The first topic of this thesis is a cell-based design solution of 4¡Ñ8 scanning decoder using RC5 protocol for DECT handsets. It is a keypad scanner ASIC without any embedded microprocessor nor internal ROMs. The keypad scanner uses RC5 transfer protocol which is compatible with remote control and wireless handsets. The keypad scanner built in the handsets must meet the requirement of low power consumption and small die size to avoid shortening the battery lift and increasing chip cost. The proposed ASIC design possesses both of the required advantages. The second topic is a high-performance SRAM using current sense amplifier. Current sensing in SRAMs is very promising method to achieve high speed operations in low-voltage applications. This topic present a current sense amplifier circuit as well as its simulation results.

Sense amplifiers are important circuit components of a dynamic random access memory (DRAM), which forms the main memory of digital computers. The ability of the sense amplifier to detect and amplify voltage signals to correctly interpret data in DRAM cells cannot be understated. The sense amplifier plays a significant role in the overall speed of the DRAM. Sense amplifiers require matched transistors for optimal performance. Hence, the effects of mismatch through process variations must be minimized. This thesis presents a research which leads to optimal nanoscale CMOS sense amplifiers by incorporating the effects of process variation early in the design process. The effects of process variation on the performance of a standard voltage sense amplifier, which is used in conventional DRAMs, is studied. Parametric analysis is performed through circuit simulations to investigate which parameters have the most impact on the performance of the sense amplifier. The figures-of-merit (FoMs) used to characterize the circuit are the precharge time, power dissipation, sense delay and sense margin. Statistical analysis is also performed to study the impact of process variations on each FoM. By analyzing the results from the statistical study, a method is presented to select parameter values that minimize the effects of process variation. A design flow algorithm incorporating dual oxide and dual threshold voltage based techniques is used to optimize the FoMs for the sense amplifier. Experimental results prove that the proposed approach improves precharge time by 83.9%, sense delay by 80.2% sense margin by 61.9%, and power dissipation by 13.1%.

De nos jours, la conception des systèmes sur puce devient de plus en plus complexe, et requiert des densités de mémoire sans cesse grandissantes. Pour ce faire, une forte miniaturisation des nœuds technologiques s’opère. Les mémoires non-volatiles résistives, tels que les RRAM, PC-RAM ou MRAM se présentent comme des alternatives technologiques afin d'assurer à la fois une densité suffisante et des faibles contraintes en surface, en latence, et en consommation à l’échelle nanométrique. Cependant, la variabilité croissante de ces cellules mémoires ainsi que des circuits en périphérie, tels que des circuits de lecture, est un problème majeur à prendre en considération. Cette thèse consiste en une étude détaillée et une aide à la compréhension de la problématique de variabilité appliquée aux circuits de lecture pour mémoires résistives. Elle propose des solutions d’amélioration de la fiabilité de lecture de ces mémoires. Pour ce faire, diverses études ont été réalisées : revue générale des solutions existantes d’amélioration du rendement de lecture, au niveau circuit et système ; développement d’un modèle statistique évaluant la contribution à la marge de lecture de la variabilité de chaque composante du chemin de lecture de la mémoire résistive ; analyse, caractérisation, modélisation et optimisation de l’offset d’un amplificateur de lecture dynamique pour mémoires résistives ; proposition d’architecture d’amplificateur de lecture permettant un rapport signal à offset optimum. / Nowadays, Systems on chip (SoCs) conception is becoming more and more complex and demand an ever-increasing amount of memory capacity. This leads to aggressive bit cell technology scaling. Nonvolatile resistive memories (PC-RAM, RRAM, MRAM) are promising technologic alternatives to ensure both high density, low power consumption, low area and low latencies. However, scaling lead to significant memory cell and/or memory periphery variability. This thesis aims to address variability issues in read circuitries of resistive memories and propose solutions for read yield enhancement of these memories. To this end, several sub-studies were achieved: overall review of the existing solutions for read yield enhancement, at both circuit and system level; development of a statistical model evaluating the contributions to read margin of the variability of each component of the resistive memory sensing path; analysis, characterization modelling and optimization of the offset of one particular dynamic sense amplifier for resistive memories; proposal of a sense amplifier architecture that features an optimum signal to offset ratio.

