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Investigation of Time Domain Modulation and Switching-Mode Power Amplifiers Suitable for Digitally-Assisted TransmittersFrebrowski, Daniel Jordan January 2010 (has links)
Innovation in wireless communication has resulted in accelerating demand for smartphones using multiple communications protocols such as WiFi, Bluetooth and the many cellular standards deployed around the world. The variety of frequency, bandwidth and power requirements associated with each standard typically calls for the implementation of separate radio frequency (RF) front end hardware for each standard. This is a less-than-ideal solution in terms of cost and device area. Software-defined radio (SDR) promises to solve this problem by allowing the RF hardware to be digitally reconfigurable to adapt to any wireless standard. The application of machine learning and cognition algorithms to SDR will enable cognitive radios and cognitive wireless networks, which will be able to intelligently adapt to user needs and surrounding radio spectrum conditions.
The challenge of fully reconfigurable transceivers is in implementing digitally-controlled RF circuits which have comparable performance to their fixed-frequency counterparts. Switching-mode power amplifiers (SMPA) are likely to be an important part of fully reconfigurable transmitters since their switching operation provides inherent compatibility with digital circuits, with the added benefit of very high efficiency. As a step to understanding the RF requirements of high efficiency and switching PAs, an inverse class F PA in push-pull configuration is implemented. This configuration is chosen for its similarity to the current mode class D (CMCD) topology. The fabricated PA achieves a peak drain efficiency of over 75% with 42.7 dBm (18.6 W) output power at 2.46 GHz.
Since SMPAs cannot directly provide the linearity required by current and future wireless communications standards, amplitude information must be encoded into the RF signal in a different way. Given the superior time resolution of digital integrated circuit (IC) technology, a logical solution is to encode this information into the timing of the signal. The two most common techniques for doing so are pulse width modulation and delta-sigma modulation. However, the design of delta-sigma modulators requires simulation as part of the design process due to the lack of closed-form relationships between modulator parameters (such as resolution and oversampling) and performance figures (such as coding efficiency and signal quality). In particular, the coding efficiency is often ignored although it is an important part of ensuring transmitter efficiency with respect to the desired signal. A study of these relationships is carried out to observe the tradeoffs between them. It is found that increasing the speed or complexity of a DS modulated system does not necessarily translate to performance benefits as one might expect. These observations can have a strong impact on design choices at the system level.
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Efficient radio frequency power amplifiers for wireless communicationsCui, Xian 10 December 2007 (has links)
No description available.
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A multi-dimensional spread spectrum transceiverSinha, Saurabh 21 October 2008 (has links)
The research conducted for this thesis seeks to understand issues associated with integrating a direct spread spectrum system (DSSS) transceiver on to a single chip. Various types of sequences, such as Kasami sequences and Gold sequences, are available for use in typical spread spectrum systems. For this thesis, complex spreading sequences (CSS) are used for improved cross-correlation and autocorrelation properties that can be achieved by using such a sequence. While CSS and DSSS are well represented in the existing body of knowledge, and discrete bulky hardware solutions exist – an effort to jointly integrate CSS and DSSS on-chip was identified to be lacking. For this thesis, spread spectrum architecture was implemented focussing on sub-systems that are specific to CSS. This will be the main contribution for this thesis, but the contribution is further appended by various RF design challenges: highspeed requirements make