O.H., C=O, and COOH) decreases the surface energy of pulp fibers and increases their hydrophobicity and water resistance. Only ~3 mg of metal ions is needed to induce the wettability transition in 1 g of kraft pulp, resulting in hydrophobic paper and tableware with water contact angles (WCAs) of 120-140° and displayed wet tensile strengths of up to 9.5 MPa, and low water absorbency, which were comparable to synthetic polymer films. This MIM technique can be integrated into the existing paper-making process for the scalable production of hydrophobic papers and tableware, providing an alternative route for developing sustainable and biodegradable plastic counterparts. The MIM-induced lignocellulose hydrophobization mechanisms were elucidated using X-ray photoelectron spectroscopy (XPS), Fourier transforms infrared spectroscopy (FT-IR), and scanning electron microscopy-energy dispersive spectroscopy (SEM-EDS), and density functional theory (DFT). Furthermore, this MIM technique was also evaluated for its applicability in wood treatment. The treatment effectively tunes the wood surface from hydrophilic to hydrophobic, enhancing its water resistance. The MIM treatment significantly improved the dimensional stability of SYP, red oak, and poplar. For example, the Fe3+ treatment reduced the tangential swelling of SYP, poplar, and red oak by 57%, 50%, and 40%, respectively. Overall, this eco-friendly and facile MIM method holds promise for developing sustainable and biodegradable alternatives to conventional plastics, contributing to a more environmentally friendly future.

No description available.

Les modules photovoltaïques à concentration (CPV) ont tendance à se miniaturiser. D’une part, la distance focale plus courte des optiques de concentration permet de réduire le besoin en matériaux pour l’assemblage du module ; et d’autre part, le rendement des modules est sensiblement meilleurs que ceux des modules CPV de taille normale. L’étude de chaque élément de la chaine de pertes dans la littérature des micro-concentrateurs a permis de confirmer cette tendance. Cette thèse aborde les problématiques de coût et de rendement à travers la conception optique d’un concentrateur à deux étages de lentilles, sa fabrication puis une étude approfondie de ses performances.La méthode de conception, développée à partir de lois d’optique géométrique et non-imageante, définit le profil des lentilles à λ=589nm en premiers lieux. Ensuite, une simulation par tracé de rayons permet d’optimiser ces lentilles pour l’ensemble du spectre solaire puis d’étudier l’impact de leur désalignement lors de la mise en module. Les limites des déplacements des éléments du module ainsi déterminées conditionnent la précision de sa fabrication. Dans notre cas, l’alignement est réalisé automatiquement par un jeu de repères mécaniques lors du moulage simultané des optiques primaires (POE) et des optiques secondaires (SOE). Contrairement aux procédés habituels, ce procédé de moulage innovant permet d’assembler un module en seulement trois étapes au lieu de cinq.Pour caractériser les micro-concentrateurs réalisés, une méthode de mesure du rapport module à cellule (CTM) est développée. Pour cela, le rendement des cellules est mesuré en simulateur solaire avant et après leur mise en module. Les cellules multi-jonctions mises en œuvre étant sensibles aux variations spectrales et spatiales de l’éclairement, la validation préalable de ces mesures est primordiale. En complément du CTM qui quantifie la somme des pertes introduites lors de la mise en module, d’autres mesures sont développées pour comprendre la chaine de perte plus en détails.Le dispositif étudié au cours de cette thèse utilise des cellules triple-jonction de 0,6 x 0,6mm² avec une concentration de 1000X et atteint un rendement de 29%. Le CTM est de 70% et l’analyse de la chaine de perte montre que le procédé inventé n’impacte pas ou peu les performances du module. De plus, la détermination de la chaine de perte montre que les pertes par réflexion et par absorption sont prédominantes, au même titre que les pertes dues à la diffusion des lentilles ainsi que les pertes dues aux non-uniformités d’éclairement sur la cellule. / The actual trend of CPV is the micro-scaling of modules. A bibliographic study shows that shorter focal length of optics implies less material consumption in manufacturing and an enhanced efficiency of the modules. In this thesis, a double stage refractive micro-concentrator is designed, manufactured and characterized. First, the optical design of the concentrator is based on non-imaging technics. Thus, the profile of the lenses is generated for a single wavelength. Then, a ray tracing simulator is used to optimize the lens profile for the overall solar spectrum and study the concentrator element misalignment effect on the performances.Secondly, a three steps self-assembly process is developed instead of the usual five steps one. Both POE and SOE lenses of our device are molded simultaneously and a mechanical guidance system in the mold ensures the alignment of the micro-concentrator elements (POE, SOE and Cell).Finally, the performances measurements of the manufactured modules are managed in solar simulators in which the lightening condition are previously studied and validated. Comparing the bare cells efficiency with the module efficiency, the cell-to-module ratio (CTM) represents the overall losses in the module. Further experiments are managed to quantify each loss of the module. The manufactured and characterized micro-concentrator is a 1000X concentrating ratio with 0.6 x 0.6mm² triple junction cells. It efficiency is 29% with a 70% CTM. Finally, the loss chain study reveals that the three steps self-assembly process is reliable.

