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Backside observation of large-scale integrated circuits with multilayered interconnections using laser terahertz emission microscope

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1. http://hdl.handle.net/2237/12631
2. http://dx.doi.org/10.1063/1.3133346
3. 0003-6951
4. APPLIED PHYSICS LETTERS. v.94, n.19, 2008, p.191104-1 - 191104-3

Identifer	oai:union.ndltd.org:NAGOYA/oai:ir.nul.nagoya-u.ac.jp:2237/12631
Date	13 May 2009
Creators	Yamashita, Masatsugu, Otani, Chiko, Kawase, Kodo, Matsumoto, Toru, Nikawa, Kiyoshi, Kim, Sunmi, Murakami, Hironaru, Tonouchi, Masayoshi
Publisher	American Institite of Physics
Source Sets	Nagoya University
Language	en_US
Detected Language	English
Type	Article(publisher)
Rights	Copyright (2009) American Institute of Physics. This article may be downloaded for personal use only. Any other use requires prior per　mission of the author and the American Institute of Physics.