No description available.

No description available.

No description available.

Thin layered systems can be considered as a solution to the repair and protection of concrete structures. This subject was studied in the current investigation. Some common uses of these systems include protection, upgrading and rehabilitation of the floor slabs,restoration of appearance of the structures, impermeability, skid resistance, wear resistance, and protection of the reinforcing steel of concrete structures against atmospheric or chemical attack. However it can be said that protection, upgrading and rehabilitation of floor slabs are the main uses for the design of modem thin layered systems. For example a thin layer of a polymer concrete with a thickness of less than 3 nun can resist a very highly concentrated load resulting from a steel wheel rolling load of 5000 N without any sign of defect. Thin layer systems therefore include traditional screeds, externally bonded steel plates, plasters and coatings as well as the more recent hi - tech. systems. Like any other structure, a thin layered system may break down as the result of many causes. Among other types of failures, delamination defect is the most common mode of failure and particularly relevant to a thin layered system. This phenomenon which mostly occur between the upper layer directly subjectedto the load and the subsequent layer, is due to debonding or slippage at the interface of the two layers. A delamination may occur at the interface of a thin layered system even without any sign of failure in other parts of the structure. Steel wheeled trolleys and fork - lift trucks are among the most anticipated types of loading and causes of failures in the thin layered systems. Different combinations of thin layered systems were prepared using some special flooring materials, both in small and large scales. Despite the lack of any standard test, the action of a steel wheel rolling load on the ready made and purpose made specimens of thin layered systems was well simulated using the Steel Wheel Rolling Load Rig. The NUROLF, Newcastle University Rolling Load Facility, was also used for simulating the action of a tyred vehicle wheel rolling load on the thin layered systems of large scale. Some simple ways for detecting any possible delamination at the interface of the thin layered systems were examined. In addition to the available material characteristics tests, a relatively new simple shear box test was proposed for defming the relationship between normal stress and the correspondings hear strength for each combination of the materials at each age of the test. The results were then used as the basis for the subsequent structural analysis. The structural analysis of the systems was carried out for both of the experiments using the finite element method and the interface technique. In spite of the simplifications made in the solution, the analytical results were consistent with the experimental results to a considerable extent. Based on the results of this investigation, a relatively constitutive procedure was concluded for predicting the behaviour of a thin layered system under the action of a wheel rolling load with regard to the delamination defect.

No description available.

In this study, glass and Kevlar® fibers reinforced epoxy composites were manufactured and characterized using different techniques. The effect of thermal exposure on the flexural properties of the composites was investigated to ascertain its suitability for the intended application in cowling panels of light engine aircraft. Thermogravimetric analysis (TGA) was carried out on both reinforced and unreinforced epoxy resin to evaluate their thermal stability at elevated temperatures. Dynamic mechanical thermal analysis was carried out to evaluate the effects of thermal exposure, applied strain and frequency on the dynamic mechanical response of the composites. The effects of the applied resin hardener and thermal exposure on the flexural strength, flexural modulus and dynamic impact response of the composites were also investigated. The flexural properties were determined using 3-point bending test, while the impact test was carried out using Split Hopkinson Pressure Bar (SHPB). TGA analysis of the reinforced and unreinforced epoxy showed no significant weight loss until the test samples were heated above 250°C in an inert atmosphere. Dynamic Mechanical Thermal Analysis (DMTA) on the composites indicated the glass transition temperature to lie between 80 and 100°C. The results of the flexural and impact tests showed that the mechanical integrity of both glass and Kevlar® fiber reinforced epoxy composites remained unimpaired by radiative or convective heat exposure for up to 3 h until the exposure temperature exceeded 200°C. This is much higher than the service temperature of cowling panels of light engine recreational aircrafts. When the manufactured fiber reinforced epoxy composites were exposed to temperature above 200°C matrix degradation occurred, which became very significant when the exposure temperature was higher than 250°C. Extensive delamination and matrix cracking occurred when the composites were exposed to the temperature range 250°C - 300°C for 1 h. Fiber-matrix debonding was not observed in the composite except after failure under impact loading. This is evidence of the fact that the epoxy matrix was adequately wetted by both the glass and Kevlar® fibers resulting in the strong fiber/matrix interfacial bonding. While the Kevlar® reinforced epoxy displayed a better damage tolerance under flexural and impact loading, glass fiber reinforced epoxy showed higher strength but lower damage tolerance. Glass fiber reinforced epoxy also showed more resistance to damage under exposure to thermal flux than Kevlar® reinforced epoxy. Under impact loading, the Kevlar® reinforced composite failed by delamination with no fiber rupture, whereas the glass fiber reinforced epoxy failed by matrix cracking, debonding, fiber rupture and fiber pullout. The results from this research have established the effect of radiative and convective thermal exposure on the mechanical behavior of the fabricated Kevlar® fiber and glass reinforced epoxy composites. The maximum temperature reached on the inner surface of the cowling panels of a typical light engine recreational aircraft due to heat radiations from the engine block has been estimated to be about 65°C. This is lower than the glass transition temperature of the epoxy matrix as obtained from DMTA. The low temperature rise is due to inflow cooling air into the cowling chamber in flight. The results of the current investigations suggest the suitability of composite materials for the intended application. The intensity of thermal exposure, to which the materials will be exposed in such application, may not cause any significant damage to the mechanical integrity of the composite. However, since the difference between the possible exposure temperature and the glass transition temperature is only a little over 20°C, a layer of thermal insulator on the inner surface of the cowling made of fiber reinforced epoxy will be desirable to further sustain the mechanical integrity of the composites when selected for use as choice materials for cowling panels of light engine aircraft.

