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  • About
  • The Global ETD Search service is a free service for researchers to find electronic theses and dissertations. This service is provided by the Networked Digital Library of Theses and Dissertations.
    Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.
21

Modeling, optimization, and control of via formation by photosensitive polymers for MCM-D applications

Kim, Tae Seon 12 1900 (has links)
No description available.
22

Design of normal-incidence waveguide-imbedded phase gratings for optical interconnects in multi-chip modules

Jones, Mark Lehi 12 1900 (has links)
No description available.
23

Study of warpage of base substrates and materials for large-area MCM-D packaging

Dang, Anh Xuan-Hung 12 1900 (has links)
No description available.
24

Processing of low permittivity silica thin films

Kokan, Julie Runyan 12 1900 (has links)
No description available.
25

Thermal management of small scale electronic systems

Desai, Anand Hasmukh. January 2006 (has links)
Thesis (Ph. D.)--State University of New York at Binghamton, Department of Mechanical Engineering, 2006. / Includes bibliographical references (leaves 163-164).
26

A timing-driven multi-way partiioning system for integrated circuits and multi-chip systems /

Roy, Kalapi. January 1994 (has links)
Thesis (Ph. D.)--University of Washington, 1994. / Vita. Includes bibliographical references (leaves [160]-175).
27

Capacity requirements planning of multichip modules through simulation

Dasalla, Kathryn Anne. January 2007 (has links)
Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Systems Science and Industrial Engineering, 2007. / Includes bibliographical references.
28

Experimental study of void formation in solder joints of flip-chip assemblies

Wang, Daijiao, Panton, Ronald L. January 2005 (has links) (PDF)
Thesis (Ph. D.)--University of Texas at Austin, 2005. / Supervisor: Ronald L. Panton. Vita. Includes bibliographical references.
29

Properties and selection of materials for flip chip packages with low-K die /

Tang, Chi Wang. January 2007 (has links)
Thesis (M.Phil.)--Hong Kong University of Science and Technology, 2007. / Includes bibliographical references (leaves 94-97). Also available in electronic version.
30

Analysis of high density interconnect alternatives in multichip module packaging using the analytic hierarchy process

Grau, Peter F. 17 March 2010 (has links)
<p>Packaging of high density integrated circuits offers many challenges in the electronics industry today. Advanced requirements for high performance computing are starting to take advantage of multichip modules that are smaller in size and weight, use less energy, and cost less than prior technologies. This project and report provides a summary of the processes of multichip module packaging and describes some of the companies and their technologies currently involved in the industry today. An advanced computer system is proposed that would require a high density multichlp module. Functional requirements and performance specifications are identified for the system.</p> <p> Many design decisions are required to determine the best integrated circuit package for the system, with trade-off analysis being key in the selection process. One comparative analysis worthy of study is the evaluation of high density interconnection alternatives. Two technologies of multichip module designs are compared using the Analytic Hierarchy Process. Main attributes of the alternatives are chosen that are key to thp design and have significant differences. The attributes are defined in detail and weighted based on their importance to the model. Performance data is also used in the comparisons of alternatives.</p> <p> A spreadsheet program was developed to quickly enter the weighted values and performance data, perform the matrix calculations, and determine the final rankings of the alternatives. Sensitivity analysis was then applied to determine what effect a change in the value of a particular attribute had on the outcome of the rankings. Results of the sensitivity analysis for key attributes are graphically plotted.</p> / Master of Science

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