Large-scale laminated safety glass is increasingly used in the public and private sector for example museums, jewelers or villas. Special safety is provided by these glasses in layered combination with polycarbonate sheets. Due to the low weight and its high tensile elongation comparing glass of the same thickness, highly transparent polycarbonate is suitable for safety-relevant components. Because of the dimensional limitation in the extrusion process, joining polycarbonate compounds are necessary for large-area joint of this laminated safety glass. According to the present state of the art, a transparent weld joint of polycarbonate is not possible. Within the scope of the project, polycarbonate joints were produced by infrared welding and adhesive bonding. The transparency of the joints was realized by varying the process parameters, for example the heating time. Additionally the present study focusses on a new innovative light intensity measurement, because conventional optical test methods can only subjectively assess the transparency and quality of the compound and the welding seam. The principle is based on the transmission of the welded and polished polycarbonate sample by means of a laser and the measurement of the current at the connected photoelectric cell, which is proportional to the intensity of the laserlight. This enables a qualitative evaluation of the joining dimension and -quality such as structural changes over the entire sample width. The results of this objective method correlate with the width of the stress distribution around the joining level, which are made visible with the photoelasticity using a polariscope and thus contribute to a better process understanding.

Within this work, bonding technologies based upon the alloying of gallium with other metals to assemble semiconductor substrates for the possible application of encapsulation and 3D-integration of micro systems and devices have been researched. Motivated by the important demand to achieve low temperature processes, methods with bonding temperatures below 200°C were investigated. Necessary technologies like the deposition of gallium as thin film and subsequent micro structuring have been developed. The alloying between gallium and gold as well as gallium and copper was analysed in detail. A good correlation between the elemental composition of the interface and its mechanical and electrical parameters was established, particularly regarding its thermal dependence. It emerged that in case of combination Au/Ga Kirkendall void are extensively formed whereby serious problems with mechanical strength as well as hermeticity emerged. In case of Cu/Ga, this problem is existent to a much lesser degree; it was possible to create hermetic tight bonds. For the necessary pre-treatment of copper, several methods could be successfully demonstrated. In summary, the development of bonding technologies based upon metallic interfaces that exhibit electric conductance, high strength and hermetic seal could be demonstrated. / In dieser Arbeit werden Bondverfahren zum Fügen von Halbleitersubstraten für mögliche Anwendungen für die Verkapselung und 3D-Integration von Bauelementen der Mikrosystemtechnik erforscht, die auf der Legierungsbildung von Gallium mit anderen Metallen beruhen. Motiviert von der zentralen Anforderung an niedrige Prozesstemperaturen wurden Methoden mit Fügetemperaturen deutlich unter 200°C untersucht. Dafür nötige Technologien zum Abscheiden von Gallium als Dünnschicht und das anschließende Mikrostrukturieren wurden entwickelt. Die Legierungsbildung zwischen Gallium und Gold sowie zwischen Gallium und Kupfer wurde im experimentell im Detail analysiert. Dabei konnte eine gute Korrelation zwischen der stofflichen Zusammensetzung und den mechanischen bzw. elektrischen Parametern der Zwischenschicht, auch und insbesondere hinsichtlich ihrer Temperaturabhängigkeit gefunden werden. Es stellte sich heraus, dass im Falle der Kombination Au/Ga Kirkendall Hohlräume in einer Menge entstehen, die zu erheblichen Problemen bezüglich mechanischer Festigkeit und Dichtheit der Fügeverbindung führen. Bei der Materialkombination Cu/Ga hingegen trat dieses Problem nur begrenzt auf; es war möglich hermetisch dichte Verbindungen herzustellen. Für die bei Kupfer nötige Vorbehandlung wurden mehrere Methoden erfolgreich getestet. Insgesamt konnte die Entwicklung von Fügetechnologien gezeigt werden, die metallische Zwischenschichten verwenden, elektrisch leitfähig sind, sehr gute Festigkeiten aufweisen und hermetisch dicht sind.

