Global ETD Search

11	Analysis of high density interconnect alternatives in multichip module packaging using the analytic hierarchy process / Grau, Peter F. January 1993 (has links) Report (M.S.)--Virginia Polytechnic Institute and State University. M.S. 1993. / Vita. Abstract. Includes bibliographical references (leaves 50-51). Also available via the Internet.
12	A systems approach to ultra-fine pitch flip chip interconnect packaging Nagarkar, Kaustubh Ravindra. January 2005 (has links) Thesis (Ph. D.)--State University of New York at Binghamton, Systems Science, 2005. / Includes bibliographical references.
13	3D packaging of multi-stacked flip chips with plugged through silicon vias for vertical interconnection / Hon, Chi Kwong. January 2006 (has links) Thesis (M.Phil.)--Hong Kong University of Science and Technology, 2006. / Includes bibliographical references (leaves 97-107). Also available in electronic version.
14	Matrix-addressable III-nitride light emitting diode arrays on silicon substrates by flip-chip technology / Keung, Chi Wing. January 2007 (has links) Thesis (M.Phil.)--Hong Kong University of Science and Technology, 2007. / Includes bibliographical references (leaves 64-69). Also available in electronic version.
15	Design and fabrication of a flip-chip-on-chip multi-chip module with 3D packaging structure and through-silicon-via for underfill dispensing / Tsui, Yat Kit. January 2004 (has links) Thesis (M. Phil.)--Hong Kong University of Science and Technology, 2004. / Includes bibliographical references (leaves 116-127). Also available in electronic version. Access restricted to campus users.
16	Electromagnetic modeling of interconnections in three-dimensional integration Han, Ki Jin. January 2009 (has links) Thesis (Ph.D)--Electrical and Computer Engineering, Georgia Institute of Technology, 2009. / Committee Chair: Madhavan Swaminathan; Committee Member: Andrew E. Peterson; Committee Member: Emmanouil M. Tentzeris; Committee Member: Hao-Min Zhou; Committee Member: Saibal Mukhopadhyay. Part of the SMARTech Electronic Thesis and Dissertation Collection.
17	Experimental study of void formation in solder joints of flip-chip assemblies Wang, Daijiao, 1970- 28 August 2008 (has links) Not available / text Welded joints Solder and soldering Multichip modules (Microelectronics)
18	Substrate-film interaction in noble metal/polymer multichip modules Hodge, Thomas C. 05 1900 (has links) No description available. Multichip modules (Microelectronics) Precious metals Polymers
19	Logic and algorithm partitioning Khan, Shoab Ahmad 12 1900 (has links) No description available. Algorithms
20	Strategies for realization of integrated microelectromechanical systems : on-board power, silicon circuitry, multichip modules Lee, Jeong-Bong 08 1900 (has links) No description available. Integrated circuits Microelectronics Multichip modules (Microelectronics)

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