Techn. Univ., Diss.--Dresden, 2002.

A Study on the Analysis of Competitive Strategy of Flip Chip Packaging Industry in Taiwan¡X Case Study on S Company Abstract The success of semiconductor industry in Taiwan significantly lies on the complete demarcation of the industry chain by companies involved in each area of IC design, foundry, packaging and testing. Nonetheless, packaging and testing are generally categorized to one industry as the major company usually runs packaging business in line with testing by emphasizing their turn-key solution. However, this concept will not be applied in the future even followed by the quantum breakthrough on the structure of the industry chain. This is a qualitative descriptive study mainly on analysis of competitive advantage and strategy of Flip Chip Packaging Industry in Taiwan. The theme studied is hardly assessed by quantified data. However through the researcher¡¦s macro review of the industry environment as well as micro review of specific individual case with primary and secondary data all-around collected, the present situation, character and trend of the industry are understood by analyzing external environment and internal corporate, searching source of competitive advantage in line with a case study of competitive strategy. The conclusion on future competitive strategy of Flip Chip Packaging Industry in Taiwan based on the case study is followed: 1. Under the trend of global demarcation with analysis, the future operation mode of Taiwan Flip Chip Packaging Industry should be transformed from low skill level to high technique intensive level through virtual integration of packaging and testing from the back end and IC design of the front end, which results in promoting the integration value of industry chain as well as providing the most efficient producing system to the globe. 2. Reviewing the current trend, development and competitors¡¦ competitive strategy of Taiwan Flip Chip Packaging Industry, analysis shows that under the evolution of technique and product, Taiwan Flip Chip Packaging Industry should take advantage of the special needs from IC design industry and IDM factories to devote to technique integration, application and development in the future. In addition the ability to innovate and establish standard will be uplifted with raising competitive from a complete industry chain and advanced foundry advantage. 3. Researching the core competitive from the case study and presenting the future competitive strategy of Taiwan Flip Chip Packaging Industry shows that differentiation directs the competition in line with stepping into production service and production research and development to replace cost advantage. Key Word: Competitive Advantage, Competitive Strategy, Core Source , Flip Chip Package

The study of alignment shift in flip chip bonding for VCSEL array was studied experimentally. We calculated the relation between the restoring force and the solder volume by the simulation software PadCAD. The metal pad size were 10£gm, 20£gm, 30£gm in diameter shape and 40£gm in square shape. The solder bump was electroplat by bidirection pulse in the silicon bench which was evaporated by Au/Pt/Ti. The oxidization in the surface of the solder was removed by using flux. The VCSEL array and the Si-bench in flip chip bonding was operated at the temperature 210¢J and 5 seconds. After the flip chip bonding, the minimum alignment shift in X direction was measured to be 2.2£gm. Base on the alignment shift measured result, the maximum coupling efficiency was calculated to be 48% for VCSEL array module.

Abstract The thesis is aimed to simulate the flip chip in chip scale package (FCCSP) by finite element method incorporated with software ANSYS due to thermally cyclic loading. The difference between two-dimensional and tree-dimensional structures is conferred. The position and height of solder bump in FCCSP and cyclic temperature are considered as parameters. The effects of above-mentioned parameters on package¡¦s fatigue models and fatigue damage are studied. The results show that the two-dimensional structure can help us to understand the position of the maximum displacement and the maximum equivalent strain. However, the values of numerical result in the two- dimensional structure are not very accurate. The fatigue fracture will first take place at the top of the most outside solder bump far away from the center of the whole package. If the height of solder bump is lower, the fatigue fracture of solder bump is faster. If the duration time of high and low temperatures is longer, the fatigue fracture due to creep of solder bump becomes faster. When the height of solder bump is change, the change of fatigue damage with plastic strain of solder bump will more obvious than the change of fatigue damage due to creep of solder bump. The extension of duration time of high and low temperatures will increase fatigue damage due to creep of solder bump, but not change the fatigue damage with plastic strain of solder bump. When the height of solder bump is reduced or the duration time of high and low temperatures is extended will increase fatigue damage subjected to cyclic temperature.

