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Indium Tin Oxide (ITO) films were deposited on a number of semi-conductor materials using reactive r. f sputtering technique to form both rectifying Schottky and ohmic contacts. These contacts were applied in the fabrication of a number of novel optoelectronic devices: Schottky photo-diodes, transparent gate High Electron Mobility Transistors (HEMTs), heterojunction bipolar transistors (HBTs) being used as heterojunction phototransistors (HPTs), light emitting diodes (LEDs) and vertical cavity surface emitting lasers (VCSELs). A number ofthese novel devices were studied in comparatively greater detail; these were the Schottky diode and the HPT. Deposition conditions necessary to produce ITO films with high conductivity and optical transparency over a wide spectral range were studied and optimised. Separate post deposition techniques were developed to produce near ideal rectifying contacts and ohmic contacts with low contact resistance respectively. A thin film of indium (In) was also used to optimise ITO ohmic contacts to n + - GaAs substrates. Near ideal Schottky diodes were realised on n-GaAs substrates using aluminium (AI) and gold (Au) metal contacts. A simulation model was then developed and implemented to study the behaviour of current transport mechanisms over a wide temperature range. Photodiodes with ITO as the Schottky metal contact were fabricated and a study comprising of both their electrical and optical behaviour was undertaken. Relatively large geometry HBTs and HPTs were fabricated using AIGaAs/GaAs, InGaP/GaAs and InPlInGaAs systems respectively; the latter devices were first reported as a result of this study. A comparative study between devices fabricated from these systems were then made. This was followed by an appraisal of the electrical properties of each of their optical counterparts which had ITO emitter contacts. The specific photo responsivity and the spectral responses of these HPTs were analysed. In light of HPTs with transparent ITO emitter ohmic contacts, a brief examination of the merits of vertical versus lateral illumination was also made in this work. Finally a spectral response model was developed to understand and help design optoelectronic detectors comprising of single layer devices (n-GaAs Schottky photo diodes) or multiple semiconductor materials (HPTs using AIGaAs/GaAs or InPlInGaAs systems) to help predict responsivities at a given incident wavelength. As well as material properties of the constituent semiconductors, this model takes into account the specific lateral and vertical geometrical dimensions of the device.

Le développement de composants de puissance pour les applications hyperfréquence représente un formidable défi qui doit conduire à l’amélioration des systèmes radars, spatiales ou de télécommunications existants. Les transistors de type HEMT AlGaN/GaN ont démontré leurs potentialités pour répondre à cet enjeu. Cependant, l’augmentation des performances des systèmes s’accompagne d’une miniaturisation de plus en plus poussée des transistors entrainant une augmentation de leur température de fonctionnement. Dans ce contexte, la gestion thermique des composants est très importante. Une température de fonctionnement élevée a en effet pour conséquence de dégrader les performances et la fiabilité des composants. Plusieurs voies, comme la fabrication de composants sur substrat diamant ou encore l’intégration de micro-canaux au plus près des transistors, sont en développement pour améliorer la dissipation thermique des transistors de la filière GaN. Ainsi, il a été mis en évidence que la gestion thermique des transistors est un enjeu majeur pour obtenir des systèmes performants et fiable. Afin d’optimiser la gestion thermique des composants, il est important de déterminer avec précision la température de fonctionnement des composants en temps réel. Ce travail de thèse a pour objectif le développement d’une méthode permettant de mesurer en temps réel la température de fonctionnement de transistors de type AlGaN/GaN en régime hyperfréquence. Cette mesure permettrait d’étudier la fiabilité des composants, de contrôler leur température en fonctionnement et d’assurer une maintenance préventive et non curative de systèmes. Plusieurs méthodes de la littérature permettent d’extraire la température de fonctionnement de composants. Cependant, ces méthodes ne sont pas adaptées pour mesurer la température en temps réel de composants packagés. La solution proposée ici consiste à intégrer un capteur de température résistif directement au niveau de la zone active des transistors. Un design permettant l’intégration des capteurs dans des composants compatibles pour des applications de puissance hyperfréquence au-delàs de 10 GHZ a été développé. Une partie conséquente du travail de thèse a consisté à fabriquer les dispositifs (transistors et capteurs intégrés) en central technologique. Des caractérisations thermiques des transistors fabriqués ont ensuite été menées en régime statique et hyperfréquence. / Power microwave devices development is a challenge which leads to improve radars, spatial or telecommunications systems. AlGaN/GaN HEMTs have demonstrated their capabilities to be used in such systems. However, systems performances improvement leads to miniaturize size of transistors. Consequently, the transistors operating temperature increases. As a result, thermal management is very important. A high device operating temperature will deteriorate device performances and device reliability. Several methods such as the use of diamond substrate or the integration of micro-channel lead to improve component thermal dissipation. It has been highlighted that the proper thermal management of the transistor thermal behavior is necessary to obtain performant and reliable systems. In order to improve devices thermal management, transistors’ operating temperature must be determined accurately in real time. The thesis goal consists in developing a method to measure in real time AlGaN/GaN HEMT operating temperature under microwave power condition. This method will permit to study component reliability, to control device operating temperature and to assure systems preventive maintenance purpose. According to the literature, several methods are used to determine HEMT operating temperature. However, these methods cannot be employed to determined packaged components operating temperature. To solve this problem, the proposed method in this work consists in integrating a resistive temperature sensor in the HEMT active area. A design has been developed which permits to integrate a sensor in components for microwave power applications above that 10 GHz. An important part of the thesis work consisted in fabricating the devices (transistors and sensors) in clean room. After fabrication thermal characterizations have been performed under microwave power conditions.

