Electroreflectance (ER) spectra of Schottky-barrier Au/n-GaN have been measured at various dc biased voltages (Vbias). The ER spectra have exhibited excitonic signals beneath band-gap energy (Eg ). In addition, Franz-Keldysh oscillations (FKOs) were also observed above Eg. The FKOs come from the former region, and the excitonic signals come from the latter region. When Vbias = 0, they are mixed. As reverse Vbias is increased, they become more separated. Furthermore, strength of surface electric field (Fs) can be deduced from the period of the FKOs. From the plot of versus Vbias, barrier height of 1.2 V and carrier concentration were obtained.

This study presents the GaSb epitaxial grown by molecular beam epitaxy (MBE) on the semi-insulating GaAs substrate and n+-GaAs substrate. Investigations are made to the effect of Sb4/Ga beam equivalent pressure (BEP) ratios on the current-voltage characteristics of the p-n hetero-junction and the metal-GaSb semiconductor Schottky contact for various metals deposited on n-type GaSb layers. Several growth conditions were taken to improve the quality of GaSb epitaxial films. The structure of GaSb epitaxial layers are characterized by the X-ray diffraction, and the optimum growth conditions 500¢J of substrate temperature and the Sb4/Ga flux ratio about 2~3 have been obtained. From the I-V curve of GaSb Schottky diodes, we know that the higher Sb4/Ga ratio will induce the lower breakdown voltage. Hence, the interface properties of hetero-junction between the GaSb/GaAs and metal/GaSb can be investigated by the current-voltage characteristics, in which the current leakages and the surface state density are strongly dependent on the ratio of Sb4/Ga BEP. Based on the thermionic emission theory, the barrier height obtained was decrease with the Sb4/Ga ratio increases. After metal deposited on the GaSb epitaxial film to form the Schottky diode, the density of surface states can be calculated from the relationship of metal work-function and barrier height, which were obtained from the current-voltage characteristics of Schottky diode measurement, and then it also found that the density of surface states show decrease as the Sb4/Ga ratio increase.

High-voltage SiC Schottky barrier diodes have been fabricated with 1mm square contacts. The SBD?s were fabricated using both an argon implant and a field plate overlap for edge termination. The current-voltage characterization of the diodes is presented with statistical yield information on the first set of diodes produced from the Mississippi Center for Advanced Semiconductor Prototyping. After packaging, reverse bias breakdown voltages over 500V at 0.1 A/cm2 and an on-state forward voltage drop of less than 2.5V at 100 A/cm2 were demonstrated. A 0.65-0.85 eV barrier height was extracted from the SBD?s using I-V measurements. Field plate terminated devices demonstrated consistent, low standard deviation breakdown voltages and low leakage currents. The argon implanted devices demonstrated a higher breakdown voltage with higher leakage currents and a higher standard deviation. It was proven that the diodes followed the thermionic field emission model for up to one third of the breakdown voltage. Over 15,000 diodes have been tested and results analyzed in this work.

Two-dimensional (2D) materials have attracted extensive research interest in recent years. Among them, graphene and the semiconducting transition metal dichalcogenides (TMDs) are considered as promising candidates for future device applications due to their unique atomic thickness and outstanding properties. The study on graphene and TMDs has demonstrated great potential to further push the scaling of devices into the sub-10 nanometer regime and enable endless opportunities of novel device architectures for the next generation. In this thesis, crucial challenges facing 2D materials are investigated from material synthesis to electronic applications. A comprehensive review of the direct synthesis of graphene on arbitrary substrates with an emphasis on the metal-catalyst-free synthesis is given, followed by a detailed study of the contact engineering in TMDs with a focus on the strategies to lower the contact resistance. Effective approaches have been demonstrated to solve these issues. These include: (1) metal-catalyst-free synthesis of graphene on various insulating substrates; (2) Fermi level pinning observed in TMDs and integration of graphene contact to lower the contact resistance; and (3) application of metal-insulator-semiconductor (MIS) contact in TMD field-effect transistors (FETs). First, a direct low-temperature synthesis of graphene on insulators without any metal catalysts has been realized. The effects of carbon sources, NH3/H2 concentrations, and insulating substrates on the material synthesis have been systematically investigated. Graphene transistors based on the as-grown material have been fabricated to study the electronic properties, which can further confirm the nitrogen-doped graphene has been synthesized from the electrical characterizations. Then electronic devices focusing on the semiconducting TMDs has been studied. The Fermi level pinning has been observed and studied in WS2 FETs with four metal materials. A novel method of using graphene as an insertion layer between the metal and TMDs has been proven to effectively reduce the contact resistance. Owing to the benefit of tuning the graphene work function via the electric field, the contact resistance can further be reduced. Finally, the effectiveness of MIS contacts in WS2 FETs has been demonstrated. A thickness dependence research has been conducted to find the optimal thickness of the inserted insulator. Moreover, the possible physical mechanism of how this MIS contact reduces the contact resistance in 2D materials has been discussed.

