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The Global ETD Search service is a free service for researchers
to find electronic theses and dissertations. This service is
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Networked Digital Library of Theses and Dissertations.
Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.
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Showing 1 to 9 of 9 (0.037 seconds)Spelling suggestions: "subject:"atomsonde"" "subject:"atomsonden""
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Characterization and Process Development of CVD/ALD-based Cu(Mn)/Co(W) Interconnect SystemShima, Kohei, Tu, Yuan, Han, Bin, Takamizawa, Hisashi, Shimizu, Hideharu, Shimizu, Yasuo, Momose, Takeshi, Inoue, Koji, Nagai, Yasuyoshi, Shimogaki, Yukihiro 22 July 2016 (has links) (PDF)
A new materials system of a single layered Co(W) barrier/liner coupled with a Cu(Mn) alloy seed was investigated. Atom probe tomography visualized the sub-nanoscale structure of Cu(Mn)/Co(W) system, and thereby revealed Cu diffusion behavior of Co(W). Grain boundaries of Co were found to be the diffusion path, and successfully stuffed by W. Mn in Cu(Mn) also segregated to stuff the grain boundaries of Co. Combination of these two additives enabled high barrier property against Cu diffusion of Cu(Mn)/Co(W). Foreseeing tiny and high-aspect-ratio Cu interconnect features, Cu(Mn)/Co(W) was fabricated by ALD/CVD processes. To maximize the performance, minor impurities of the film incorporated from the ligand of the precursors were controlled by precursor selection. Thin, conformal, and smooth films were finally demonstrated onto a trench substrate.
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| 2 |
Characterization and Process Development of CVD/ALD-based Cu(Mn)/Co(W) Interconnect SystemShima, Kohei, Tu, Yuan, Han, Bin, Takamizawa, Hisashi, Shimizu, Hideharu, Shimizu, Yasuo, Momose, Takeshi, Inoue, Koji, Nagai, Yasuyoshi, Shimogaki, Yukihiro 22 July 2016 (has links)
A new materials system of a single layered Co(W) barrier/liner coupled with a Cu(Mn) alloy seed was investigated. Atom probe tomography visualized the sub-nanoscale structure of Cu(Mn)/Co(W) system, and thereby revealed Cu diffusion behavior of Co(W). Grain boundaries of Co were found to be the diffusion path, and successfully stuffed by W. Mn in Cu(Mn) also segregated to stuff the grain boundaries of Co. Combination of these two additives enabled high barrier property against Cu diffusion of Cu(Mn)/Co(W). Foreseeing tiny and high-aspect-ratio Cu interconnect features, Cu(Mn)/Co(W) was fabricated by ALD/CVD processes. To maximize the performance, minor impurities of the film incorporated from the ligand of the precursors were controlled by precursor selection. Thin, conformal, and smooth films were finally demonstrated onto a trench substrate.
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Untersuchungen zur Korngrenzensegregation in nanokristallinen Al-Cu- und Co-P-Legierungen mittels 3d-Atomsondentomographie / Investigations of grain boundary segregation in nanocrystalline Al-Cu- and Co-P alloys by means of 3d-atom probe tomographyChoi, Pyuck-Pa 30 October 2003 (has links)
No description available.
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Wachstum und Grenzflächenbeschaffenheit oxidischer Ausscheidungen in Silber / Growth and Interfacial Composition of Oxide Precipitates in SilverKluthe, Christian 05 November 2003 (has links)
No description available.
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Untersuchung atomarer Strukturen an geordnetem und nanokristallinem ternären Fe3Al / Studies of atomic scale structures of ordered and nanocrystalline ternary Fe3AlRademacher, Thomas 13 July 2011 (has links)
No description available.
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Heterogene Interdiffusion von nanokristallinen Cu/Co/Au-Schichten / Heterogenous interdiffusion of nanocrystalline Cu/Co/Au-layersLang, Christian 30 October 2001 (has links)
No description available.
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Thermische Stabilität und Reaktion metallischer Multilagen / Thermal stability and reaction of metallic multilayersEne, Constantin Buzau 19 December 2007 (has links)
No description available.
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Bestimmung von Platzbesetzung und Bindungsenergien mittels Atomsondentomographie / Site Occupation and Binding Energies by Means of Atom Probe TomographyBoll, Torben 07 May 2010 (has links)
No description available.
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Korngrenzsegregation in Silber-Nickel und Kupfer-Wismut Legierungen / Grain Boundary Segregation in Silver-Nickel and Copper-Bismuth AlloysWolde-Giorgis, Daniel 25 August 2005 (has links)
No description available.
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