Graphite epoxy composites are being used in aerospace industry and spacecraft applications for their light weight and high strength. As a matter of fact these materials also have some disadvantages like damage which is hazardous when used in cryogenic application. Composite materials IM7/977-2, IM7/5555 and IM7/5276-1 are of interest for the aerospace industry and this research concentrates on study of microcracking, delamination and other defects in the [0/90]s composite laminates of the above materials. These materials were uni-axially tested to pre-determined stress levels and the damages in the material were recorded in the form of microcrack density at different stress levels. In this research work the use of X-Ray Microtomography has proven to be an excellent tool to characterize the crack connectivity and damage information three dimensionally. Dye penetrant technique was also used in this work to enhance the visibility of the cracks.

Das Wissen um die strukturellen und elektronischen Eigenschaften verborgener Metall-Organik-Grenzflächen ist entscheidend für die Optimierung und Verbesserung der Leistungsfähigkeit von auf organischen Halbleitern basierenden Bauteilen. In der vorliegenden Arbeit wurde ein Delaminationskonzept für das Ultrahochvakuum (UHV) umgesetzt und optimiert, mit dessen Hilfe an Modellsystemen verborgene Grenzflächen für oberflächensensitive Methoden zugänglich gemacht und im Anschluss hinsichtlich ihrer elektronischen und topographischen Eigenschaften untersucht wurden. Die Erfahrungen und Ergebnisse dieser Arbeit stellen im Bezug auf Untersuchungen und die Optimierung von organischen Bauteilen und ihre verborgenen Grenzflächen einen neuartigen Zugang dar. Der erste Schwerpunkt der Arbeit befasste sich am Beispiel von verborgenen Metall/NTCDA- und Metall/ PTCDA-Grenzflächen mit der Frage, wie verborgene Grenzflächen erfolgreich für oberflächensensitive Methoden zugänglich gemacht werden können. Nach einer Eruierung eines Klebstoffs, dessen Eigenschaften den Anforderungen hinsichtlich der Festigkeit, Verarbeitung und UHV-Tauglichkeit genügt, konnte gezeigt werden, dass es mit ausreichender Sorgfalt möglich ist, einen unmittelbaren Zugang zu verborgenen Grenzflächen zu erhalten. Es konnten dabei Kontakte von ca. 10 × 15 mm2 Größe offengelegt werden. Dabei zeigte sich auch, dass der Klebstoff für die Qualität der Delamination eine entscheidende Rolle spielt. Auf der einen Seite bestimmt das Klebeverhalten des Klebstoffs die Größe der möglichen Delaminationsfläche, und auf der anderen Seite bestimmt seine chemische Zusammensetzung das Ausgas- und Diffusionsverhalten, welche Einfluss auf den Kontaminationsgrad der delaminierten Grenzflächen haben. Mit Hilfe von dickeren Metallschichten konnte erreicht werden, dass leichter zu verarbeitende Klebstoffe (Klebestreifen) für die Delamination verborgener Grenzflächen verwendet werden können. Auch konnte die gesamte Prozedur, eine verborgene Grenzfläche zu präparieren und zu delaminieren, erfolgreich in-situ im UHV durchgeführt werden. Als schwierig zeigte sich die thermische Desorption von Molekülschichten von delaminierten Metallkontakten. Bei der thermischen Ausdünnung (100-250_C) wird unweigerlich die Morphologie des darunter liegende Metallkontakts verändert. Zudem wurden Konzepte getestet, mit welchen PTCDA-Schichten von delaminierten Kontakten mittels Lösungsmitteln entfernt wurden, um im Anschluss daran die Kontakttopographie zu untersuchen. Es wird vermutet, dass der Einfluss der Lösungsmittel auf den delaminierten Kontakt zwar gegeben, jedoch gering ist. Im zweiten Schwerpunkt dieser Arbeit konnten für verborgene Metall(Au,Ag)/PTCDA und Ag/NTCDA-Grenzflächen nach ihrer Delamination einige Gemeinsamkeiten festgestellt werden: Nach der Delamination der Top-Kontakte befinden sich auf den Metallkontakten inhomogene Molekülschichten. Dabei waren auf den PTCDA-bedeckten Kontakten dickere Schichten (4-5 ML PTCDA auf Ag-Kontakt) und auf den NTCDA-bedeckten Kontakten große Bereiche von mindestens 2 mm im Durchmesser mit Monolagen vorhanden. Auch topographisch zeigten sich Gemeinsamkeiten. So wiesen die