Metal-Insulator-Metal (MIM), Metal-Insulator-Insulator-Metal (MIIM), and Metal-Insulator-Insulator-Insulator-Metal (MIIIM) quantum tunneling diodes have been designed, fabricated, and characterized. The key interest of this work was to develop tunneling diodes capable of operating and detecting THz radiation up to 30THz, which is well beyond the operation ranges of other semiconductor-based diodes. Al2O3, HfO2 and TiO2 metal oxides were employed for studying the behavior of metal-insulator-metal (MIM) and metal-insulator-insulator-metal (MIIM) quantum tunneling diodes. Specifically, ultra-thin films of these oxides with varied thicknesses were deposited by atomic layer deposition (ALD) as the tunneling junction material that is sandwiched between platinum (Pt) and titanium (Ti) electrodes, with dissimilar work functions of 5.3 eV and 4.1 eV, respectively. Due to the unique and well-controlled tunneling characteristic of the ALD ultra-thin films, reproducible MIM and MIIM diode devices have been developed. The DC characteristics of MIM and MIIM tunneling junctions with different junction areas and materials were investigated in this work. The effects of the different compositions and thicknesses of the tunneling layer on the diodes were studied systematically. Through the introduction of stacked dual tunneling layers, it is demonstrated that the MIIM and MIIIM diodes exhibited a high degree of asymmetry (large ratio between forward and reverse currents) and a strong nonlinearity in their I-V characteristics. The characterization was performed on diodes with micro and nano-scale junction areas. The MIM diodes reported herein exhibited lower junction resistances than those reported by prior works. Moreover, a study was conducted to numerically extract the average barrier heights by fitting the analytical model of the tunneling current to the measured I-V responses, which were evaluated with respect to the thickness of the constituent tunneling layer. RF characterization was performed on the MIM diodes up to 65GHz, and its junction impedance was extracted. A rigorous procedure was followed to extract the diode equivalent circuit model to obtain the intrinsic lumped element model parameters of the MIM diodes.

Due to their unique properties, carbon fiber reinforced polymers (CFRP) are becoming ever more prevalent in today's society. Unfortunately, CFRP suffer from a wide range of failure modes and structural health monitoring methods are currently insufficient to predict these failures. It is apparent that self-sensing structural health monitoring could be advantageous to protect consumers from catastrophic failure in CFRP structures. Previous research has shown that embedded nickel nanostrand nanocomposites can be used to instantaneously measure strain in carbon fiber composites, but these methods have been severely limited and can induce high stress concentrations that compromise the structural integrity of the carbon fiber structure. In this research the strain sensor material and the connective circuitry to the sensor are analyzed to improve the practicality of in situ strain sensing of carbon fiber structures. It has been found that the use of nickel nanostrands embedded directly onto carbon fiber as a strain sensor material has no advantages over a carbon fiber strain sensor alone. Additionally, it has been shown that the circuitry to the strain sensor plays a critical role in obtaining a strong, consistent piezoresistive signal that can be related to strain. The use of nickel coated carbon fiber in the circuitry has been evaluated and shown to reduce the noise in a piezoresistive signal while allowing for remote strain sensing from greater distances away from the strain location. The piezoresistive strain sensing utilized in the tested sensor designs relies on electrons tunneling through an insulting barrier between two conductors. This phenomenon is known as quantum tunneling. Two factors - tunneling barrier height and gap distance - affect the probability of quantum tunneling occurring. Thus, to accurately model and predict the piezoresistivity of nanocomposites these two parameters must be known. Through the use of dielectric spectroscopy the gap distance can be determined. Using nanoindenting, the barrier height for various polymers was also determined. The measured values can be used, in future work, to improve the modeling of nickel nanostrand nanocomposite.

