Emerging transparent conducting and semiconducting oxide (TCO) and (TSO) materials have achieved success in display markets. Due to their excellent electrical performance, TSOs have been chosen to enhance the performance of traditional displays and to evaluate their application in future transparent and flexible displays. This dissertation is devoted to the study ZnO-based thin film transistors (TFTs) using multilayer dielectrics and channel layers. Using multilayers to engineer transistor parameters is a new approach. By changing the thickness, composition, and sequence of the layers, transistor performance can be optimized. In one example, Al2O3/Ta2O5 bilayer gate dielectrics, grown by atomic layer deposition at low temperature were developed. The approach combined high dielectric constant of Ta2O5 and the excellent interface quality of Al2O3/ZnO, resulting in enhanced device performance. Using zinc oxide (ZnO)/hafnium oxide (HfO2) multilayer stack as a TFT channel with tunable layer thicknesses resulted in significant improvement in TFT stability. Atomic layer deposited SnO2 was developed as a gate electrode to replace ITO in thin film transistors and circuits. The SnO2 films deposited at 200 °C show low electrical resistivity of ~3.1×10-3 Ohm-cm with the high transparency of ~93%. TFT fabricated with SnO2 gate show excellent transistor properties. Using results from the above experiments, we have developed a novel process in which thin film transistors (TFTs) are fabricated using one binary oxide for all transistor layers (gate, source/drain, semiconductor channel, and dielectric). In our new process, by simply changing the flow ratio of two chemical precursors, C8H24HfN4 and (C2H5)2Zn, in an ALD system, the electronic properties of the binary oxide HZO were controlled from conducting, to semiconducting, to insulating. A complete study of HZO thin films deposited by (ALD) was performed. The use of the multi-layer (HfO2/ZnO) channel layer plays a key role in improving the bias stability of the devices. The low processing temperature of all materials at 160 °C is an advantage for the fabrication of fully transparent and flexible devices. After precise device engineering, including growth temperature, gate dielectric, electrodes (S/D&G) and semiconductor thickness, TFT with excellent device performance are obtained.

In this thesis, an interface passivation by a lattice matched atomic layer deposition (ALD) epitaxial magnesium calcium oxide (MgCaO) on wide-bandgap gallium nitride (GaN) has been applied for the first time and expensively studied via various characterization methods (including AC conductance methods, pulsed current-voltage, and single pulse charge pumping). Also, beta-Ga2O3 with a monoclinic crystal structure that offers several surface oriented channels has been demonstrated as potential beta-Ga2O3 FET. On the other hand, low frequency noise studies in 2-D MoS2 NC-FETs was reported for the first time. Low frequency noise of the devices is systematically studied depending on various interfacial oxides, different thicknesses of interfacial oxide, and ferroelectric hafnium zirconium oxide. Interestingly enough, the low frequency noise is found to decrease with thicker ferroelectric HZO in the subthreshold regime of the MoS2 NC-FETs, in stark contrast to the conventional high-k transistors. Also, the ferroelectric switching speed is found to be related with the maximum electric field applied during the fast gate voltage sweep, suggesting the internal ferroelectric switching speed can be even faster depending on the device’s electrical bias conditions and promises a high speed performance in our ferroelectric HZO

<p>Beta-gallium oxide (<i>β</i>-Ga₂O₃) is an emerging wide bandgap semiconductor for next generation power devices which offers the potential to replace GaN and SiC. It has an ultra-wide bandgap (UWBG) of 4.8 eV and a corresponding <i>E</i>_brof 8 MV/cm. <i>β</i>-Ga₂O₃also possesses a decent intrinsic electron mobility limit of 250 cm²/V<i>·</i>s, yielding high Baliga’s figure of merit of 3444. In addition, the large bandgap of <i>β</i>-Ga₂O₃gives stability in harsh environment operation at high temperatures. </p> <p>Although low-cost large-size <i>β</i>-Ga₂O₃native bulk substrates can be realized by melt growth methods, the unique property that (100) surface of <i>β</i>-Ga₂O₃has a large lattice constant of 12.23 Å allows it to be cleaved easily into thin and long nano-membranes. Therefore, <i>β</i>-Ga₂O₃FETs on foreign substrates by transferring can be fabricated and investigated before <i>β</i>-Ga₂O₃epitaxy technology becomes mature and economical viable. Moreover, integrating <i>β</i>-Ga₂O₃on high thermal conductivity materials has an advantage in terms of suppressing self-heating effects. </p><p>In this dissertation, structural and material innovations to overcome and improve critical challenges are summarized as follows: 1) Top-gate nano-membrane <i>β</i>-Ga₂O₃FETs on a high thermal conductivity diamond substrate with record high maximum drain current densities are demonstrated. The reduced self-heating effect due to high thermal conductivity of the substrate was verified by thermoreflectance measurement. 2) Local electro-thermal effect by electrical bias was applied to enhance the electrical performance of devices and improvements of electrical properties were shown after the annealing. 3) Thin thermal bridge materials such as HfO₂and ZrO₂were inserted between <i>β</i>-Ga₂O₃and a sapphire substrate to reduce self heating effects without using a diamond substrate. The improved thermal performance of the device was analyzed by phonon density of states plots of <i>β</i>-Ga₂O₃and the thin film materials. 4) Nano-membrane tri-gate <i>β</i>-Ga₂O₃FETs on SiO₂/Si substrate fabricated via exfoliation have been demonstrated for the first time. 5) Using the robustness of <i>β</i>-Ga₂O₃in harsh environments, <i>β</i>-Ga₂O₃ferroelectric FETs operating as synaptic devices up to 400 °C were demonstrated. The result offers the potential to use the novel device for ultra-wide bandgap logic applications, specifically neuromorphic computing exposed to harsh environments.<br></p>