mit Molekülmultilagen bedeckten Bereiche glatte Oberflächen auf, während die Metalloberflächen selbst zerklüftete, mäanderartige und raue Oberflächen aufwiesen. Eine weitere Gemeinsamkeit war, dass der Klebstoff die PE-spektroskopische Untersuchung der Valenzzustände erheblich erschwerte. Des Weiteren konnte die Molekülschicht zwar thermisch ausgedünnt werden, jedoch konnten danach keine Valenzzustände untersucht werden. Als letzter gemeinsamer Gesichtspunkt waren topographische Einflüsse des Klebstoffs, welcher durch seine mikro- wie makroskopischen thermischen Verformungen und Blasenbildung massiv die topographische Struktur des Kontakts verändert. Bei der Untersuchung von in-situ delaminierten verborgenen Grenzflächen stand zunächst die Metall(Au,Ag)/PTCDA-Grenzflächen im Fokus. Bei delaminierten Au/PTCDA-Kontakten war die offengelegte Grenzfläche nach der Delamination nicht intakt, und es fanden sich Löcher in der Metallschicht mit mehreren μm Durchmesser. Durch diese waren Bestandteile des Klebstoffs (VACSEAL) photoelektronenspektroskopisch und lichtmikroskopisch auf der verborgenen Grenzfläche zu sehen, die gerade in der UV-Photoelektronenspektroskopie (UPS) eine Untersuchung der Valenzzustände dünner PTCDA-Schichten besonders erschweren. Das HOMO der PTCDA-Multilage liegt bei delaminierten Au/PTCDA-Kontakten bei etwa 2,3eV. Die Untersuchung von Ag/PTCDA-Kontakten zeigte intakte Metallkontaktfilme nach der Delamination. Es konnte zudem die Molekülschicht thermisch bei 260_C auf 2-4 Monolagen erfolgreich ausgedünnt werden, so dass Valenzzustände untersucht werden konnten. Der Klebstoff erschwerte jedoch auch hier die Untersuchung. Aufgrund verbreiterter Spektren konnten die Lagen des HOMO und FLUMO des in-situ delaminierten und ausgedünnten Ag/PTCDA-Kontakts ungefähr bei 1,9 eV bzw. 0,7 eV bestimmt werden. Weiterhin wurden offengelegte Ag/NTCDA-Grenzflächen untersucht. Bei Ag/ NTCDAKontakten ist es gelungen, durch sukzessives Erhöhen der Metallschichtdicke den Einfluss des Klebstoffs zu minimieren bzw. gänzlich ohne diesen auszukommen. Bereits ab Silberschichtdicken von 2,5 μm können verborgene Grenzflächen mit geschickter Technik so delaminiert werden, dass sich Kontaktbereiche ohne Klebstoffanteile ergeben. Dabei wurde ein Drittel des Kontakts verklebt und die restlichen zwei Drittel standen nach der Delamination frei von Klebstoffbestandteilen für Untersuchungen zur Verfügung. Ein weiterer Erfolg bezüglich der Delamination war nicht nur, dass leichter zu verarbeitende Klebstoffe (Klebestreifen) verwendet werden konnten, sondern vor allem, dass es gelang, Ag/NTCDA-Kontakte zu delaminieren, deren Molekülschichtdicken im Monolagenbereich vorlagen. Damit konnte zum ersten Mal die direkte Molekül-Metall-Wechselwirkung an der verborgenen Grenzfläche untersucht werden, ohne dass der Kontakt für die Klebstoffaushärtung geheizt und die NTCDA-Schicht thermisch desorbiert werden musste. Das mit UPS ermittelte HOMO lag dabei bei 2,3 eV und das FLUMO bei 0,6 eV. Zudem wurde eine Austrittsarbeit von 4,9 eV ermittelt. Ferner konnte die Valenzstruktur eines vollständig in-situ präparierten und delaminierten Kontakts im UHV untersucht werden. Die Ergebnisse zeigten keinerlei Unterschiede zu den Kontakten, die für die Verklebung an Luft gebracht wurden. Ferner wurde ein Modell vorgestellt, mit dem erklärt werden kann, weshalb sich nach der Delamination nur einige wenige Moleküllagen auf dem Metallkontakt befinden. Bei den allgemeinen topographischen Untersuchungen ergab sich, dass die delaminierten Ag/NTCDA-Kontakte relativ rau mit einer RMS-Rauheit im Bereich von 18-24 nm und einer Skewness von 0,5 bis 1,5 waren. Ebenfalls wurden zwei Auffälligkeiten von delaminierten Ag/NTCDA-Kontakten untersucht: Die erste waren topographische Strukturen, die im Lichtmikroskop Löcher in der Metallschicht zu sein schienen. Diese erwiesen sich im Rasterkraftmikroskop (RKM) als lokal begrenzte Bereiche mit erhöhter Rauheit. Die zweite topographische Auffälligkeit waren Bereiche auf den delaminierten Ag/NTCDA-Kontakten, die im Lichtmikroskop als dunkle Flecken verschiedener Größe erschienen. Bei