Spelling suggestions: "subject:"multichannel""
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Modeling, optimization, and control of via formation by photosensitive polymers for MCM-D applicationsKim, Tae Seon 12 1900 (has links)
No description available.
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Design of normal-incidence waveguide-imbedded phase gratings for optical interconnects in multi-chip modulesJones, Mark Lehi 12 1900 (has links)
No description available.
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Study of warpage of base substrates and materials for large-area MCM-D packagingDang, Anh Xuan-Hung 12 1900 (has links)
No description available.
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Processing of low permittivity silica thin filmsKokan, Julie Runyan 12 1900 (has links)
No description available.
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Thermal management of small scale electronic systemsDesai, Anand Hasmukh. January 2006 (has links)
Thesis (Ph. D.)--State University of New York at Binghamton, Department of Mechanical Engineering, 2006. / Includes bibliographical references (leaves 163-164).
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A timing-driven multi-way partiioning system for integrated circuits and multi-chip systems /Roy, Kalapi. January 1994 (has links)
Thesis (Ph. D.)--University of Washington, 1994. / Vita. Includes bibliographical references (leaves [160]-175).
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Capacity requirements planning of multichip modules through simulationDasalla, Kathryn Anne. January 2007 (has links)
Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Systems Science and Industrial Engineering, 2007. / Includes bibliographical references.
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Experimental study of void formation in solder joints of flip-chip assembliesWang, Daijiao, Panton, Ronald L. January 2005 (has links) (PDF)
Thesis (Ph. D.)--University of Texas at Austin, 2005. / Supervisor: Ronald L. Panton. Vita. Includes bibliographical references.
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Properties and selection of materials for flip chip packages with low-K die /Tang, Chi Wang. January 2007 (has links)
Thesis (M.Phil.)--Hong Kong University of Science and Technology, 2007. / Includes bibliographical references (leaves 94-97). Also available in electronic version.
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Analysis of high density interconnect alternatives in multichip module packaging using the analytic hierarchy processGrau, Peter F. 17 March 2010 (has links)
<p>Packaging of high density integrated circuits offers many
challenges in the electronics industry today. Advanced requirements
for high performance computing are starting to take advantage of
multichip modules that are smaller in size and weight, use less energy,
and cost less than prior technologies. This project and report provides
a summary of the processes of multichip module packaging and
describes some of the companies and their technologies currently
involved in the industry today. An advanced computer system is
proposed that would require a high density multichlp module. Functional
requirements and performance specifications are identified for the
system.</p>
<p>
Many design decisions are required to determine the best
integrated circuit package for the system, with trade-off analysis being
key in the selection process. One comparative analysis worthy of study
is the evaluation of high density interconnection alternatives.
Two technologies of multichip module designs are compared using
the Analytic Hierarchy Process. Main attributes of the alternatives are
chosen that are key to thp design and have significant differences. The
attributes are defined in detail and weighted based on their importance
to the model. Performance data is also used in the comparisons of
alternatives.</p>
<p>
A spreadsheet program was developed to quickly enter the
weighted values and performance data, perform the matrix calculations,
and determine the final rankings of the alternatives. Sensitivity analysis
was then applied to determine what effect a change in the value of a
particular attribute had on the outcome of the rankings. Results of the
sensitivity analysis for key attributes are graphically plotted.</p> / Master of Science
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