This thesis is a sandwich thesis composed of three papers that are published in refereed journals or conferences. The first paper is a systematic experimental study conducted to identify the first phase to form during cobalt germanidation. Hexagonal β-Co5Ge3 was the first phase to form at temperatures as low as 227°C followed by monoclinic CoGe as the second phase at the same temperature. We also report for the first time that both phases that formed were highly ordered partial epitaxial crystal orientations suggesting that both of those low-temperature phases could potentially serve as high quality contacts for germanium based devices with a very low thermal budget which is advantageous for the process design. Those results contributed to a better understanding of cobalt germanidation leading to the first multiphase technology computer aided design model presented in the second paper. This kinetic model for cobalt germanide growth can predict the resulting phase based on anneal time, temperature, and ambient. The model has been calibrated to experimental results. This predictive model can help in the design of cobalt germanide contacts with low resistance and can serve as a general modeling framework for multiphase solid state reaction binary systems. A comprehensive survey of the experimental results for formation of cobalt germanides is discussed and the data are reconciled in the third paper. Factors affecting the resulting phases and their quality are identified and some optimum choices for the experimental parameters are pointed based on the survey. The role of germanium crystal orientation in ohmic and Schottky properties of the contact is analyzed. Fermi level pinning plays a role mainly on metal/(100) n-type Ge interfaces and its role is minimal on p-type Ge and other crystalline orientations. Schottky Barrier Heights for cobalt germanide contacts reported in the literature are surveyed. Crystalline cobalt germanides, forming when Co is deposited at high temperatures, are expected to have lower interface resistivities compared to those reported. The work is important because contact resistance has become one of the most important factors in advanced complementary metal oxide semiconductor (CMOS) technology and advanced devices already include germanium (Ge) in the source/drain regions of devices. It is also important because heating at the interface due to contact resistance is one of the key challenges in power devices and cobalt germanide can be used both for Si and Ge based devices as well as for gallium nitride (GaN) devices. The latter application is possible because cobalt germanide is lattice-matched to GaN. / Thesis / Doctor of Philosophy (PhD) / The main goal of this thesis is to create predictive empirical, mathematical, and physical models to help the designer of the semiconductor process technology to design high quality electric contacts, namely cobalt germanides, to their semiconductor devices, germanium based. The choice of cobalt germanides is motivated by their expected superior quality given the possibility of growing them in crystalline form. We settled a theoretical and experimental controversy regarding the first phase to form by conducting experiments demonstrating that low-temperature forming cobalt germanide phases are highly ordered and could serve as high quality contacts. A predictive physical based mathematical model was developed to assist the designer in obtaining the desired cobalt germanide phase for its needed electrical properties by design. Factors affecting the quality of the germanide were identified based on an extensive survey and the optimum choices for the parameters to obtain high quality contact were pointed.

The electrical properties of ZnO and contacts to ZnO have been investigated using different techniques. Temperature dependent Hall (TDH) effect measurements have been used to characterize the as-received melt grown ZnO samples in the 20 – 330 K temperature range. The effect of argon annealing on hydrogen peroxide treated ZnO samples has been investigated in the 200 – 800oC temperature range by the TDH effect measurement technique. The experimental data has been analysed by fitting a theoretical model written in Matlab to the data. Donor concentrations and acceptor concentrations together with the associated energy levels have been extracted by fitting the models to the experimentally obtained carrier concentration data by assuming a multi-donor and single charged acceptor in solving the charge balance equation. TDH measurements have revealed the dominance of surface conduction in melt grown ZnO in the 20 – 40 K temperature range. Surface conduction effects have proved to increase with the increase in annealing temperature. Surface donor volume concentrations have been determined in the 200 – 800oC by use of theory developed by D. C. Look. Good rectifying Schottky contacts have been fabricated on ZnO after treating the samples with boiling hydrogen peroxide. Electrical properties of these Schottky contacts have been investigated using current-voltage (IV) and capacitance-voltage (CV) measurements in the 60 – 300 K temperature range. The Schottky contacts have revealed the dominance of predominantly thermionic emission at room temperature and the existence of other current transport mechanisms at temperatures below room temperature. Polarity effects on the Schottky contacts deposited on the O-polar and Zn-polar faces of ZnO have been demonstrated by the IV technique on the Pd and Au Schottky contacts at room temperature. Results obtained indicate a strong dependence of the Schottky contact quality on the polarity of the samples at room temperature. The quality of the Schottky contacts have also indicated their dependence on the type of metal used with the Pd producing contacts with the better quality as compared to the Au. Schottky barrier heights determined using temperature dependent IV measurements have been observed to increase with increasing temperature and this has been explained as an effect of barrier inhomogeneities, while the ones obtained from CV measurements have proved to follow the negative temperature coefficient of the II – VI semiconductor material, i.e. a decrease in barrier height with increasing temperature. However, the values have proved to be larger than the energy gap of ZnO, an effect that has been explained as caused by an inversion layer. Copyright / Dissertation (MSc)--University of Pretoria, 2010. / Physics / unrestricted