RKM-Untersuchungen konnten die dunklen Bereiche als NTCDA-Kristallite identifiziert werden, deren Dicke zwischen 500-600 nm lag. Zum Abschluss soll an dieser Stelle noch angemerkt werden, dass die Übertragung der Erfahrungen und Ergebnisse dieser Arbeit auf andere Systeme möglich ist. Das hier erfolgreich angewandte Delaminationskonzept besticht durch einfache Handhabung und Untersuchungsmöglichkeiten im UHV. Gerade im Hinblick auf eine vollständige in-situ Präparation und Delamination gibt es jedoch noch erhebliches Optimierungspotential, bis die Untersuchung von verborgenen Grenzflächen anderer Systeme, die besonders empfindlich gegenüber Umgebungsbedingungen sind, erfolgreich durchgeführt werden und zur Optimierung von "organischen" Bauteilen beitragen können. / The knowledge of structural and electronic properties of buried metal/organic semiconductor interfaces is crucial for the optimisation and the improvement of devices based on organic semiconductors. The present thesis establishes an optimised concept of a delamination technique suitable for ultra high vacuum (UHV) with which model systems of buried interfaces were made accessible for surface sensitive methods which were applied to investigate their electronic and topographical properties. The experience with and results of this work are valuable for the investigation and optimisation of organic devices and their buried interfaces. A primary focus of this work is on the question how buried interfaces could be accessed successfully for surface sensitive methods using buried metal/NTCDA and metal/PTCDA interfaces as model systems. Having found an adhesive which was able to meet the demands of strength, processing and UHV-suitability it was proved that it is possible, with some care, to access the buried interfaces directly. Contacts of approximately 10 × 15 mm2 in size were accessed. Furthermore, the experience showed that the adhesive plays a decisive role for the quality of delaminated contacts: On the one hand the size of the delaminated contacts is determined by the properties of the adhesive, on the other hand its chemical compounds determine the degassing and diffusion properties which have an influence on the degree of contamination of the delaminated interface. Moreover adhesive tapes were successfully used, which were easy to handle for the delamination of buried interfaces by means of thicker metal contact layers. Moreover, the whole process of preparation and subsequent delamination of a buried interface was successfully performed in-situ in UHV. The thermal desorption of molecular layers from delaminated metal contacts proved to be difficult. Thinning out the molecular layers thermally (100−250_C), makes the change in morphology of the metal contact underneath inevitable. Additionally, concepts are discussed with which layers of PTCDA were removed from delaminated contacts by means of solvents in order to investigate the contact topography thereupon. It is assumed that there is an influence of the solvents on the delaminated contact but on a small scale. The second focus of the thesis is on the investigation of the electronical and topographical properties of the buried interfaces, for which some similarities between delaminated metal (Au,Ag)/ PTCDA- and Ag/NTCDA interfaces were found: After the delamination of top-contacts there were inhomogeneous layers of molecules on the metal contacts. Whereas PTCDA covered metal contacts had thicker molecular layers (4 − 5 ML PTCDA on Ag), NTCDA covered contacts showed only one monolayer coverage over large areas of at least 2 mm in diameter. There were also topographical similarities. Regions with multilayer coverage showed smooth surfaces whereas metal surfaces showed a fissured, meander-like and rough surface. Both contact systems also had in common that the adhesive made PES investigations of valence states very difficult. Furthermore, it was possible to thin out the molecular layers thermally but afterwards no valence states could be measured. The last aspect both contacts had in common was the influence of the adhesive on the topography of the metal surfaces. The