TCAD numerical simulations have been carried out to study the current-voltage, electrical breakdown, and self-heating characteristics of β-Ga2O3 based metal-oxide field effect transistors (MOSFETs). β-Ga2O3 semiconductor has an ultra-wide bandgap of ~ 4.8 eV, a theoretical critical breakdown field strength, Ec ~ 8 MV/cm, making it an excellent candidate for high-voltage or power electronics applications. The numerical simulations have been benchmarked against experimentally reported data. For modeling impact ionization, which is expected to induce intrinsic avalanche breakdown, the Selberherr’s model has been used with appropriate parameterization. For a device with a gate length of 2 μm, 0.6 μm gate-drain spacing, 3.4 μm source-drain spacing, and 20 nm thick Al2O3 gate insulator, the intrinsic breakdown voltage was found to be ~460 V. While self-heating dramatically affects the output current and conductance, it has an insignificant effect on the breakdown voltage. The use of a thinner epitaxial channel was found to increase the breakdown voltage slightly (by ~30 V).

No description available.

No description available.

<p>Beta-gallium oxide (<i>β</i>-Ga₂O₃) is an emerging wide bandgap semiconductor for next generation power devices which offers the potential to replace GaN and SiC. It has an ultra-wide bandgap (UWBG) of 4.8 eV and a corresponding <i>E</i>_brof 8 MV/cm. <i>β</i>-Ga₂O₃also possesses a decent intrinsic electron mobility limit of 250 cm²/V<i>·</i>s, yielding high Baliga’s figure of merit of 3444. In addition, the large bandgap of <i>β</i>-Ga₂O₃gives stability in harsh environment operation at high temperatures. </p> <p>Although low-cost large-size <i>β</i>-Ga₂O₃native bulk substrates can be realized by melt growth methods, the unique property that (100) surface of <i>β</i>-Ga₂O₃has a large lattice constant of 12.23 Å allows it to be cleaved easily into thin and long nano-membranes. Therefore, <i>β</i>-Ga₂O₃FETs on foreign substrates by transferring can be fabricated and investigated before <i>β</i>-Ga₂O₃epitaxy technology becomes mature and economical viable. Moreover, integrating <i>β</i>-Ga₂O₃on high thermal conductivity materials has an advantage in terms of suppressing self-heating effects. </p><p>In this dissertation, structural and material innovations to overcome and improve critical challenges are summarized as follows: 1) Top-gate nano-membrane <i>β</i>-Ga₂O₃FETs on a high thermal conductivity diamond substrate with record high maximum drain current densities are demonstrated. The reduced self-heating effect due to high thermal conductivity of the substrate was verified by thermoreflectance measurement. 2) Local electro-thermal effect by electrical bias was applied to enhance the electrical performance of devices and improvements of electrical properties were shown after the annealing. 3) Thin thermal bridge materials such as HfO₂and ZrO₂were inserted between <i>β</i>-Ga₂O₃and a sapphire substrate to reduce self heating effects without using a diamond substrate. The improved thermal performance of the device was analyzed by phonon density of states plots of <i>β</i>-Ga₂O₃and the thin film materials. 4) Nano-membrane tri-gate <i>β</i>-Ga₂O₃FETs on SiO₂/Si substrate fabricated via exfoliation have been demonstrated for the first time. 5) Using the robustness of <i>β</i>-Ga₂O₃in harsh environments, <i>β</i>-Ga₂O₃ferroelectric FETs operating as synaptic devices up to 400 °C were demonstrated. The result offers the potential to use the novel device for ultra-wide bandgap logic applications, specifically neuromorphic computing exposed to harsh environments.<br></p>