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No description available.

End-functional poly(ether amic acid)s and poly(siloxane imide) multiblock copolymers, comprised of 2,2'-Bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride (BPADA) / meta-phenylene diamine (MPDA) and hexafluoroisopropylidene-2-bis(phthalic acid anhydride) (6FDA) / meta-phenylene diamine (MPDA) polyimide segments, have been prepared and characterized to explore possibilities for controlling interface properties. Incorporation of polydimethylsiloxane (PDMS) components into polyimide backbone structures can yield advantageous properties such as low energy surfaces and low stress interfaces. End-functional BPDA/MPDA poly(amic acid) salts and poly(siloxane amic acid) salts were prepared in methanolic or aqueous tripropylamine solutions. The polymeric salts formed stable water solutions (or dispersions) and imidized in less than 10 minutes at 260°C. The water solubility and rapid imidization times are ideal for on-line processing. Thus, these materials can be used as sizing and interface toughening agents for fiber reinforced composite manufacturing. Epoxy-polyimide networks prepared from the amine functionalized polyimide with DER 331 epoxy resin and diamino diphenylsulfone showed microphase separation (100-300 nm inclusions) by transmission electron microscopy. Slight toughening of the cured epoxy with 9 weight % imide was observed with the imide as the included phase. Epoxy bilayer films of polyimide (amine end-functional and commercial Ultem™) and poly(siloxane imide) multiblock copolymers were prepared to evaluate the polymer-matrix interphase region. Atomic force microscopy (AFM) analysis of the bilayer films showed diffusion at the interphase for the bilayers prepared with the polyimides and the BPADA/MPDA block copolymers containing polyimide continuous phases. Poly(siloxane imide) multiblock copolymers comprised of 6FDA/MPDA polyimide structures are ideal candidates for controlling interfacial properties between silicon substrates layered with thin films for microelectronic applications. These high Tg materials offer an approach for obtaining reduced moisture absorption and low stress interfaces. Evaluation of the refractive indices of the block copolymer films showed a decrease with increasing siloxane content thus suggesting the possibility of lower dielectric constants. The polymer-metal interfacial properties were investigated for films cast on titanium and tantalum substrates. The results suggested a correlation between the surface hydroxyl concentration of the metal oxide layer with the interfacial properties of the cast poly(siloxane imide) block copolymer films. The surface hydroxyls were thought to hydrogen bond with the PDMS component of the block copolymer. Since the titanium substrate has a higher surface hydroxyl concentration than the tantalum, higher silicon concentrations were observed. The melt imidized end-functional polyimides and poly(siloxane imide) block copolymers produced thermally stable materials with 5% weight loss temperatures well above 400°C. However, the block copolymers showed slightly lower 5% weight loss temperatures as a function of siloxane content with a significant increase in char formation. Correlation of the upper glass transition temperatures with the imide segment length was consistent with findings noted for other phase separated randomly segmented block copolymers. Incorporating PDMS into the polyimide backbone structure has an effect on the bulk and surface properties. The bulk properties of the poly(siloxane imide) block copolymers were characterized using TEM. The morphologies were consistent with classical block copolymers. Surface properties of the block copolymer films as a function of PDMS content were investigated using angular dependent X-ray photoelectron spectroscopy at take-off angles of 15, 30, and 45°. Surface enrichment of PDMS content over that of the bulk was observed at all three sampling depths. Further evidence of this siloxane enrichment in the surface was demonstrated with water contact angle analyses. With as little as 5 weight % PDMS (<Mn> = 5000 g/mol) in the block copolymer there was over a 25% increase in the water contact angle over the polyimide control. The surface topography was influenced by the degree of phase separation and was characterized using AFM. The roughness factor was used to represent the data. It was found that the surface roughness increased with increasing PDMS content. / Ph. D.