topographical structures of the contacts were massively altered due to thermally induced, micro- and macroscopically noticeable changes as well as the creation of blisters of the adhesive. Investigating in-situ delaminated buried interfaces, the focus was on metal (Au,Ag)/PTCDA interfaces first. The revealed interfaces of delaminated Au/PTCDA contacts were not intact after delamination and showed holes in the metal layer of several microns in diameter. Through these holes the adhesive (VACSEAL) could be measured and seen on the buried interface by means of PES and optical microscopy, respectively, which made UPS investigations of valence states of thin PTCDA layers rather difficult. The PTCDA multilayer HOMO was found to be at approx. 2.3 eV for delaminated Au/PTCDA contacts. The investigation of Ag/PTCDA contacts showed intact metal films after delamination. The molecular layers could be successfully desorbed thermally at 260_C to 1-3 monolayers so that valence states were investigated. The adhesive, however, made investigations rather difficult. The spectra of the in-situ delaminated and thermally desorbed Ag/PTCDA contact were noticeably broadened so that the positions of HOMO and FLUMO could only be estimated at 1.9 eV and 0.7 eV, respectively. Additionally, interfaces of Ag/NTCDA contacts were investigated. By incrementally increasing the thickness of the metal layer the influence of the adhesive on the Ag/NTCDA contacts was successfully minimised or even made the use of the liquid adhesive dispensable. Even at silver thicknesses of 2.5 μm the buried interfaces can be delaminated in that way that there are parts of the contact having no adhesive underneath. In this case one third of the contact was glued to a substrate and the remaining two thirds were investigated without amounts of adhesive material. Not only the usage of adhesive tapes, which are easier to handle, was a further success as far the delamination process is concerned, but also the fact that Ag/NTCDA contacts were delaminated in that way which had a coverage of only a few monolayers. Consequently, the interaction between molecules and metal of the buried interface could be investigated without the contact being heated for curing the adhesive or for molecule desorption. With UPS it was found that the HOMO position was at 2.3 eV and the position of the FLUMO at 0.6 eV. Additionally, the work function was determined to be 4.9 eV. Furthermore, the valence structure of a contact was investigated which was prepared and delaminated completely in-situ without breaking the UHV. The results did not show any discrepancies to those where contacts were being exposed to air for gluing. Also, a model is presented which could help to explain why only monolayers remain on the metal contact after delamination. Investigations of the topography revealed that delaminated Ag/NTCDA contacts are relatively rough at a RMS-roughness in the range of 18-24 nm and had a skewness of 0.5 to 1.5. Finally, two peculiarities of delaminated Ag/NTCDA contacts were investigated: The first one were topographical structures which seemed to be holes in the metal layer seen through the optical microscope. By means of atomic force microscopy (AFM) it was revealed that these structures where small areas of a higher roughness. The second topographical peculiarity were dark areas of different sizes on delaminated Ag/NTCDA contacts seen in the optical microscope. AFM investigations could identify these dark areas as NTCDA-crystallites which had a thickness between 500 to 600 nm. Summing up, it should be noted that all experiences and results of this work can also be translated successfully to other systems. The advantages of the delamination concept used here is the simple handling and the possibility to do investigations under UHV conditions. Regarding the complete in-situ preparation and delamination there is still a potential to optimise the set-up. In doing so, other systems of buried interfaces being sensitive to ambient conditions could be investigated successfully in order to improve and to optimise organic based electronic devices.

