A research project was undertaken to integrate Ultrasonic Consolitation (UC) and Direct-Write (DW) technologies into a single apparatus to fabricate embedded electrical systems within an ultrasonically consolidated metallic enclosure. Process and design guidelines were developed after performing fundamental research on the operational capabilities of the implemented system. In order to develop such guidelines, numerous tests were performed on both UC and DW. The results from those tests, as well as the design and process guidelines for the fabrication of an embedded touch switch, can be used as a base for future research and experimentation on the UC-DW apparatus. The successful fabrication of an embedded touch switch proves the validity of the described design and process parameters and demonstrates the usefulness of this integration.

With the industry striving for smaller devices, new technologies are developed to further miniaturize electronics devices. To this end, realization of 3D/non-planar interconnects, which aim at miniaturizing the interconnects formed between components on the same device, has attracted many researchers. This thesis focuses on a feasibility analysis for developing non-planar interconnects on various flexible substrates using laser assisted maskless microdeposition (LAMM), which is a pressure-less process. There are two types of flexible substrates that are used: double-sided copper substrates separated by a layer of polyethylene terephthalate (PET) as well as a polyethylene terephthalate flexible substrate with surface-mounted resistors. For both substrates, multiple types of experiments were conducted to discover procedures which result in the highest rate of success for forming conductive interconnects. Optimal process parameters and deposition techniques were determined after multiple experiments. After experiments were completed, the resultant substrates were subject to various characterization methodologies including optical and scanning electron microscopy, energy-dispersive X-ray spectroscopy, X-ray diffraction and profilometery. The results of these methodologies are documented in this thesis. After many types of experiments involving substrate manipulation of the double-sided copper substrates, it was shown that the silver nano-particles were more likely to form a conductive interconnect when a polished slant was fabricated on the substrate. Many deposition patterns were used for the flexible substrates with surface-mounted resistors. Of these patterns, the two patterns, the ‘zigzag’ and ‘dot solder’ patterns, proved to have a much higher success rate for creating conductive interconnects compared to the other patterns. During this study, the results of the experiments using the LAMM process show that this technology has great potential for creating non-planar interconnects on flexible substrates. The experiments however suggest that the process is very sensitive to the material composition and process parameters. As such, with a small change in parameters, the 3D interconnects can fail to be produced. It was also observed that the possibility of silver interconnect fractures is higher where dissimilar materials with different thermal expansion rates are used for the underlying substrates.

With the industry striving for smaller devices, new technologies are developed to further miniaturize electronics devices. To this end, realization of 3D/non-planar interconnects, which aim at miniaturizing the interconnects formed between components on the same device, has attracted many researchers. This thesis focuses on a feasibility analysis for developing non-planar interconnects on various flexible substrates using laser assisted maskless microdeposition (LAMM), which is a pressure-less process. There are two types of flexible substrates that are used: double-sided copper substrates separated by a layer of polyethylene terephthalate (PET) as well as a polyethylene terephthalate flexible substrate with surface-mounted resistors. For both substrates, multiple types of experiments were conducted to discover procedures which result in the highest rate of success for forming conductive interconnects. Optimal process parameters and deposition techniques were determined after multiple experiments. After experiments were completed, the resultant substrates were subject to various characterization methodologies including optical and scanning electron microscopy, energy-dispersive X-ray spectroscopy, X-ray diffraction and profilometery. The results of these methodologies are documented in this thesis. After many types of experiments involving substrate manipulation of the double-sided copper substrates, it was shown that the silver nano-particles were more likely to form a conductive interconnect when a polished slant was fabricated on the substrate. Many deposition patterns were used for the flexible substrates with surface-mounted resistors. Of these patterns, the two patterns, the ‘zigzag’ and ‘dot solder’ patterns, proved to have a much higher success rate for creating conductive interconnects compared to the other patterns. During this study, the results of the experiments using the LAMM process show that this technology has great potential for creating non-planar interconnects on flexible substrates. The experiments however suggest that the process is very sensitive to the material composition and process parameters. As such, with a small change in parameters, the 3D interconnects can fail to be produced. It was also observed that the possibility of silver interconnect fractures is higher where dissimilar materials with different thermal expansion rates are used for the underlying substrates.

The layer-by-layer nature of additive manufacturing (AM) allows for access to the entire build volume of a component during manufacture including the internal structure. Voids are accessible during the build process and allow for components to be embedded and sealed with subsequently printed layers. This process, in conjunction with direct write (DW) of conductive materials, enables the direct manufacture of parts featuring embedded electronics, including interconnects and sensors. The scope of previous works in which DW and AM processes are combined has been limited to single material AM processes. The PolyJet process is assessed for hybridization with DW because of its multi-material capabilities. The PolyJet process is capable of simultaneously depositing different materials, including rigid and elastomeric photopolymers, which enables the design of flexible features such as membranes and joints. In this work, extrusion-based DW is integrated with PolyJet AM technology to explore opportunities for embedding conductive materials on rigid and elastomeric polymer substrates. Experiments are conducted to broaden the understanding of how silver-loaded conductive inks behave on PolyJet material surfaces. Traces of DuPont 5021 conductive ink as small as 750?m wide and 28?m tall are deposited on VeroWhite+ and TangoBlack+ PolyJet material using a Nordson EFD high-precision fluid dispenser. Heated drying at 55°C is found to accelerate material drying with no significant effect on the conductor's geometry or conductivity. Contact angles of the conductive ink on PolyJet substrates are measured and exhibit a hydrophilic interaction, indicating good adhesion. Encapsulation is found to negatively impact conductivity of directly written conductors when compared to traces deposited on the surface. Strain sensing components are designed to demonstrate potential and future applications. / Master of Science

