NDLTD Global ETD Search
  • Refine Query
  • Source
  • Publication year
  • to
  • Language
  • 141
  • 43
  • 26
  • 17
  • 13
  • 9
  • 8
  • 1
  • 1
  • 1
  • 1
  • 1
  • 1
  • 1
  • 1
  • Tagged with
  • 313
  • 137
  • 98
  • 96
  • 67
  • 54
  • 52
  • 51
  • 46
  • 45
  • 34
  • 33
  • 32
  • 28
  • 28
  • About
  • The Global ETD Search service is a free service for researchers to find electronic theses and dissertations. This service is provided by the Networked Digital Library of Theses and Dissertations.
    Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.

Search results

Showing 111 to 120 of 313 (0.042 seconds)
111

Thermal cycling and rate-dependent stress relaxation behavior of solders

Woodmansee, Michael W. 08 1900 (has links)
No description available.
Deformations (Mechanics)
Solder and soldering Testing
Materials Mechanical properties
112

Analysis of lead free tin-silver-copper and tin-lead solder wetting reactions

Anson, Scott J. January 2007 (has links)
Thesis (Ph. D.)--State University of New York at Binghamton, Dept. of Systems Science and Industrial Engineering, 2007. / Includes bibliographical references.
113

Solder paste inspection based on phase shift profilometry

Hui, Tak-wai. January 2007 (has links)
Thesis (M. Phil.)--University of Hong Kong, 2008. / Also available in print.
114

Mechanical properties and microstructure invesitigation of SN-AG-CU lead free solder for electronic package applications

Wang, Qing, Johnson, R. Wayne, Gale, W. F. January 2005 (has links) (PDF)
Dissertation (Ph.D.)--Auburn University, 2005. / Abstract. Vita. Includes bibliographic references.
115

PBGA reliability of lead free solder balls assembled with tin lead solder paste for harsh environment electronics

Mitchell, Charles Clayton, January 2006 (has links) (PDF)
Thesis(M.S.)--Auburn University, 2006. / Abstract. Vita. Includes bibliographic references.
116

Monitoring and control system for hot air solder leveling process /

Schuh, Amy Jeanne, January 1991 (has links)
Report (M.S.)--Virginia Polytechnic Institute and State University. M.S. 1991. / Vita. Abstract. Includes bibliographical references (leaf 105). Also available via the Internet.
117

Development of convective reflow-projection moire warpage measurement system and prediction of solder bump reliability on board assemblies affected by warpage

Tan, Wei. January 2008 (has links)
Thesis (Ph. D.)--Mechanical Engineering, Georgia Institute of Technology, 2008. / Committee Chair: Dr. Ume, I. Charles; Committee Member: Dr. Book, Wayne; Committee Member: Dr. Kim, Yeong; Committee Member: Dr. Pan, Jiahui; Committee Member: Dr. Sitaraman, Suresh; Committee Member: Dr. Wu, C. F. Jeff.
118

Soldering in magnesium high pressure die casting and its preservation by surface engineering

Tang, Caixian. January 2007 (has links)
Thesis (PhD) - Swinburne University of Technology, Industrial Research Institute Swinburne - 2007. / [A thesis submitted] for the degree of Doctor of Philosophy, Industrial Research Institute, Swinburne University of Technology - 2007. Typescript. Includes bibliographical references (p. 154-167).
119

Prognostics health management and damage relationships of lead-free components in thermal cycling harsh environments

Madhura Hande, Handattu, Lall, Pradeep, January 2008 (has links)
Thesis--Auburn University, 2008. / Abstract. Vita. Includes bibliographical references (leaves 159-167).
120

Heterogeneous nucleation of Sn in Sn-Ag-Cu solder joints

Benedict, Michael Scott. January 2007 (has links)
Thesis (M.S.)--State University of New York at Binghamton, Program of Materials Science and Engineering, 2007. / Includes bibliographical references.

Page generated in 0.0489 seconds