High temperature composite materials used in aerospace applications are exposed to extremely harsh conditions and must be able to withstand moisture and extremes of temperature. For example, the surface of an aircraft flying at Mach 2.4 has been estimated to reach around 177°C as a result of aerodynamic heating. This thesis has examined the effect of isothermal aging on two high temperature composite materials, a novel CSIRO composite and a commercial composite, both based on bismaleimides. Changes in mechanical properties and resin chemistry at two different temperatures were measured in order to assess the validity of accelerated aging tests. ¶ Delamination is a major cause of failure in materials, therefore, the Mode I interlaminar fracture toughness (GIC) of both materials was measured using the double cantilever beam (DCB) test. After aging at 250°C, the CSIRO CBR 320/328 composites exhibited better retention of GIC than the CIBA GEIGY Matrimid® 5292 composites. After 6 weeks of aging at this temperature, the CBR 320/328 material retained 100% of its initial interlaminar fracture toughness, however the Matrimid® 5292 material retained only 64% of its initial GIC. This trend was reversed at the lower aging temperature, when after 30 weeks of aging at 204°C, GIC was measured at 13% of its original value for the CSIRO composites, whereas it was measured at 64% in the case of the Matrimid® composites. When the fracture surfaces of these specimens were examined using scanning electron microscopy (SEM), the commercial material was observed to show an increasing degree of porosity with aging at 204°C. It was concluded that the good property retention at the temperature, despite this observed porosity, was a result of the excellent fibre/matrix adhesion exhibited by this material. ¶ Chemical degradation of the matrix of the composites was monitored by Fourier Transform Infrared (FTIR) and Raman Spectroscopy. Chemical changes at the core of both of these materials were found to occur concurrently with the observed changes in interlaminar fracture toughness. FTIR analysis of both matrix materials revealed the predominant degradation mechanism to be oxidation, specifically the oxidation of the methylene group bridging two aromatic rings common to the structure of both resins, was substantiated by the ingrowth of a broad peak centred at 1600cm-1. In addition to this, the pyromellitic anhydride unit present only in the CBR 320/328 composites was found to be highly resistant to the effects of aging, whereas the saturated imide, common to the cured structures of both materials, was observed to degrade. ¶ Raman spectroscopy showed an increase in the intensity of a peak at 1646 cm-1 in the Matrimid® 5292 composites aged at 250°C towards the centre of the sample as a result of increased reaction of the allylic carbon-carbon double bond. At 204°C, the degree of reaction increased towards the surface of the material, possibly as a result of a reverse Diels-Alder reaction. The glass transition temperatures of both materials were found to decrease with aging, with the exception of the CSR 320/328 composites aged at 204°C, which initially increased due to continued crosslinking of the resin. ¶ It is concluded that the degradation mechanisms at the two aging temperatures are very different. The reliability of results from accelerated (elevated temperature) aging tests has been drawn into doubt.

90nm wafer process has been released in production, but the bump pitch released in production is 180um. The major problem is the yield of solder paste printing process below 180um will be less than 80%. It means the cost will be very high. Thus it is difficult to make 150um bump pitch by using printing process in production. Substrate C4 pad will be bumped by pre-solder, and it will be jointed with wafer bump after re-flow process. The printing process is the most popular process in C4 pad pre-solder due to low cost and high throughput. But the challenge of 150um and even more of the wafer bump pitch shrinkage are the inevitable trend. So, a lot of substrate manufacturers are trying to develop the new process for C4 pro-solder pitch less than 100um. As soon as the C4 pad pre-solder pitch has been shrunk, the solder volume will be shrunk as well. It means the bump structure will be getting weak, and it may not pass the reliability tests. Thus, to evaluate the workability of bump structure is our purpose. First, the simulation software is used to compare the fatigue lives of two structures by using solder bump and copper bump substrates during thermal cycling test, and then to proceed the whole FCBGA process and reliability tests. The result of evaluation confirm the workability of FCBGA product using copper bump substrate, and it can be used with the same parameter and machine in solder bump substrate. Keyword¡GFCBGA, Substrate, Bump, Cold Joint, Delamination