Made available in DSpace on 2016-06-02T19:53:32Z (GMT). No. of bitstreams: 1 PEREZ_MARTINEZ_Karim_2013.pdf: 1435441 bytes, checksum: dc4551ff55ece881790f51193596d2bd (MD5) Previous issue date: 2013-09-27 / Financiadora de Estudos e Projetos / This research deals with the production planning and scheduling problem in the molded pulp packing industry, studying particularly a plant of molded pulp packages for eggs. The production process can be subdivided into two processes: molding process and printing process. The main challenge for production planning activities is on the molding process, where products are produced through tooling that have several molds. These tooling are called "Molding Patterns" or " Conformation Patterns". Each one of the molding patterns can contain one, two, until three kind of molds, allowing to produce several products simultaneously. Producing several products at the time can generate large inventory for low demand products and also null inventory for high demand products. Thus, different inventory levels are defined for each product based on their demand behavior, in order to control inventory quantities. In this way, decisions related to the production planning and scheduling in this production process involve deciding which molding patterns should used, how much time they should be used, and how they should be sequenced. All these should be make taking into account a parallel machine system and sequenced-dependent setups time and costs, in order to minimize inventory and setups costs, as well as penalties associated to inventory out of the specified inventory levels of each product. To represent this problem we proposed two formulations: the first one based on the Capacitated Lot Sizing and Scheduling Problem (CLSP), and the second one based on the General Lot Sizing and Scheduling Problem (GLSP). The results from the models were compared in a set of real word instances of a plant, in order to check the adequacy to represent the decisions involved in the studied production process, as well as the main differences between their production plans and performance of the models. The proposed formulations were also adapted for a particular instance, in order to compare their productions plans against the production plan implement by the studied plant. Results show that the proposed models represent rightly decisions involved in the production planning and scheduling in the molded pulp. Furthermore, the solutions obtained by the proposed models represent production plans with costs significantly lower than the schedule implemented by a real plant in this kind of industry. / Este trabalho aborda o problema de planejamento e programação da produção na indústria de embalagens em polpa moldada, considerando particularmente uma fábrica de embalagens para acondicionamento de ovos. O processo de produção pode ser subdividido em dois processos: processo de moldagem e processo de estampagem. O principal desafio para as atividades de planejamento encontra-se no processo de moldagem, em que a obtenção dos produtos depende da utilização de diferentes ferramentais, formados por um conjunto de moldes. Estes ferramentais são chamados de padrões de conformação ou padrões de moldagem , e podem conter um, dois ou até três tipos de moldes, permitindo a produção simultânea de produtos diferentes. Esta produção simultânea de itens pode gerar grandes níveis de estoque de produtos de baixa demanda e estoques nulos para produtos de alta demanda, desta forma, são definidos diferentes níveis de estoque para cada produto com base no comportamento da sua demanda. As decisões envolvidas no planejamento e programação da produção neste tipo de processo envolve a escolha dos padrões de moldagem a serem utilizados, o tempo de produção de cada padrão, e a sequência em que estes devem ser programados, considerando um sistema de linhas paralelas idênticas e tempos e custos de preparação dependentes da sequência. Estas decisões devem ser definidas de modo a minimizar os custos de estocagem, preparação, e penalidades associadas ao desvio do volume do estoque em relação aos níveis estabelecidos para cada produto. Para representar o problema são propostas dois tipos de formulações: a primeira baseada no Problema de Dimensionamento de Lotes Capacitado (CLSP), e a segunda baseada no Problema de Dimensionamento e Sequenciamento de Lotes Geral (GLSP). Os resultados da resolução dos modelos são comparados com base em exemplares reais da fábrica em estudo, a fim de verificar sua adequação para representar as decisões envolvidas no sistema de produção, as principais diferenças nos planos de produção gerados, e o desempenho destes modelos. Os resultados obtidos demonstram que os modelos propostos representam adequadamente as decisões no sistema de produção estudado, e geram planos de produção significativamente melhores que os planos praticados pela fábrica.