A wide variety of tunable physio-chemical properties make ZnO nanowires a promising candidate for functional device applications. Although bottom-up grown nanowires are producible in volume, their high-throughput device integration requires control over dimensions and, more importantly, of precise placement. Thus development of top-down fabrication routes with accurate device positioning is imperative and hence pursued in this thesis. ZnO thin film transistors (TFT) were fabricated using solution based precursor zinc neodecanoate. A range of ZnO thin films were prepared by varying process parameters, such as precursor concentrations and annealing temperatures, and then analysed for their optical and electrical characteristics. ZnO TFTs prepared from a 15 % precursor concentration and annealing at 700 $^\circ$C exhibited best device performance with a saturation mobility of 0.1 cm$^2$/V.s and an on/off ratio of 10$^7$. Trap limited conduction (TLC) transport was found to be dominant in these devices. A direct-write electron beam lithography (EBL) process was developed using zinc naphthenate and zinc neodecanoate precursors for the top-down synthesis of ZnO nanowires. Nanoscale ZnO patterns with a resolution of 50 nm and lengths up to 25 $\mu$m were fabricated. A linear mobility of 0.5 cm$^2$/V.s and an on/off ratio of $\sim$10$^5$ was achieved in the micro-FETs with 50 $\mu$m channel width. Interestingly, on scaling down the ZnO channel width down to 100 nm, almost two orders of magnitude enhancement in the linear mobility was observed, which reached $\sim$33.75 cm$^2$/V.s. Such increment in the device performance was attributed to the formation of larger grains and thus reduction in the grain-boundary scattering. Six volatile organic compounds (VOCs) were sensed at room temperature using the direct-write EBL fabricated ZnO devices under UV sensitisation. As the surface-to-volume ratio increases with the decreasing channel width (from 50 $\mu$m to 100 nm), sensing response of the ZnO devices becomes more significant. Ppm level detection of various VOCs was observed; with a 25 ppm level Anisole detection being the lowest concentration. Additionally, using 100 nm device, detection of 10 ppm NO$_2$ was achieved at room temperature. The sensing response towards NO$_2$ was found to be increased with UV illumination and sensor temperature. This led to exhibit $\sim$171 % sensing response for a 2.5 ppm level of NO$_2$.

Three types of poly(norbornane carbonate) or PNC oligomers were synthesized and characterized via spectroscopic methods and elemental analyses to validate their chemical structures. Using the results from proton nuclear magnetic resonance (1H NMR) experiments, the degree of polymerization and size of each PNC chain was estimated via end-group analysis. All three types of PNC structures were both thermally-labile and acidolytically-labile, allowing them to be used as sacrificial materials in both direct-write and thermally-processed template systems. Thermogravimetric analysis (TGA) data was used to determine the kinetic parameters for the thermolytic decomposition reactions and evolved-gas analysis via mass spectrometry (TGA-MS) was used to determine the mechanisms for thermolytic degradation. PNC oligomers were freely-mixed with hydrogen silsesquioxane (HSQ) to form solutions that were spin-coated to form templated films. Transmission electron microscopy (TEM) showed that the free-mixing of PNCs with HSQ resulted in the agglomeration of the porogen molecules during the spincoating step. This phase-segregation produced domain sizes much larger than those of the individual chains, and during decomposition large pores were produced. To combat the phase segregation, hydrosilylation reactions were used to covalently bond vinyl end-capped PNC chains to silane-functionalized siloxane and silsesquioxane molecules. These matrix-like materials served as compatibilizers in order to improve the phase-compatibility of the sacrificial polymers in HSQ films. NMR and GPC analyses showed that the solids recovered from the hydrosilylation reactions were binary mixtures of hybrid nanocomposite molecules and residual ungrafted PNC chains. TEM imaging showed that the domains in these nanocomposite films had bimodal size distributions due to the presence of two components in the mixtures. The hybrid molecules produced pores ranging in size from about 6-13 nm as a result of improvements in the phase-compatibility of the grafted oligomers. However, the residual ungrafted oligomers in the blends produced larger domains measuring 30-40 nm. It is believed that separation difficulties can be avoided if the vinyl termination reaction conditions can be adjusted to ensure 100% conversion of all the terminal hydroxyl groups to vinyl groups. Doing so would allow all PNC chains to be grafted during hydrosilylation reaction; thus, avoiding the recovery of free PNC oligomers.

No description available.