Renewable lignocellulosic materials are promising green plastic alternatives to fossil fuel-based plastics. However, the hydrophilic nature and poor water resistance of lignocellulosic materials have hindered their practical applications. This study reports a facile metal-ion-modification (MIM) route, swelling with aqueous metal ion solutions, and drying to convert conventional hydrophilic paper and wood pulp into biodegradable hydrophobic paper and tableware without the addition of hydrophobic sizing chemicals/materials. Metal ions such as Fe3+ and Zr4+ can coordinate with pulp fibers’ polar groups (i.e., O.H., C=O, and COOH) that induce self-assembly of their surface fibrillated “hairy” cellulose nanofibrils to form a more compact structure with fewer available O.H. groups for water sorption. The formation of coordination bonds with polar groups (i.e., O.H., C=O, and COOH) decreases the surface energy of pulp fibers and increases their hydrophobicity and water resistance. Only ~3 mg of metal ions is needed to induce the wettability transition in 1 g of kraft pulp, resulting in hydrophobic paper and tableware with water contact angles (WCAs) of 120-140° and displayed wet tensile strengths of up to 9.5 MPa, and low water absorbency, which were comparable to synthetic polymer films. This MIM technique can be integrated into the existing paper-making process for the scalable production of hydrophobic papers and tableware, providing an alternative route for developing sustainable and biodegradable plastic counterparts. The MIM-induced lignocellulose hydrophobization mechanisms were elucidated using X-ray photoelectron spectroscopy (XPS), Fourier transforms infrared spectroscopy (FT-IR), and scanning electron microscopy-energy dispersive spectroscopy (SEM-EDS), and density functional theory (DFT). Furthermore, this MIM technique was also evaluated for its applicability in wood treatment. The treatment effectively tunes the wood surface from hydrophilic to hydrophobic, enhancing its water resistance. The MIM treatment significantly improved the dimensional stability of SYP, red oak, and poplar. For example, the Fe3+ treatment reduced the tangential swelling of SYP, poplar, and red oak by 57%, 50%, and 40%, respectively. Overall, this eco-friendly and facile MIM method holds promise for developing sustainable and biodegradable alternatives to conventional plastics, contributing to a more environmentally friendly future.

Wafer bonding is important in microelectromechanical systems (MEMS) manufacturing, enabling wafer-level encapsulation and packaging. In this project, different pre-treatments of the polycrystalline silicon surface for eutectic gold-silicon (AuSi) bonding were studied with respect to the resulting bond strength. Native oxides or other surface layers can decrease the interaction between Au and Si, leading to weaker bonds. Different etching methods were investigated to remove native oxide. Spectroscopic ellipsometry (SE), water contact angle measurements and Fourier transform infrared spectroscopy (FTIR) were used to analyze the surfaces. SE measurements showed that the oxide layer grew 5 Å the first 4 hours after HF etch, rinse and dry, but then grew less than this during the following 6 weeks. The measured oxide growth was similar for wafers with other pre-treatments. Through contact angle measurements, it was demonstrated that the different etching methods resulted in different outermost surface layers. None of the contact angles were changed much over several weeks, indicating subsequent oxide growth occurred below a stable outermost layer. For wafer bonding, wafers with bond frame structures were used. After wafer bonding, the bond frames were analyzed with infrared (IR) microscopy and the bonds were shear tested for bond strength. The shorter the exposure time to ambient air atmosphere before bond, the stronger the bond in general. Furthermore, the wafers stored in nitrogen atmosphere exhibited higher bond strengths than the wafers stored in air for the same amount of time, confirming that the growing oxide was the reason for the decreased bond quality during wafer storage. HF (wet/vapor) etched wafers in general had slightly stronger bonds than the other wafers and the wafers etched with HF vapor had the highest average bond strength of all. The IR images showed that white areas in the bond frames were related to decreased bond strength, and that wafers that had longer storage time on average had more white in the bond frames. As a conclusion, to achieve as strong bonds as possible, the waiting time between wafer pre-treatments and bonding should be minimized, and in the waiting time it is beneficial to store the wafers in nitrogen atmosphere. In this study most wafers stored 2 weeks in nitrogen had good bond quality and even wafers stored 3 days in air had acceptable bond strengths. However, using HF to etch away the oxide before bond is preferable compared to the other etching methods, not only to have larger average bond strength, but also to have