The ever expanding range of applications for embedded systems continues to offer new challenges (and opportunities) to chip manufacturers. Applications ranging from exciting high resolution gaming to routine tasks like temperature control need to be supported on increasingly small devices with shrinking dimensions and tighter energy budgets. These systems benefit greatly by having the capability to operate over a wide range of supply voltages, known as ultra dynamic voltage scaling (U-DVS). This refers to systems capable of operating from nominal voltages down to sub-threshold voltages. Memories play an important role in these systems with future chips estimated to have over 80% of chip area occupied by memories. This thesis presents the design and characterization of an ultra dynamic voltage scalable memory (SRAM) that functions from nominal voltages down to sub-threshold voltages without the need for external support. The key contributions of the thesis are as follows: 1) A variation tolerant reference generation for single ended sensing: We present a reference generator, for U-DVS memories, that tracks the memory over a wide range of voltages and is tunable to allow functioning down to sub-threshold voltages. Replica columns are used to generate the reference voltage which allows the technique to track slow changes such as temperature and aging. A few configurable cells in the replica column are found to be sufficient to cover the whole range of voltages of interest. The use of tunable delay line to generate timing is shown to help in overcoming the effects of process variations. 2) Random-sampling based tuning algorithm: Tuning is necessary to overcome the in-creased effects of variation at lower voltages. We present an random-sampling based BIST tuning algorithm that significantly speed-up the tuning ensuring that the time required to tune is comparable to a single MBIST algorithm. Further, the use of redundancy after delay tuning enables maximum utilization of redundancy infrastructure to reduce power consumption and enhance performance. 3) Testing and Characterization for U-DVS systems: Testing and characterization is an important challenge in U-DVS systems that have remained largely unexplored. We propose an iterative technique that allows realization of an on-chip oscilloscope with minimal area overhead. The all digital nature of the technique makes it simple to design and implement across technology nodes. Combining the proposed techniques allows the designed 4 Kb SRAM array to function from 1.2 V down to 310 mV with reads functioning down to 190 mV. This would contribute towards moving ultra wide voltage operation a step closer towards implementation in commercial designs.

On-chip impedance tuning is used to overcome IC perturbations caused by packaging stress. Tuning is more important for matching networks of radio frequency (RF) systems. Possible package resonance and fabrication process variations may cause instability, which is a major problem in RF systems. Thus, precautions need to be taken in order to maintain the overall stability of components and the final system itself. Electrically erasable programmable read-only memory switches (EEPROMs) occupy less die area compared to e-fuses and microelectromechanical system (MEMS) switches, thus EEPROMs are proposed to be used as tuning switches in millimetre-wave (mm-wave) applications. It is anticipated that EEPROM switches will also enable multi-time programming because of the smaller area and the fact that more switches can be used for fine-tuning. The problem addressed in this research is how suitable EEPROMs are for switching applications in the mm-wave region. The main focus of this dissertation is to characterise the suitability of EEPROM switches qualitatively for tuning with systems operating in the mm-wave spectrum. 130 nm SiGe BiCMOS IBM 8HP process technology was used for simulation and the fabricated prototypes. The Dickson charge pump (CP), two voltage doubler CPs and four floating gate (FG) devices were investigated. Literature and theoretical verification was done using computer aided design (CAD) Cadence software through circuit analysis and the layouts were also designed for integrated circuit (IC) prototype fabrication. The qualitative evaluation of the hypothesis was based on investigating reliability issues, switching characteristics, CP output drive capability and mm-wave characterisation. The maximum measured drain current for FGs was 1.4 mA, 2.7 mA and 3 mA for devices 2, 3 and 4, respectively. The ratio between ON state switching current (after tunnelling) and OFF state switching current (after injection) was 1.5, 1.35 and 6 for devices 2, 3 and 4, respectively. The ratios correlated with the expected results in terms of FG transistor area: a high area results in a higher ratio. Despite the correlation, devices 2 and 3 may be unsuitable because the ratio is less than 2: a smaller ratio between the ON and OFF states could also result in higher losses. The