Low profile, conformal antennas have considerable advantages for Aerospace and Military platforms where conventional antenna system add weight and drag. Direct Write (DW) technology has been earmarked as a potential method for fabricating low profile antennas directly onto structural components. This thesis determines the key design rules and requirements for DW fabrication of planar antennas. From this, three key areas were investigated: the characterisation of DW ink materials for functionality and durability in harsh environments, localised processing of DW inks and the optimisation of DW conductive ink material properties for antenna fabrication. This study mainly focused on established DW technologies such as micro-nozzle and inkjet printing due to their ability to print on conformal surfaces. From initial characterisation studies it was found that silver based micro-nozzle PTF inks had greater adhesion then silver nano-particle inkjet inks but had lower conductivity (2% bulk conductivity of silver as opposed to 8% bulk conductivity). At higher curing temperatures (>300??C) inkjet inks were able to achieve conductivities of 33% bulk conductivity of silver. However, these temperatures were not suitable for processing on temperature sensitive surfaces such as carbon fibre. Durability tests showed that silver PTF inks were able to withstand standard aerospace environments apart from Skydrol immersion. It was found that DW inks should achieve a minimum conductivity of 30% bulk silver to reduce antenna and transmission line losses. Using a localised electroplating process (known as brush plating) it was shown that a copper layer could be deposited onto silver inkjet inks and thermoplastic PTF inks with a copper layer exhibiting a bulk conductivity of 66% bulk copper and 57% bulk copper respectively. This was an improvement on previous electroless plating techniques which reported bulk copper conductivities of 50% whilst also enabling DW inks to be plated without the need for a chemical bath. One of the limitations of many DW ink materials is they require curing or sintering before they become functional. Conventional heat treatment is performed using an oven which is not suitable when processing DW materials onto large structural component. Previous literature has investigated laser curing as means of overcoming this problem. However, lasers are monochromatic and can therefore be inefficient when curing materials that have absorption bands that differ from the laser wavelength. To investigate this, a laser diode system was compared to a broadband spot curing system. In the curing trials it was found that silver inks could be cured with much lower energy density (by a factor of 10) using the broadband white light source. Spectroscopy also revealed that broadband curing could be more advantageous when curing DW dielectric ink materials as these inks absorb at multiple wavelengths but have low heat conductivity. Themodynamical modelling of the curing process with the broadband heat source was also performed. Using this model it was shown that the parameters required to cure the ink with the broadband heat source only caused heat penetration by a few hundred micro-metres into the top surface of the substrate at very short exposure times (~1s). This suggested that this curing method could be used to process the DW inks on temperature sensitive materials without causing any significant damage. Using a combination of the developments made in this thesis the RF properties of the DW inks were measured after broadband curing and copper plating. It was found that the copper plated DW ink tracks gave an equivalent transmission line loss to a copper etched line. To test this further a number of GPS patch antennas were fabricated out of the DW ink materials. Again the copper plated antenna gave similar properties to the copper etched antenna. To demonstrate the printing capabilities of the micro-nozzle system a mock wireless telecommunications antenna was fabricated on to a GRP UAV wing. In this demonstrator a dielectric and conductive antenna pattern was fabricated on to the leading edge of the wing component using a combination of convection curing and laser curing (using an 808nm diode laser).

The incorporation of porosity in a material potentially results in the changes in electrical, mechanical and electrical properties and has generated much interest by researchers. The development of new techniques for inducing porosity in thin films may prove advantageous if they lead to a decrease in processing complexity, or an increase in the processing flexibility by widening the window of compatible physical conditions, or the improvement of the final properties of the porous materials. Two processing techniques were developed to produce porosity in thin dielectric films at temperatures below the glass transition temperature of the host matrix. These glassy-regime processing methods relied on the susceptibility of hydrogen silsesquioxane (HSQ) to gelation in the glassy regime when exposed to polar substances. Both of these glassy-regime processing methods relied on the susceptibility of hydrogen silsesquioxane (HSQ) towards gelation in the glassy regime when exposed to polar substances. The first processing method made use of co-solvent mixtures of polar non-protic organic solvent to serve both as gelation catalysts and pore-generators. HSQ films were soaked in the polar organic co-solvents, which penetrated the films and initiated crosslinking throughout the matrix. Afterwards the films were baked, volatilizing entrapped solvents and producing air pockets within the rigid matrix. The second porosity method used UV-radiation to initiate acid-catalyzed decomposition of polycarbonate sacrificial polymers after first using bases to catalyze the gelation of HSQ. The radiation-based (direct-write) decomposition of the porogen enabled the selective patterning of regions porosity via the use of a photomask, which resulted in the creation of refractive index profiles in the direct-written films. Porous films that were produced by these two glassy-state processing techniques were used to build slab waveguide structures. Optical characterization experiments showed that the fabricated waveguides had average propagation losses of 16 - 27 dB/cm for the first guided TE mode and about 36-40 dB/cm, for the second TE guided mode. It is believed that the large propagation loss values were caused by a combination of the Rayleigh scattering from the relatively large UV-induced pores produced in the direct-write layers as well as scattering induced by surface roughness.

No description available.