Spelling suggestions: "subject:"multichannel""
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Automatic visual inspection of placement of bare dies in multichip modules /Chheda, Mahesh. January 1994 (has links)
Thesis (M.S.)--Rochester Institute of Technology, 1994. / Typescript. Includes bibliographical references (leaves 95-96).
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Design and fabrication of an underwater digital signal processor multichip module on low temperature cofired ceramic /Hayth-Perdue, Wendy, January 1994 (has links)
Thesis (M.S.)--Virginia Polytechnic Institute and State University, 1994. / Vita. Abstract. Includes bibliographical references (leaves 57-58). Also available via the Internet.
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New organic materials for microelectronics applicationsWright-Williams, Lorna M. 08 1900 (has links)
No description available.
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A fault detection and diagnosis technique for multi-chip module interconnectsKim, Bruce Chang-Shik 05 1900 (has links)
No description available.
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Design for testability techniques and optimization algorithms for performance and functional testing of mult-chip module interconnectionsPendurkar, Rajesh 05 1900 (has links)
No description available.
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Electrical characterization of a multilayer low temperature co-fireable ceramic multichip module /Barton, Cecil Edward, January 1994 (has links)
Thesis (M.S.)--Virginia Polytechnic Institute and State University, 1994. / Vita. Abstract. Includes bibliographical references (leaves 84-86). Also available via the Internet.
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Parallel test techniques for multi-chip modulesSasidhar, Koppolu 08 1900 (has links)
No description available.
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System-in-package a system level investigation for package reliability /Saiyed, Mohammed Shafi. January 2005 (has links)
Thesis (Ph. D.)--State University of New York at Binghamton, Department of System Science and Industrial Engineering, 2005. / Includes bibliographical references.
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Design and simulation of a multichip module /Nazareth, Mathew B. January 1994 (has links)
Thesis (M.S.)--Rochester Institute of Technology, 1994. / Typescript. Includes bibliographical references (leaves 103-104).
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Toward a comprehensive cost model for multichip module (MCM) manufacturingPierce, Daniel W. 12 1900 (has links)
No description available.
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