Les dispositifs interconnectés moulés (« Molded Interconnected Devices », MID) sont constitués de supports polymères avec des pistes métalliques déposées à leur surface. Les objectifs de la thèse ont été d'optimiser les traitements de surface de polymères d'origine industrielle étudiés dans le contexte des MID pour obtenir des dépôts par métallisation electroless présentant une bonne adhérence. De plus, des procédés innovants de localisation de tels dépôts métalliques ont été développés. Durant ces travaux, la fonctionnalisation par plasma micro-ondes sous différentes atmosphères azotées et sous différentes conditions a été étudiée pour obtenir l'adsorption d'espèces palladiées (catalyseurs universels de la réaction de métallisation electroless). Des plans d'expériences ont été mis en oeuvre pour identifier un protocole type, développé sur PA12, pour obtenir des dépôts adhérents (Ni, Cu). Cette méthode a pu être globalement transposée avec succès sur d'autres polymères d'origine industrielle (ABS/PC, LCP). La seconde partie des travaux a consisté à développer des protocoles originaux basés sur des colloïdes de palladium directement synthétisés en surface d'un tampon en PDMS (lithographie douce) pour la réalisation de motifs métalliques par des procédés « top-down » et « bottomup ». Des analyses de surface AFM, SEM, TEM, XPS, ToF-SIMS et de mouillage ont permis de caractériser les différentes modifications de surface. Ces protocoles ont permis la réalisation de motifs métalliques MID adhérents jusqu'à 15 μm d'épaisseur et des motifs submicrométriques à haute résolution et haute densité avec des caractéristiques non encore obtenues à ce jour via cette technologie / Molded Interconnected Devices (MID) consist in polymer based substrates with metal tracks at their surface. The aim of this thesis was to optimize surface treatments applied to industrial polymers intended for MID applications, in order to obtain electroless metal coatings exhibiting a high practical adhesion. Furthermore, innovative processes to localize these metal coatings were developed. In this work, surface functionalization based on various operating parameters of microwave plasma using various nitrogen-based atmospheres were studied to obtain palladium (universal catalyst for electroless metallization) adsorption. Designs of experiments were used to identify an optimal set of parameters for PA12 surface treatment to obtain adherent metal coatings (Ni, Cu). These conditions were overall successfully transferred to other industrial polymers (ABS/PC, LCP). The second part of this work consisted in the development of innovative processes based on the use of palladium colloids directly synthetized at the surface of PDMS stamps (soft lithography) to achieve localized metallization using bottom-up and top-down approaches. AFM, SEM, TEM, XPS, ToF-SIMS and wettability measurements allowed to characterise the various surface modifications. These processes made possible 15 μm thick MID metal patterns with satisfactory practical adhesion as well as high resolution and high density sub-micrometric patterns with unseen properties for this technology

The heat generated in a circuit breaker can be transmitted in two ways: Either through metal parts of current path to conductors outside of device or through plastic parts or air of chassis. The accuracy of the simulation depends on the accuracy of the 3D model and all his parts and it also depends on precise definition of materials with precise definition of electrical and thermal parameters. Electrical circuit breaker has various source of the heat which results in raising temperature of the device above the level of environment. Heat sources are: 1) Joule’s loss of the circuit breaker current path. 2) Heat loss in a bimetal, which is used for thermal release. 3) Resistivity of contacts. This thesis deals with static state of thermal analysis so the sources do not include transient heat source for switching OFF and switching ON. Electrical circuit breakers are made in smaller and smaller forms however their electrical parameters are not decreasing with size. There is logical conclusion that there is more heat on the same unit size which makes thermal analysis of circuit breaker one of the most important part of development.

