This thesis examines melting in superheated silicon films in contact with SiO₂ under pulsed laser irradiation. An excimer-laser pulse was employed to induce heating of the film by irradiating the film through the transparent fused-quartz substrate such that most of the beam energy was deposited near the bottom Si-SiO₂ interface. Melting dynamics were probed via in situ transient reflectance measurements. The temperature profile was estimated computationally by incorporating temperature- and phase-dependent physical parameters and the time-dependent intensity profile of the incident excimer-laser beam obtained from the experiments. The results indicate that a significant degree of superheating occurred in the subsurface region of the film. Surface-initiated melting was observed in spite of the internal heating scheme, which resulted in the film being substantially hotter at and near the bottom Si-SiO₂ interface. By considering that the surface melts at the equilibrium melting point, the solid-phase-only heat-flow analysis estimates that the bottom Si-SiO₂ interface can be superheated by at least 220K during excimer-laser irradiation. It was found that at higher laser fluences (i.e., at higher temperatures), melting can be triggered internally. At heating rates of 10¹⁰ K/s, melting was observed to initiate at or near the (100)-oriented Si-SiO₂ interface at temperatures estimated to be over 300K above the equilibrium melting point. Based on theoretical considerations, it was deduced that melting in the superheated solid initiated via a nucleation and growth process. Nucleation rates were estimated from the experimental data using Johnson-Mehl-Avrami-Kolmogorov (JMAK) analysis. Interpretation of the results using classical nucleation theory suggests that nucleation of the liquid phase occurred via the heterogeneous mechanism along the Si-SiO₂ interface.

Delamination along thin film interfaces is a prevalent failure mechanism in microelectronic, photonic, MEMS, and other engineering applications. Current interfacial fracture test techniques specific to thin films are limited by either sophisticated mechanical fixturing, physical contact near the crack tip, non-representative test specimens, or complicated stress fields. Moreover, these techniques are generally not suitable for investigating fatigue crack propagation under cyclical loading. A fixtureless and noncontact experimental test technique is thus proposed and implemented to study interfacial fracture for thin film systems. The proposed test incorporates permanent magnets surface mounted onto micro-fabricated released thin film structures. An applied external magnetic field induces noncontact monotonic or fatigue loading to initiate delamination along the interface between the thin film and underlying substrate. Characterization of the film deflection, peel angle, and delamination propagation is accomplished through in situ optical techniques. Analytical and finite-element models are used to extract fracture parameters from the experimental data using thin-film peel mechanics. The developed interfacial fracture test has been demonstrated for Cu thin films on a SiO₂/Si substrate.

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In this dissertation, a carbon nanotube thin-film transistor is fabricated on a flexible substrate. Combined printing and stamping techniques are used for the fabrication. An ink-jet printing technique is used to form the gate, source, and drain electrodes as well as the dielectric layer. A self aligned carbon nanotube (CNT) thin film is formed by using a new modified dip coat technique before being transferred to the device substrate. This novel modified dip-coat technique utilizes the capillary effect of a liquid solution rising between gaps to coat CNT solution on a large area of the substrate while consuming minimal CNT solution. Several key solutions are addressed to solve the fabrication problems. (1) The source/drain contact with the CNT channel is developed by using droplets of silver ink printed on the source/drain areas prior to applying CNT thin. The wet silver ink droplets allow the silver to "wet" the CNT thin-film area and enable good contact with the source and drain contact after annealing. (2) A passivation layer to protect the device channel is developed by bonding a thin Kapton film on top of the device channel. This thin Kapton film is also used as the media for transferring the aligned CNT thin-film on the device substrate. Using this technique, printing the passivation layer can be avoided, and it prevents the inter-diffusion of the liquid dielectric into the CNT porous thin-film. (3) A simple and cost effective technique to form multilayer metal interconnections on flexible substrate is developed and demonstrated. Contact vias are formed on the second substrate prior bonding on the first substrate. Ink-jet printing is used to fill the silver ink into the via structure. The printed silver ink penetrates through the vias to contact with the contact pads on the on the bottom layer, followed by an anneal process. High drain current of 0.476mA was obtained when V[subscript G]= -3V and source-drain voltage (V[subscript DS]) was -1.5V. A bending test was performed on the CNT TFT showing less than a 10% variation in performance. A bending test was also performed on via structures, which yielded less than a 5% change in resistance. The developed CNT TFT is used to form a switch in a phase shifter for a flexible phased-array antenna (PAA). Four element 1-dimensional and 2-dimensional phased-array antennae are fabricated and characterized. Multilayer metal interconnects were used to make a complete PAA system. For a 2-bit 1x4 PAA system, by controlling the ON/OFF states of the transistors, beam steering of a 5.3GHz signal from 0° to -27° has been demonstrated. The antenna system also shows good stability and tolerance under different bending radii of curvature. A 2-bit 2x2 PAA system was also fabricated and demonstrated. Two dimensional beam steering of a 5.2GHz signal at an angle of [theta]=20.7° and [phi]=45° has been demonstrated. The total efficiency of the 1-dimensional and 2-dimensional PAA systems are 42% and 46%, respectively. / text