Large-scale laminated safety glass is increasingly used in the public and private sector for example museums, jewelers or villas. Special safety is provided by these glasses in layered combination with polycarbonate sheets. Due to the low weight and its high tensile elongation comparing glass of the same thickness, highly transparent polycarbonate is suitable for safety-relevant components. Because of the dimensional limitation in the extrusion process, joining polycarbonate compounds are necessary for large-area joint of this laminated safety glass. According to the present state of the art, a transparent weld joint of polycarbonate is not possible. Within the scope of the project, polycarbonate joints were produced by infrared welding and adhesive bonding. The transparency of the joints was realized by varying the process parameters, for example the heating time. Additionally the present study focusses on a new innovative light intensity measurement, because conventional optical test methods can only subjectively assess the transparency and quality of the compound and the welding seam. The principle is based on the transmission of the welded and polished polycarbonate sample by means of a laser and the measurement of the current at the connected photoelectric cell, which is proportional to the intensity of the laserlight. This enables a qualitative evaluation of the joining dimension and -quality such as structural changes over the entire sample width. The results of this objective method correlate with the width of the stress distribution around the joining level, which are made visible with the photoelasticity using a polariscope and thus contribute to a better process understanding.

Within this work, bonding technologies based upon the alloying of gallium with other metals to assemble semiconductor substrates for the possible application of encapsulation and 3D-integration of micro systems and devices have been researched. Motivated by the important demand to achieve low temperature processes, methods with bonding temperatures below 200°C were investigated. Necessary technologies like the deposition of gallium as thin film and subsequent micro structuring have been developed. The alloying between gallium and gold as well as gallium and copper was analysed in detail. A good correlation between the elemental composition of the interface and its mechanical and electrical parameters was established, particularly regarding its thermal dependence. It emerged that in case of combination Au/Ga Kirkendall void are extensively formed whereby serious problems with mechanical strength as well as hermeticity emerged. In case of Cu/Ga, this problem is existent to a much lesser degree; it was possible to create hermetic tight bonds. For the necessary pre-treatment of copper, several methods could be successfully demonstrated. In summary, the development of bonding technologies based upon metallic interfaces that exhibit electric conductance, high strength and hermetic seal could be demonstrated. / In dieser Arbeit werden Bondverfahren zum Fügen von Halbleitersubstraten für mögliche Anwendungen für die Verkapselung und 3D-Integration von Bauelementen der Mikrosystemtechnik erforscht, die auf der Legierungsbildung von Gallium mit anderen Metallen beruhen. Motiviert von der zentralen Anforderung an niedrige Prozesstemperaturen wurden Methoden mit Fügetemperaturen deutlich unter 200°C untersucht. Dafür nötige Technologien zum Abscheiden von Gallium als Dünnschicht und das anschließende Mikrostrukturieren wurden entwickelt. Die Legierungsbildung zwischen Gallium und Gold sowie zwischen Gallium und Kupfer wurde im experimentell im Detail analysiert. Dabei konnte eine gute Korrelation zwischen der stofflichen Zusammensetzung und den mechanischen bzw. elektrischen Parametern der Zwischenschicht, auch und insbesondere hinsichtlich ihrer Temperaturabhängigkeit gefunden werden. Es stellte sich heraus, dass im Falle der Kombination Au/Ga Kirkendall Hohlräume in einer Menge entstehen, die zu erheblichen Problemen bezüglich mechanischer Festigkeit und Dichtheit der Fügeverbindung führen. Bei der Materialkombination Cu/Ga hingegen trat dieses Problem nur begrenzt auf; es war möglich hermetisch dichte Verbindungen herzustellen. Für die bei Kupfer nötige Vorbehandlung wurden mehrere Methoden erfolgreich getestet. Insgesamt konnte die Entwicklung von Fügetechnologien gezeigt werden, die metallische Zwischenschichten verwenden, elektrisch leitfähig sind, sehr gute Festigkeiten aufweisen und hermetisch dicht sind.