This master’s thesis is focused on calculation, simulation and experimental verification of electrodynamic forces acting upon movable contact piece of MCCB and experimental current carrying path. A short description of low voltage circuit breakers is briefly discussed in first chapter. Second chapter is focused upon contact system analysis of particular MCCB with thermomagnetic trigger. A hardness of contact materials is briefly described. A detailed analytical calculations were used to determine electrodynamic forces in MCCB. A FEM simulation in ANSYS Maxwell was carried out for comparison with analytical results. An experimental apparatus was designed and built for verification of constriction repulsion force, so called Holm’s force. A series of measurements is subsequently performed on proposed apparatus and results are compared with results from previous chapters.

No / The advances of the polymer melt flow-induced crystallization behaviour and its influence on mechanical properties of high density polyethylene (HDPE) in micron injection (MI) were studied in the present paper. Analysis of mechanical performance, including yield stress and elongation at break, for samples adopted from different regions in a molded plaque showed that a higher injection speed, a higher mold temperature and a longer cooling time could effectively enhance the yield stress but negatively promoted the ductility. Then, the mechanisms of such variation of mechanical performance and the factors affecting it were investigated by means of differential scanning calorimetry (DSC), scanning electron microscopy (SEM) and polarized light microscopy (PLM). The super high shear rate during cavity feeding in MI molding not only induced a typical three-layered structure but also developed a highly oriented fibrously morphological structure in the skin layer. However, such fully oriented morphology was much negative in the interlayer and even could not be observed in the core layer. The results from SEM and PLM observations indicated that the orientation morphology varied significantly through the plaque's cross-section and thickness of the each layer changed with the process parameters and geometric position, and finally led to variation of the mechanical performance.

In der Niederspannungstechnik werden die Anlagen zum Übertragen und Verteilen von Elektroenergie als Niederspannungs-Schaltgerätekombinationen bezeichnet. Die Anlagen sollen ihre Aufgaben möglichst wartungsfrei über einen Zeitraum von mehreren Jahrzehnten erfüllen. Damit ein langzeitstabiler Betrieb der Niederspannungs-Schaltgerätekombinationen möglich ist, müssen die Anlagen mindestens normgerecht thermisch dimensioniert sein. Um die Erwärmung von Niederspannungs-Schaltgerätekombinationen zuverlässig und effizient zu berechnen, wird in dieser Arbeit die Wärmenetzmethode genutzt. In der Wärmenetzmethode werden die Vorgänge der Erwärmung mit Hilfe von Wärmestromquellen, Temperaturquellen, Wärmewiderständen und Wärmekapazitäten nachgebildet. Einen wesentlichen Einfluss auf die Erwärmung einer Schaltgerätekombination haben die in den Wärmequellen der Anlage erzeugten Verlustleistungen. Die dominanten Wärmequellen (Hauptwärmequellen) innerhalb von Niederspannungs-Schaltgerätekombinationen werden in dieser Arbeit untersucht und die Ergebnisse in die Wärmenetzmethode integriert. Mit den Ergebnissen werdenmit Hilfe der Wärmenetzmethode die Erwärmungen verschiedener Betriebsmittel einer Niederspannungs-Schaltgerätekombination berechnet und anhand von Experimenten verifiziert. Die Wärmenetze der einzelnen Betriebsmittel werden zum Gesamt-Wärmenetz einer Niederspannungs-Schaltgerätekombination zusammengeschaltet. Die mit diesem Wärmenetz berechneten Temperaturen werden dann durch Experimente an der Versuchsanlage einer Niederspannungs-Schaltgerätekombination verifiziert. Eine der Hauptwärmequellen in Niederspannungs-Schaltgerätekombinationen sind die ohmschen Leitungsverluste in den Strombahnen der Hauptsammel- und Feldverteilerschienen. Bei Drehstrombelastung werden die hier in den einzelnen Teilleitern erzeugten Verlustleistungen durch die Stromverdrängung aufgrund des Skin- und den überlagerten Proximity-Effekts maßgeblich beeinflusst. Gegenüber einer Gleichstrombelastung unterscheiden sich die Verlustleistungen jedes einzelnen Teilleiters um