Solid oxide fuel cells (SOFCs) are very attractive as energy generation devices because they are clean, reliable, and almost entirely pollution-free. SOFCs have flexible fuel selections compared with other fuel cell technologies. The main disadvantage of SOFCs is their high operating temperature (~1000ºC for conventional SOFCs) which leads to cell cracking and formation of non-conducting compounds at electrolyte/electrode interfaces. Therefore, intermediate temperature SOFCs (ITSOFCs) in the range of 500-700 ºC has attracted extensive research interests. To achieve high cell performance at reduced temperatures, it requires high-catalytic activity, high ionic conductivity, and comparable thermal expansion coefficient (TEC) of the cell components. To address the above issues, the research focuses on two main approaches (i.e., the interlayer approach and the electrolyte approach) in order to improve the overall cell performance. First, the design of a thin layer of a vertically-aligned nanocomposite (VAN) structure as an interlayer between the electrolyte and cathode is demonstrated. The development of the VAN structures consisted of the cathode material as a perovskite or ordered double perovskite structure, La0.5Sr0.5CoO3 (LSCO) or PrBaCo2O5 delta (PBCO), and the electrolyte material as a fluorite structure, Ce0.9Gd0.1O1.95 (CGO or GDC), were achieved for thin film solid oxide fuel cell (TFSOFCs). The VAN structure significantly improves the overall performance of the TFSOFC by increasing the interfacial area between the electrolyte and cathode and also acts as a transition layer that improves adhesion and relieves both thermal stress and lattice strain. Second, microstructural and electrical properties of Gd-doped CeO2 (GDC, Ce0.9Gd0.1O1.95) thin films electrolyte are studied for intermediate temperature solid oxide fuel cells (SOFCs). The GDC thin film electrolytes with different grain sizes and grain morphologies were prepared by varying the deposition parameters such as substrate temperature, oxygen partial pressure, target repetition rate, and laser ablation energy. The electrical property of the GDC thin film is strongly affected by the grain size. Third, bilayer electrolytes composed of a gadolinium-doped CeO2 (GDC) layer (~6 micrometer thickness) and an yttria-stabilized ZrO2 (YSZ) layer with various thicknesses (~330 nm, ~440 nm, and ~1 micrometer) are achieved by a pulsed laser deposition (PLD) technique for thin film solid oxide fuel cells (TFSOFCs). One effective approach is to incorporate YSZ thin film as a blocking layer in between the GDC and anode for preventing chemical reduction of GDC and electrical current leakage. This bilayer approach effectively improves the GDC's chemical/ mechanical stability and reduces the OCV loss under reducing conditions. The results suggest that the YSZ thin film serves as a blocking layer for preventing electrical current leakage in the GDC layer and also provides chemical, mechanical, and structural integrity in the cell, which leads to the overall enhanced performance.