The thesis investigates the thermo-mechanical deformation and stress of a flip-chip package (FCBGA) via both experiment and simulation. First, Shadow Moiré is used to evaluate the warpage of a package at elevated temperature. Then we adopt the finite element method incorporated with the software ANSYS to simulate the warpage of a package and compare the obtained results with experiment at data. Then, the material properties of underfill, the thickness of die and the substrate are considered as important parameters. Their effects on stress and strain fields of package are studied. In case of FCBGA with and without underfill, we find that FCBGA with underfill can reduce stress concentration and increase warpage of a package in comparion with FCBGA without underfill. As for FCBGA with and without heat slug, it is observed that the warpage of FCBGA with heat slug is smaller than that of FCBGA without heat slug. Both stress and strain in the packages of above two cases are similar. The parametric study about the underfill, we find that smaller modulus and CTEs of underfill can reduce the stress and strain of package. However in the consideration of thicknesses of both die and substrate, it is shown that thinner die can reduce stress and strain of package, but thinner substrate does not. So it is suggested that thicknesses of die are the thinner the better.

Dissertation (Ph.D.)--Auburn University, 2006. / Abstract. Includes bibliographic references (p.99-110).

Techn. Universiẗat, Diss., 2002--Berlin.

BACKGROUND: Recent rapid increases in technology development have become increasingly prevalent in education. As a result of online education resources, classroom teaching dynamics have begun to shift away from traditional lecture. In particular, flipping the classroom has become popular in higher education. Flipping the classroom consolidates standard lectures into at-home self-study modules, and utilizes class time for engaging students in critical thinking exercises. Some research suggests that this style of teaching has led to increased student satisfaction and higher exam scores. OBJECTIVES: The objective of this study is to compare flipped classroom modules to traditional lecture in PA and medical student didactic education. METHODS: This study is a crossover interventional study that includes first year PA students and second year medical students from Boston University. Students will be randomly assigned to either a control group or experimental group. Both groups will take three tests throughout the study: a pre-test prior to intervention, a test following the first week prior to crossover, and a final exam after crossover completion. Each exam will consist of 30 multiple choice questions and a Likert scale questionnaire assessing student satisfaction. The control group will be exposed to traditional lecture while the experimental group will be exposed to a flipped classroom module. Content will be identical between groups, and following module completion, the groups will crossover for exposure to opposing treatment. RESULTS: Each cohort’s exam scores will be evaluated based on mean score and standard deviation at all three time points. Additionally, Likert scale responses will be evaluated at all three time points. Values will be assessed to determine if a relationship between lecture style, exam scores, and student satisfaction exist. DISCUSSION: Results from this study will help to determine the significance of flipped classroom learning in medical education.

With the progress of the semiconductor technology, the devices scaling down to submicron range leads to increase I/Os number and very fine pitch IC package type; such as BGA, Flip Chip and CSP type packages. For Flip chip packaging, the solder bumping process act as the role of I/O interconnection instead of conventational wirebonding process. The ball mounted process is defined as the solder ball mounted on the Flip Chip Ball Grad Array (FC-BGA) substrate for solder bumping. In this study, how to improve the strength of ball-shear; residual tin capability and capability of process kit are the main issues to be investigated for the ball mounted process. To analyze the root cause and to implement the corrective action are the important purpose for solving the failures occurred on the ball mounted process. The following technologies included as (1) engineering ststictic methodology; JMP (statistical software) (2) Problem solving methodology (PSM) (3) Optimizing the process window (4) Set up the main parameters to analyse in machinery (5) how to monitor the CPK capability & material properties analysis, are used for these issues. Finally, the ball mounted process has been successfully investigated and results in solving the failure of Flip Chip ball mounted process and surface mounted technology (SMT) process for assembly packaging manufacture completely.

Thesis (Ph. D.)--School of Mechanical Engineering, Georgia Institute of Technology, 2004. Directed by Daniel F. Baldwin. / Vita. Includes bibliographical references (leaves 202-210).