Aluminium matrix composites are among the most promising candidate materials for light weight and high strength applications such as transportation and armour. In a previous study 6061 aluminum matrix composites reinforced with plain weave carbon fiber preform (AS4 Hexcel) were successfully fabricated by squeeze casting using the laminate fabrication technique. This research aims at optimizing the fabrication process in order to achieve improved strength and mechanical properties. It focuses on the liquid infiltration squeeze casting method. Good mechanical bonding between fiber and aluminium is achieved thanks to improved infiltration and impregnation of the fabric by liquid aluminium. Oxidation products at fiber/aluminium interface and porosity are reduced. As a result, composites are produced with overall improved mechanical properties. The flexural strength is increased by up to 19.9% and 15.4% compared to the laminate approach and the reference 6061 aluminium alloy squeeze cast under identical conditions, respectively. Similarly, overall hardness is improved. However, the impact strength is reduced by 7.76% and 25.78% when compared to casts fabricated by the laminate method and the reference aluminium alloy, respectively. The thesis constitutes a good basis for further research on fiber and particle reinforced aluminium matrix composites with the goal of further improving fracture toughness, particularly for gradient materials used in armour applications.

No description available.

Aluminium matrix composites are among the most promising candidate materials for light weight and high strength applications such as transportation and armour. In a previous study 6061 aluminum matrix composites reinforced with plain weave carbon fiber preform (AS4 Hexcel) were successfully fabricated by squeeze casting using the laminate fabrication technique. This research aims at optimizing the fabrication process in order to achieve improved strength and mechanical properties. It focuses on the liquid infiltration squeeze casting method. Good mechanical bonding between fiber and aluminium is achieved thanks to improved infiltration and impregnation of the fabric by liquid aluminium. Oxidation products at fiber/aluminium interface and porosity are reduced. As a result, composites are produced with overall improved mechanical properties. The flexural strength is increased by up to 19.9% and 15.4% compared to the laminate approach and the reference 6061 aluminium alloy squeeze cast under identical conditions, respectively. Similarly, overall hardness is improved. However, the impact strength is reduced by 7.76% and 25.78% when compared to casts fabricated by the laminate method and the reference aluminium alloy, respectively. The thesis constitutes a good basis for further research on fiber and particle reinforced aluminium matrix composites with the goal of further improving fracture toughness, particularly for gradient materials used in armour applications.

No description available.

Ce projet de thèse se situe dans le cadre de l'étude de la fiabilité prédictive de nouveaux concepts d'assemblages microélectroniques de type « system in package » SiP. L'objectif est de développer une méthodologie de fiabilité prédictive adaptée aux nouveaux concepts d'assemblage qui permet d'optimiser et de prédire les performances dès la phase de conception. Elle est ensuite appliquée sur des projets concrets. Cette méthodologie de fiabilité prédictive fait intervenir des études expérimentales, des simulations thermomécaniques et des analyses statistiques pour traiter les données et évaluer la fiabilité et les risques de défaillance. L'utilisation d'outils de simulation des composants électroniques est bien adaptée pour aider à l'évaluation des zones les plus fragiles, la mise en place des règles de conception et la détermination des paramètres les plus influents avec une réduction du temps de mise en marché d'un produit fiable et une optimisation des performances. Les études réalisées sur le silicium avec deux tests : bille sur anneau et test trois points montrent que le rodage et l'épaisseur ont une influence sur la variation de la contrainte et la déflexion du silicium à la rupture. Avec le test trois points, le déclenchement des fissures est lié à la qualité de sciage et de rodage. Cependant avec le test bille sur anneau, seule la qualité de surface influence le déclenchement des fissures. Le test bille sur anneau est bien adapté pour évaluer la qualité de surface du silicium. Avec les techniques chimiques de réduction de contraintes, comme la gravure humide et plasma, la résistance à la rupture a été considérablement améliorée. Ces tests de rupture sur le silicium ont permis de caractériser la rupture du silicium sous une contrainte de flexion et de compléter les résultats de simulation. Ces travaux démontrent, le besoin et l'utilité du prototypage virtuel des composants électroniques et de l'utilisation d'une méthodologie prédictive dans l'évaluation de la fiabilité en l’appliquant sur des composants réels. / This thesis project is a study of the predictive reliability of new microelectronic package concepts such as "system in package" SiP. The objective is to develop a reliable predictive methodology adapted to the new assembly concepts to optimize and to predict the performance at the design phase. Then, the methodology is applied to concrete projects. This methodology of predictive reliability involves the use of experimental studies, thermomechanical simulations and statistical analysis to process the data and assess the reliability and risks of failure. The use of simulation tools for electronic components is well suited to assist in the evaluation of the most fragile areas, the setting up of design rules and the determination of the most influential parameters with a reduction in the setup time market for a reliable and optimized performance. Studies on silicon strength are conducted with two tests: ball on ring test and on three-point bend test show that the grinding and the thickness influence the variation of the stress and deflection of the silicon at break. With the three points bend test, the onset of crack is linked to defects in sawing and grinding zone. However, with the ball on ring test, only the surface quality influences the initiation of cracks. The ball on ring test is well suited for evaluating the quality of the silicon surface. Chemical techniques of stress release, such as wet etching and plasma etching, improve significantly the strength of silicon samples. These tests on silicon dies are used to characterize the breakdown of silicon under bending test and to complete the simulation results. We have demonstrated in this work, the need and the usefulness of the virtual prototyping of electronic components and the use of a predictive methodology in assessing reliability.