den Leistungsfaktor k3~. Für Drehstromschienensysteme mit mehreren Teilleitern existieren bisher nur unzureichende Angaben zum Leistungsfaktor k3~ durch den Skin- und den Proximity-Effekt. In dieser Arbeit wurden FEM-Modelle aufgebaut, die Leistungsfaktoren k3~ für unterschiedliche Schienenanordnungen berechnet und anhand experimenteller Untersuchungen verifiziert. Weitere Hauptwärmequellen in Niederspannungs-Schaltgerätekombinationen sind die in den Anlagen eingebauten Betriebsmittel zum Schalten, Trennen und Schützen (z. B. Leistungsschalter, Trennschalter, Trenneinrichtungen, Sicherungen). Neben den Schaltkontakten selbst gehören die thermischen Schutzauslöser und Sicherungen zu den Hauptwärmequellen in den Strombahnen der Schaltgeräte. Um die Erwärmung der Geräte genau zu berechnen, müssen der Aufbau der Strombahnen und die Verteilung der Widerstände bekannt sein. Diese Widerstände können im Allgemeinen nur gemessen werden. Dabei hat sich zum einen gezeigt, dass die gemessenen Widerstände der Schaltkontakte von Kompaktleistungsschaltern auch im selben Gerät stark variieren können. Zum anderen sind die Widerstände der Schaltkontakte so dominant, dass in ihnen bis zu 47 % der gesamten Verlustleistungen eines Kompaktleistungsschalters entstehen können. Bedingt durch die zunehmende kompakte Bauweise der Anlagen erzeugen die Drehstromfelder der Sammelschienen hohe magnetische Feldstärken in umgebenden Metallteilen. In den Gehäusen, Einbauplatten, Wänden, Umhüllungen und Verkleidungen in Niederspannungs-Schaltgerätekombinationen können daher hohe Verlustleistungen entstehen, die maßgeblich die Erwärmung der Anlagen beeinflussen. Rechnerische und experimentelle Untersuchungen haben gezeigt, dass bei typischen Anordnungen von Schienen und Umhüllungen Verlustleistungen entstehen, die bis zu 32,7% der gesamten in der Versuchsanordnung gemessenen Verlustleistungen betragen. Sind die Ergebnisse der untersuchten Wärmequellen in die Wärmenetze der verschiedenen Betriebsmittel von Niederspannungs-Schaltgerätekombinationen integriert, ermöglichen die aufgebauten Wärmenetze die Berechnung von Temperaturen mit geringen Abweichungen (+4,4 K, -3,5 K) verglichen mit gemessenen Temperaturen. Mit den verifizierten und modularisierten Wärmenetzen der Betriebsmittel ist eine Möglichkeit geschaffen, Wärmenetze von Niederspannungs-Schaltgerätekombinationen effizient und wirtschaftlich aufzubauen.:1 Einleitung 1 2 Problemstellung 2 2.1 Stand der Technik / Ausgangssituation 2 2.2 Normen zur Erwärmung 3 2.3 Aufgabenstellung 5 2.4 Aufbau der Versuchsanlage 7 3 Grundlagen der Erwärmungsberechnung 11 3.1 Erzeugte Wärmeleistungen 11 3.2 Wärmeübertragung 17 3.3 Erwärmungsberechnung mit Wärmenetzen 39 4 Grundlagen zur Stromverdrängung 43 4.1 Stromdichteverteilung im Vollzylinder 43 4.2 Stromverdrängung und der Leistungsfaktor k 48 5 Untersuchungen zu den Wärmequellen 54 5.1 Stromwärmeverluste in den elektrischen Leiter von Sammel- und Feldverteilerschienen 57 5.2 Stromwärmeverluste in Schaltgeräten und zugehörigen Betriebsmitteln 90 5.3 Wirbelstrom- und Hystereseverluste in Metallteilen 105 6 Wärmenetze für die Betriebsmittel einer Niederspannungs- Schaltgerätekombination 126 7 Wärmenetz einer Niederspannungs-Schaltgerätekombination 148 8 Zusammenfassung und Ausblick 155 9 Literaturverzeichnis 158 10 Anhang 163 / In low-voltage engineering the systems for transmission and distribution of electric energy are named as low-voltage switchgear and controlgear assemblies. The systems have to perform their functions maintenance free as much as possible for a period of some decades. To achieve a long-time stable operation, the systems have to be designed thermally at least according to standards. In this thesis the thermal network method is used to calculate the heating of low-voltage switchgear and controlgear assemblies reliably and efficiently. The thermal network method simulates the processes of heating by heat sources, temperature sources thermal resistors and thermal capacities. The thermal power losses which are produced in the heat sources of the systems have significant influence on the heating of switchgear and controlgear assemblies. The dominant heat sources (main heat sources) within low-voltage switchgear and controlgear assemblies are researched at this thesis and the results are integrated to