RF circuits sensitive to the effects of parasitics, including parasitic inductance, passive component modelling, as well as signal integrity issues. The integration is first considered more ideally, using mathematical sub-systems, and then later implemented practically using complementary metal-oxide semiconductor (CMOS) technology. The integration involves mixed-signal and radio frequency (RF) design techniques – and final integration involves several specialized analogue sub-systems, such as a class F power amplifier (PA), a low-noise amplifier (LNA), and LC voltage-controlled oscillators (VCOs). The research also considers various issues related to on-chip inductors, and also considers an active inductor implementation as an option for the VCO. With such an inductor a better quality factor is achievable. While some conventional sub-system design techniques are deployed, several modifications are made to adapt a given sub-system to the design requirements for this thesis. The contribution of the research lies in the circuit level modifications done at sub-system level aimed towards eventual integration. For multiple-access communication systems, where a number of independent users are required to share a common channel, the transceiver proposed in this thesis, can contribute towards improved data rate or bit error rate. The design is completed for fabrication in a standard 0.35-μm CMOS process with minimal external components. With an active chip area of about 5 mm2, the simulated transmitter consumes about 250 mW&the receiver consumes about 200 mW. AFRIKAANS : Die navorsing wat vir hierdie tesis onderneem is, beoog om kundigheid op te bou aangaande die kwessies wat met die integrasie van ‘n direkte spreispektrumstelsel (DSSS) sender-ontvanger op ‘n enkele skyfie verband hou. Verskeie tipes sekwensies, soos byvoorbeeld Kasami- en Gold-sekwensies, is vir gebruik in tipiese spreispektrumstelsels beskikbaar. Vir hierdie tesis is komplekse spreisekwensies (KSS) gebruik vir verbeterde kruis- en outokorrelasie-eienskappe wat bereik kan word deur so ‘n sekwensie te gebruik. Alhoewel DSSS en KSS reeds welbekend is, en diskrete hardeware oplossings reeds bestaan, is die vraag na gesamentlike geïntegreerde DSSS en KSS op een vlokkie geïdentifiseer. Vir hierdie tesis is spreispektrumargitektuur aangewend met die klem op KSS substelsels. Dit is dan ook die belangrikste bydrae van hierdie tesis, maar die bydrae gaan verder gepaard met verskeie RF-ontwerpuitdagings: hoëspoed-vereistes maak RF-stroombane sensitief vir die uitwerking van parasitiese komponente, met inbegrip van parasitiese induktansie, passiewe komponentmodellering en ook seinintegriteitskwessies. Die integrasie word eerstens meer idealisties oorweeg deur wiskundige substelsels te gebruik en dan later prakties te implementeer deur komplementêre metaaloksied-halfgeleiertegnologie (CMOS) te gebruik. Die integrasie behels gemengdesein- en radiofrekwensie(RF)-ontwerptegnieke – en finale integrasie behels verskeie gespesialiseerde analoë substelsels soos ‘n klas F-kragversterker (KV), ‘n laeruis-versterker (LRV), en LC-spanningbeheerde ossileerders (SBO’s). Die navorsing oorweeg ook verskeie kwessies in verband met op-skyfie induktors en oorweeg ook ‘n aktiewe induktorimplementering as ‘n opsie vir die SBO. Met sodanige induktor is ‘n beter kwaliteitsfaktor haalbaar. Hoewel enkele konvensionele substelsel-ontwerptegnieke aangewend word, word daar verskeie wysigings aangebring om ‘n gegewe substelsel by die ontwerpvereistes vir hierdie tesis aan te pas. Die bydrae van die navorsing is hoofsaaklik die stroombaanmodifikasies wat gedoen is op substelselvlak om integrasie te vergemaklik. Vir veelvoudige-toegang kommunikasiestelsels waar ‘n aantal onafhanklike gebruikers dieselfde seinkanaal moet deel, kan die sender-ontvanger voorgestel in hierdie tesis meewerk om die datatempo en fouttempo te verbeter. Die ontwerp is voltooi vir vervaardiging in ‘n standaard 0.35-μm CMOS-proses met minimale eksterne komponente. Met ‘n aktiewe skyfie-oppervlakte van ongeveer 5 mm2, verbruik die gesimuleerde sender ongeveer 250 mW en die ontvanger verbruik ongeveer 200 mW. / Thesis (PHD)--University of Pretoria, 2011. / Electrical, Electronic and Computer Engineering / unrestricted
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