xv, 101 p. ; ill. (some col.) A print copy of this title is available through the UO Libraries under the call number: KNIGHT QC176.84.E5 P47 2007 / Silver films with nanoscale to mesoscale thicknesses were produced by chemical reduction onto silica substrates and their physical and electrical properties were investigated and characterized. The method of silver deposition was developed in the context of this research and uses a single step reaction to produce consistent silver films on both flat silica coverslips and silica nanospheres of 250-1000 nm. Both the structure and the electrical properties of the silver films are found to differ significantly from those produced by vacuum deposition. Chemically deposited (CD) silver is not uniformly smooth, but rather is granular and porous with a network-like structure. By quantitatively accounting for the differences in scale, geometry, and microstructure of the CD films, it is found that the same models used to describe the resistivity of vacuum deposited films may be applied to CD films. A critical point in the analysis that allows this relation involves the definition of a geometric parameter, g, which replaces the thickness, t, as the critical length that influences the electrical properties of the film. The temperature dependent properties of electrical transport were also investigated and related to the microstructure of the CD films. A detailed characterization of CD silver as shells on silica spheres is also presented including physical and optical properties. In spite of the rough and porous morphology of the shells, the plasmon resonance of the core-shell structure is determined by the overall spherical shell structure and is tunable through variations in the shell thickness. Preliminary investigations into the electrical transport properties of aggregates of silver coated spheres suggest similarities in the influence scale, geometry, and microstructure to silver films on flat substrates. The aggregates of shells also exhibit pressure related resistance behavior due to the composite structure. / Adviser: Miriam Deutsch

No description available.

Call number: LD2668 .T4 1961 K57

LD2668 .T4 1966 C434 / Master of Science

Four different trivalent and tetravalent metal phthalocyanine systems (chlorogallium, chloroindium, vanadyl, and titanyl phthalocyanines) were used singly to prepare thin films (0.05-2.0 micron thickness) on gold, optically transparent substrates. The photoelectronic properties of these electrodes could be modified either by altering the growth conditions (i.e. rate of sublimation, cleanliness of substrate) or by dosing the thin films with either hydrogen or oxygen at elevated temperatures (150°C). The properties of these thin films were monitored by electron microscopy, UV-visible spectrophotometry, X-ray and Ultra-violet surface spectroscopies, and a variety of electrochemical and photoelectrochemical techniques. All four systems behaved in a manner similar to a p-type semiconductor when prepared at rapid rates (10-20 A/min) on gold substrates. In the dark, for contacting redox couples with Eᵒ’ values negative of +0.6V, the phthalocyanine electrodes showed negligible dark currents. Upon illumination, the photoelectrodes only produced positive photopotentials. Chlorogallium phthalocyanine thin films could be made to produce both positive and negative photopotentials when grown at slow rates (1-5 A/min) on clean, gold substrates. These chlorogallium phthalocyanine electrodes regained the properties of a p-type semiconductor after being dosed with oxygen for 48 hours at 150°C. X-ray Photoelectron Spectroscopy confirmed the presence of a high concentration of oxygen at the surface of all of the p-type phthalocyanine electrodes. The oxygen may accept electron density from the phthalocyanine macrocycle to cause the Fermi level to move down in energy toward its valence band edge. Dosing the film with hydrogen caused the electrode to exhibit its original intrinsic characteristics. This variability in electrical properties as a function of gas dopant may lead to the development of a sensitive gas sensing device. Ultra-violet Photoelectron Spectroscopy, as well as molecular orbital calculations, were applied to the chlorogallium phthalocyanine system to determine the molecular orbital contributions to its valence and conduction bands. Photoelectrochemical cells made from electrodes of chlorogallium and vanadyl phthalocyanines exhibited power conversion efficiencies in excess of 0.1%. The vanadyl and titanyl phthalocyanine electrodes were also effective catalysts for the photoreduction of H⁺ to H₂.