the thermal network method. The results are used to calculate the heating of various electrical components of a low-voltage switchgear and controlgear assembly using the thermal network method and verified by means of experiments. The thermal networks of the individual components are interconnected to form the overall thermal network of a low-voltage switchgear and controlgear assembly. The temperatures computed with this thermal network are then verified by experiments at the test setup of a low-voltage switchgear and controlgear assembly. In low-voltage switchgear and controlgear assemblies one of the main heat sources are the ohmic losses in the current paths of the main busbars and the distribution busbars. If the busbars are loaded with a three-phase current, the generated power losses of every individual subconductors are significantly influenced by the current displacement due to the skin effect and the superposed proximity effect. The power losses of each individual subconductor differ by the power factor k3~ compared to a DC load. For three-phase busbar systems with several subconductors there is only insufficient information on the power factor k3~ which takes into account the current displacement by the skin effect and the proximity effect. In this thesis, FEM models were developed to calculate the power factor k3~ for different busbar systems. The results were verified by experimental investigations. The installed electrical devices for switching, isolating and protection (e. g. circuit breakers, disconnectors, devices for disconnecting and fuses) are further main heat sources in low-voltage switchgear and controlgear assemblies. In addition to the main switching contacts themselves, thermal protection trips and the fuses are the main heat sources in the current paths of the switching devices. In order to calculate the heating of the electrical devices properly, the structure of the current paths and the distribution of the electrical resistances have to be known. In general these resistances can only determine by measuring. On one hand, it was found that the measured resistances vary widely even inside the same device. On the other hand, the resistances of the switching contacts are dominating, that up to 47 % of the entire power losses of a molded case circuit breaker can be generated there. Conditioned by the more and more compact design of the switchgears, the three-phase fields of the main busbars causes high magnetic fields at the surrounding metallic components. High power losses can therefore occur in housings, panels, walls, casings and enclosures in low-voltage switchgear and controlgear assemblies, which have a significant influence on the heating of the systems. Computational and experimental investigations have shown that typical arrangements of busbars and enclosures result in power losses of up to 32.7% of the total power losses measured in the test setup. If the results of the investigated heat sources are integrated into the networks of the various equipment of low-voltage switchgear and controlgear assemblies, the thermal networks set up enable the calculation of temperatures with small deviations (+4.4 K, -3.5 K) compared with measured temperatures. The verified and modularised thermal networks of the equipment provide an efficient and economical way of setting up heating networks of low-voltage switchgear and controlgear assemblies.:1 Einleitung 1 2 Problemstellung 2 2.1 Stand der Technik / Ausgangssituation 2 2.2 Normen zur Erwärmung 3 2.3 Aufgabenstellung 5 2.4 Aufbau der Versuchsanlage 7 3 Grundlagen der Erwärmungsberechnung 11 3.1 Erzeugte Wärmeleistungen 11 3.2 Wärmeübertragung 17 3.3 Erwärmungsberechnung mit Wärmenetzen 39 4 Grundlagen zur Stromverdrängung 43 4.1 Stromdichteverteilung im Vollzylinder 43 4.2 Stromverdrängung und der Leistungsfaktor k 48 5 Untersuchungen zu den Wärmequellen 54 5.1 Stromwärmeverluste in den elektrischen Leiter von Sammel- und Feldverteilerschienen 57 5.2 Stromwärmeverluste in Schaltgeräten und zugehörigen Betriebsmitteln 90 5.3 Wirbelstrom- und Hystereseverluste in Metallteilen 105 6 Wärmenetze für die Betriebsmittel einer Niederspannungs- Schaltgerätekombination 126 7 Wärmenetz einer Niederspannungs-Schaltgerätekombination 148 8 Zusammenfassung und Ausblick 155 9 Literaturverzeichnis 158 10 Anhang 163