less bond strength decrease during waiting time before bond. / I tillverkning av mikroelektromekaniska system (MEMS) är skivbondning viktigt för inkapsling och förpackning av mikrosystem på skivnivå. I detta projekt studerades olika förbehandlingar av polykristallina kiselytan, inför eutektisk AuSi-bondning, med avseende på resulterande bondstyrka. Nativoxid eller andra ytskikt kan minska interaktionen mellan guld (Au) och kisel (Si), vilket leder till svagare bond. Flera olika etsmetoder undersöktes för att ta bort nativoxid. Spektroskopisk ellipsometri (SE), mätningar av vattenkontaktvinkel och Fouriertransform infraröd spektroskopi (FTIR), användes för att analysera ytorna. Resultaten från SE-mätningarna visade att oxiden växte 5 Å under de 4 första timmarna efter HF-ets, skölj och tork, men växte sedan mindre än detta under de följande 6 veckorna. Den uppmätta oxidtillväxten var liknande för skivorna med andra förbehandlingar. Kontaktvinklarna var olika för olika förbehandlingsmetoder, vilket visar att de hade olika yttersta ytskikt. Ingen av kontaktvinklarna ändrades mycket under flera veckor, vilket indikerar att den följande oxidtillväxten skedde under ett stabilt yttersta lager. För skivbondning andvändes skivor med bondramar längs chip-kanterna. Dessa bondramar var gjorda av polykristallint Si respektive Au på skivorna som skulle bondas. Efter bondning analyserades bondramarna med infraröd (IR) mikroskopi och skjuvtester gjordes för att bestämma bondstyrkan. Ju kortare tid skivorna exponerades till omgivande luft, desto starkare bond i allmänhet. Dessutom uppvisade skivorna som lagrats i kväveatmosfär högre bondstyrkor än de skivor som lagrats i luft, vilket bekräftar att den växande oxiden var orsaken till den minskade bondkvaliteten under skivlagring. HF-etsade skivor (HF- dipp och HF-ånga) hade något starkare bond än de andra skivorna och de skivor som etsats med HF-ånga hade allra högst genomsnittlig bondstyrka. IR-bilderna visade att vita områden i bondramarna var relaterat till minskad bondstyrka och att skivor som hade längre lagringstid i genomsnitt hade mer vitt i bondramarna. Slutsatsen är att för att uppnå så hög bondstyrka som möjligt ska tiden mellan förbehandlingar och bond minmeras, och under väntetiden är det till fördel att skivorna förvaras i kväveatmosfär. I den här studien hade skivor som förvarats 2 veckor i kväve bra bondkvalitet och även skivor som stått 3 dagar i luft hade godtagbara bondstyrkor. Att använda HF för att etsa bort oxid är dock bättre än att använda någon av de andra etsmetoderna, inte bara för att få högre genomsnittliga bondstyrkor, utan också för att få mindre minskning av bondstyrkan under väntetiden inför bondning.

The research presented in this dissertation is focused on the construction of complex molecular structures on planar gold and silicon dioxide surfaces using a variety of surface modification techniques, along with thorough surface characterization at each modification step. The dissertation is structured into six separate chapters. In Chapter 1, an introduction to the importance and implications of molecular level surface modification, commonly employed surface modification methods, and available surface characterization techniques is presented. Chapter 2 shows applications of novel methodologies for the functionalization of gold surfaces using alkane dithiol self-assembled monolayers and thiol-ene click chemistry. The resulting functionalized gold substrates demonstrate higher chemical stability than alkanethiol self-assembled monolayers alone and allow spatially controlled functionalization of gold surfaces with light. In Chapter 3, work on tunable hydrophobic surfaces is presented. These surfaces are prepared using a combination of organosilane chemistry, layer-by-layer polyelectrolyte deposition, and thiol-ene chemistry. These hydrophobic surfaces demonstrate high mechanical and chemical stability, even at low pH (1.68). The pinning of water droplets could be tuned on them by the extent of their thermal treatment. Comprehensive surface characterization using X-ray photoelectron spectroscopy (XPS), time-of-flight secondary ion mass spectrometry (ToF-SIMS), spectroscopic ellipsometry, atomic force microscopy, and water contact angles was carried out on the molecular assemblies prepared on gold and silicon dioxide surfaces. Chapters 4 and 5 are focused on the application, data interpretation, and enhancement in sensitivity of different surface characterization methods. In Chapter 4, XPS, ToF-SIMS, and principal components analysis are used to probe a real world corrosion-type problem. This systemic study showed the destruction of a protective coating composed of a nitrilotris(methylene)triphosphonic acid by a low-intensity fluorine plasma. In Chapter 5, enhancement in ToF-SIMS signals is shown via bismuth metal deposition. These surfaces are also probed by spectroscopic ellipsometry using the interference enhancement method. Finally, Chapter 6 concludes this dissertation by describing possible future work.