This thesis conducts research on the light rail transit (LRT)-line Tvärbanan in Stockholm regarding punctuality of dwell time (DT), focusing on the influence passengers have on the mean and the variance of DT. The eight major stops during rush-hours are analyzed through a combination of quantitative and qualitative analysis. DT is proved to be affected by many factors in a complex setting, with vast differences between stops and between train types, proving that the infrastructure, the platform design, and the train design is important factors. The overall core problem is the non-uniformity of passengers, which is caused mainly by (1) the platform layout, especially the locations of entrances/exits, (2) placement of the train doors in relation to platform obstacles, (3) connections to other means of public transportation, and (4) the overall placement of the entrances/exits at other stops in the same direction. Stop-specific measures and suggestions of overall improvements are proposed in order to reduce the mean and the variation of DT. / Detta examensarbete undersöker hur uppehållstid påverkas av passagerare på light rail-linjen Tvärbanan i Stockholm, vilket har haft en historia av höga och oförutsägbara uppehållstider. De åtta största hållplatserna under rusningstid är analyserade genom en kombination av kvalitativa och kvantitativa studier. Uppehållstiden beror på många faktorer i en complex miljö, där stora skillnader finns mellan de olika hållplatserna och de olika tågtyperna, vilket är ett bevis att infrastrukturen, plattformsdesignen och tågdesignen är viktiga faktorer. Grundproblemet är att passagerare är ojämnt fördelade på plattformarna, vilket är orsakat av (1) plattformsdesignen, speciellt vart ingångar/utgångar är placerade, (2) vart tågdörrarna stannar i relation till objekt på plattformen, (3) förbindelser till annan kollektivtrafik och (4) hur ingångar/utgångar är placerade över hela linjen i samma riktning. Övergripande och hållplatsspecifika åtgärder för att minimera uppehållstiden presenteras i rapporten.

International Telemetering Conference Proceedings / October 28-31, 1996 / Town and Country Hotel and Convention Center, San Diego, California / Eutectic (63% tin-37% lead) or near-eutectic (40% tin-60% lead) tin-lead solder is widely used for creating electrical interconnections between the printed wiring board (PWB) and the components mounted on the board surface. For components mounted directly on the PWB mounting pads, that is, surface mounted components, the tin-lead solder also constitutes the mechanical interconnection. Eutectic solder has a melting point of 183°C (361°F). It is important to realize that its homologous temperature, defined as the temperature in degrees Kelvin over its melting point temperature (T(m)), also in degrees Kelvin, is defined as T/T(m). At room temperature (25°C = 298K), eutectic solder's homologous temperature is 0.65. It is widely acknowledged that materials having a homologous temperature ≥ 0.5 are readily subject to creep, and the solder joints of printed wiring assemblies are routinely exposed to temperatures above room temperature. Hence, solder joints tend to be subject to both thermal fatigue and creep. This can lead to premature failures during service conditions. The geometry, that is, the lead configuration, of the joints can also affect failure. Various geometries are better suited to withstand failure than others. The purpose of this paper is to explore solder joint failures of dual in-line (DIP) integrated circuit components, leadless ceramic chip carriers (LCCCs), and gull wing and J-lead surface mount components mounted on PWBs.