Silicon carbide is a promising wide bandgap semiconductormaterial for high-temperature, high-power, and high-frequencydevice applications. However, there are still a number offactors that are limiting the device performance. Among them,one of the most important and critical factors is the formationof low resistivity Ohmic contacts and high-temperature stableSchottky diodes on silicon carbide. In this thesis, different metals (TiW, Ti, TiC, Al, and Ni)and different deposition techniques (sputtering andevaporation) were suggested and investigated for this purpose.Both electrical and material characterizations were performedusing various techniques, such as I-V, C-V, RBS, XRD, XPS,LEED, SEM, AFM, and SIMS. For the Schottky contacts to n- and p-type 4H-SiC, sputteredTiW Schottky contacts had excellent rectifying behavior afterannealing at 500 ºC in vacuum with a thermally stableideality factor of 1.06 and 1.08 for n- and p-type,respectively. It was also observed that the SBH for p-type SiC(ΦBp) strongly depends on the choice the metal with alinear relationship ΦBp= 4.51 - 0.58Φm, indicating no strong Fermi-level pinning.Finally, the behavior of Schottky diodes was investigated byincorporation of size-selected Au nano-particles in Ti Schottkycontacts on silicon carbide. The reduction of the SBH isexplained by using a simple dipole layer approach, withenhanced electric field at the interface due to the small sizeof the circular patch (Au nano-particles) and large differenceof the barrier height between two metals (Ti and Au) on both n-and p-SiC. For the Ohmic contacts, titanium carbide (TiC) was used ascontacts to both n- and p-type 4H-SiC epilayers as well as onAl implanted layers. The TiC contacts were epitaxiallydeposited using a co-evaporation method with an e-beam Tisource and a Knudsen cell for C60, in a UHV system at low substrate temperature(500 ºC). In addition, we extensively investigatedsputtered TiW (weight ratio 30:70) as well as evaporated NiOhmic contacts on both n- and p-type epilayers of SiC. The bestOhmic contacts to n-type SiC are annealed Ni (&gt;950ºC)with the specific contact resistance of ≈ 8× 10-6Ω cm2with doping concentration of 1.1 × 10-19cm-3while annealed TiW and TiC contacts are thepreferred contacts to p-type SiC. From long-term reliabilitytests at high temperature (500 ºC or 600 ºC) invacuum and oxidizing (20% O2/N2) ambient, TiW contacts with a platinum cappinglayer (Pt/Ti/TiW) had stable specific contact resistances for&gt;300 hours. <b>Keywords</b>: silicon carbide, Ohmic and Schottky contacts,co-evaporation, current-voltage, capacitance-voltagemeasurement, power devices, nano-particles, Schottky barrierheight lowering, and TLM structures.

<p>Silicon carbide is a promising wide bandgap semiconductormaterial for high-temperature, high-power, and high-frequencydevice applications. However, there are still a number offactors that are limiting the device performance. Among them,one of the most important and critical factors is the formationof low resistivity Ohmic contacts and high-temperature stableSchottky diodes on silicon carbide.</p><p>In this thesis, different metals (TiW, Ti, TiC, Al, and Ni)and different deposition techniques (sputtering andevaporation) were suggested and investigated for this purpose.Both electrical and material characterizations were performedusing various techniques, such as I-V, C-V, RBS, XRD, XPS,LEED, SEM, AFM, and SIMS.</p><p>For the Schottky contacts to n- and p-type 4H-SiC, sputteredTiW Schottky contacts had excellent rectifying behavior afterannealing at 500 ºC in vacuum with a thermally stableideality factor of 1.06 and 1.08 for n- and p-type,respectively. It was also observed that the SBH for p-type SiC(Φ_Bp) strongly depends on the choice the metal with alinear relationship Φ_Bp= 4.51 - 0.58Φ_m, indicating no strong Fermi-level pinning.Finally, the behavior of Schottky diodes was investigated byincorporation of size-selected Au nano-particles in Ti Schottkycontacts on silicon carbide. The reduction of the SBH isexplained by using a simple dipole layer approach, withenhanced electric field at the interface due to the small sizeof the circular patch (Au nano-particles) and large differenceof the barrier height between two metals (Ti and Au) on both n-and p-SiC.</p><p>For the Ohmic contacts, titanium carbide (TiC) was used ascontacts to both n- and p-type 4H-SiC epilayers as well as onAl implanted layers. The TiC contacts were epitaxiallydeposited using a co-evaporation method with an e-beam Tisource and a Knudsen cell for C₆₀, in a UHV system at low substrate temperature(500 ºC). In addition, we extensively investigatedsputtered TiW (weight ratio 30:70) as well as evaporated NiOhmic contacts on both n- and p-type epilayers of SiC. The bestOhmic contacts to n-type SiC are annealed Ni (>950ºC)with the specific contact resistance of ≈ 8× 10^-6Ω cm²with doping concentration of 1.1 × 10^-19cm^-3while annealed TiW and TiC contacts are thepreferred contacts to p-type SiC. From long-term reliabilitytests at high temperature (500 ºC or 600 ºC) invacuum and oxidizing (20% O₂/N₂) ambient, TiW contacts with a platinum cappinglayer (Pt/Ti/TiW) had stable specific contact resistances for>300 hours.</p><p><b>Keywords</b>: silicon carbide, Ohmic and Schottky contacts,co-evaporation, current-voltage, capacitance-voltagemeasurement, power devices, nano-particles, Schottky barrierheight lowering, and TLM structures.</p>