Dickson CP achieved an output voltage of 2.96 V from an input of 1.2 V compared to 3.08 V as computed from the theoretical analysis and 4.5 V from the simulation results. The prototypes of the voltage doubler CP did not perform as expected: a maximum of 1 V was achieved compared to 4.1 – 5 V as in the simulation results. The suitability of FG devices for switching applications depends on the ratio of the ON and OFF states (associated to insertion and isolation losses): the larger the FG transistor area, the higher the ratio. The reliability issues are dominated by the oxide thickness of the transistor, which contributes to charge leakages and charge trapping: smaller transistor length causes more uncertainties. Charge trapping in the oxide increases the probability of leakages and substrate conduction, thus introduces more losses. Based on the findings of this research work, the FG devices promise to be suitable for mm-wave switching applications and there is a need for further research investigation to characterise the devices in the mm-wave region fully. AFRIKAANS : Impedansie-instelling op skyf word gebruik om steurings in geïntegreerde stroombane wat deur verpakkingstres veroorsaak word, te oorkom. Instelling is meer belangrik om netwerke van radiofrekwensiesisteme te paar. Moontlike verpakkingresonansie en variasies in die vervaardigingsproses kan onstabiliteit veroorsaak, wat ‟n groot probleem is in radiofrekwensiesisteme. Voorsorg moet dus getref word om die oorhoofse stabiliteit van komponente en die finale sisteem self te handhaaf. Elektries uitveebare programmeerbare slegs-lees-geheueskakelaars (EEPROMs) neem minder matrysarea op as e-sekerings en die sekerings van mikro-elektromeganiese sisteme en word dus voorgestel vir gebruik as instellingskakelaars in millimetergolfaanwendings. Daar word verwag dat EEPROM-skakelaars ook multi-tydprogrammering sal moontlik maak as gevolg van die kleiner area en die feit dat meer skakelaars gebruik kan word vir fyn instellings. Die probleem wat in hierdie navorsing aandag geniet, is die geskiktheid van EEPROMS vir skakelaanwendings in die millimetergolfstreek. The hooffokus van die verhandeling is om die geskiktheid van EEPROM-skakelaars kwalitatief te karakteriseer vir instelling met sisteme wat in die millimetergolfspektrum funksioneer. Department of Electrical, Electronic and Computer Engineering v University of Pretoria 130 nm SiGe BiCMOS IBM 8HP-prosestegnologie is gebruik vir simulasie en die vervaardigde prototipes. Die Dickson-laaipomp is gebruik vir simulasie en die vervaardigde prototipes. Die Dickson-laaipomp, twee spanningverdubbelinglaaipompe en vier swewendehektoestelle is ondersoek. Literatuur- en teoretiese verifikasie is gedoen met behulp van rekenaarondersteunde-ontwerp (CAD) Cadence-sagteware deur stroombaananalise en die uitleg is ook ontwerp vir die vervaardiging van geïntegreerdestroombaanprototipes. Die kwalitatiewe evaluasie van die hipotese is gebaseer op die ondersoek van betroubaarheidkwessies, skakelingeienskappe, laaipompuitsetdryfvermoë en millimetergolfkarakterisering. Die maksimum gemete dreineerstroom vir swewende hekke was 1.4 mA, 2.7 mA en 3 mA vir onderskeidelik toestelle 2, 3 en 4. Die verhouding tussen die AAN-toestand van die skakelstroom (na tonnelling) en die AF-toestand van die skakelstroom (na inspuiting) was 1.5, 1.35 en 6 vir toestelle 2, 3 en 4, onderskeidelik. Die verhoudings het ooreengestem met die verwagte resultate rakende die swewendehek-transistorareas: ‟n groot area het ‟n hoër verhouding tot gevolg. Nieteenstaande die ooreenstemming, mag toestelle 2 en 3 moontlik nie geskik wees nie, omdat die verhouding kleiner as 2 is: ‟n kleiner verhouding tussen die AAN- en AF-toestande mag ook hoër verliese tot gevolg hê. Die Dickson-laaipomp het ‟n uitsetspanning van 2.96 V vanaf ‟n inset van 1.2 V vergeleke met 3.08 V soos bereken volgens die teoretiese analise en 4.5 V volgens die simulasieresultate. Die prototipes van die spanningverdubbelinglaaipomp het nie gefunksioneer soos verwag is nie: ‟n maksimum van 1 V is bereik vergeleke met 4.1 – 5 V soos in die simulasieresultate. Die geskiktheid van swewendehektoestelle vir skakelingtoepassings hang af van die verhouding van die AAN- en AF-toestande (wat met invoer-en isolasieverlies geassosieer word): hoe groter die swewendehektransistorarea, hoe hoër die verhouding. Die betroubaarheidkwessies word oorheers deur die oksieddikte van die transistor, wat bydra tot ladinglekkasies en ladingvasvangs: korter transistorlengte veroorsaak meer onsekerheid. Ladingvasvangs in die oksied verhoog die moontlikheid van lekkasies en substraatgeleiding en veroorsaak dus groter verlies. Die bevindings van hierdie navorsing toon dat swewendehektoestelle waarskynlik geskik is vir millimetergolfaanwendings en verdere navorsing is nodig om die toestelle volledig in die millimetergolfstreek te karakteriseer. Copyright / Dissertation (MEng)--University of Pretoria, 2013. / Electrical, Electronic and Computer Engineering / unrestricted