Plasmons can be generated in the two dimensional electron gas (2DEG) of grating-gated high electron mobility transistors (HEMTs). The grating-gate serves dual purposes, namely to provide the required wavevector to compensate for the momentum mismatch between the free-space radiation and 2D-plasmons, and to tune the 2DEG sheet charge density. Since the plasmon frequency at a given wavevector depends on the sheet charge density, a gate bias can shift the plasmon resonance. In some cases, plasmon generation results in a resonant change in channel conductance which allows a properly designed grating-gated HEMT to be used as a voltage-tunable resonant detector or filter. Such devices may find applications as chip-scale tunable detectors in airborne multispectral detection and target tracking. Reported here are investigations of InGaAs/InP-based HEMT devices for potential tunable resonant sub-THz and THz detectors. The HEMTs were fabricated from a commercial double-quantum well HEMT wafer by depositing source, drain, and semi-transparent gate contacts using standard photolithography processes. Devices were fabricated with metalized transmission gratings with multiple periods and duty cycles. For sub-THz devices, grating period and duty cycle were chosen to be 9 ?m and 22%, respectively; while they were chosen to be 0.5 ?m and 80% for the THz device. The gratings were fabricated on top of the gate region with dimensions of 250 ?m x 195 ?m. The resonant photoresponse of the larger grating-period HEMT was investigated in the sub-THz frequency range of around 100 GHz. The free space radiation was generated by an ultra-stable Backward Wave Oscillator (BWO) and utilized in either frequency modulation (FM), or amplitude modulation (AM) experiments. The photoresponse was measured at 4K sample temperature as the voltage drop across a load resistor connected to the drain while constant source-drain voltages of different values, VSD, were applied. The dependence of such optoelectrical effect to polarization of the incident light, and applied VSD is studied. The results of AM and FM measurements are compared and found to be in agreement with the calculations of the 2D-plasmon absorption theory, however, a nonlinear behavior is observed in the amplitude and the line-shape of the photoresponse for AM experiments. For detection application, the minimum noise-equivalent-power (NEP) of the detector was determined to be 235 and 113 pW/Hz1/2 for FM and AM experiments, respectively. The maximum responsivity of the detector was also estimated to be ~ 200 V/W for the two experiments. The far-IR transmission spectra of the device with nanometer scale period was measured at 4 K sample temperature for different applied gate voltages to investigate the excitation of 2D-plasmon modes. Such plasmon resonances were observed, but their gate bias dependence agreed poorly with expectations.

Les transistors HEMTs (High Electron Mobility Transistors) de la filière GaN sont destinés à des applications dans les domaines militaire et spatial. C’est pourquoi nous avons étudié l’influence de trois types de stress électriques : à canal ouvert, à canal pincé et NGB (Negative Gate Bias), ainsi que l’influence de neutrons thermalisés avec une fluence pouvant aller jusqu’à 1,7.1012 neutrons.cm-2, sur leurs performances électriques dc.Dans un premier temps, nous avons étudié des HEMTs AlInN/GaN de laboratoire. Pour les trois stress, nous avons observé une dégradation due à la création de pièges accepteurs et donneurs au cours des différents stress et à la présence de pièges préexistants. Nous avons ensuite irradié ces composants par des neutrons thermalisés et avons observé une légère dégradation des performances électriques des transistors non stressés et stressés à canal ouvert ou pincé. En revanche, nous avons mis en lumière une légère amélioration pour les transistors ayant subi un stress NGB. Nous avons également irradié des MOS-HEMTs AlInN/GaN et conclu que ceux-ci étaient plus sensibles vis à vis des irradiations.Dans un deuxième temps, nous avons stressé de manière analogue des HEMTs AlGaN/GaN du commerce. Dans le cas du stress à canal ouvert, nous avons observé une diminution importante du courant de drain tandis que pour les stress à canal pincé et NGB le courant de drain augmente légèrement à cause d’une libération de pièges préexistants sous l’action du champ électrique vertical. Lors des irradiations avec des neutrons thermalisés, ces transistors, stressés ou non, subissent là encore des dégradations. / The GaN based HEMTs (High Electron Mobility Transistors) are excellent candidates for military and spatial applications. That’s why we have analysed the influence of three different types of bias stress: on-state stress, off-state stress and NGB (Negative Gate Bias), and the influence of thermalized neutrons with a fluence up to 1.7x1012 neutrons.cm-2, on their dc electrical performances.First, we have studied laboratory AlInN/GaN HEMTs. For the three conditions of stress, we have observed a degradation due to pre-existing traps and to the creation of acceptor and donor traps during the stress. Then, we have irradiated these components with thermalized neutrons and we have found a small degradation of the electrical performances of unstressed and on-state stressed and off-state stressed transistors. On the other hand, we have highlighted a slight improvement for NGB stressed components. We have also irradiated AlInN/GaN MOS-HEMTs and we have concluded that they are more sensible to irradiation.In a second time we have stressed in the same way commercial AlGaN/GaN HEMTs. For the on-state stress, we have observed an important increase in the drain current. However, the drain current increases for the on-state and NGB stressed components due to a release of electrons from pre-existing traps under vertical electrical field. During the irradiation with thermalized neutrons, the unstressed and stressed transistors are degraded and a small decrease in the drain current is visible.

Cette thèse est principalement axée sur le développement des matériaux III-N pour les transistors de puissance HEMTs, ainsi que les multipuits quantiques et les applications optroniques qui en découlent dans une moindre mesure. Suite à un rappel des propriétés des nitrures, des différentes applications possibles, du principe de la MOCVD et des différentes caractérisations retenues pour ce travail, nous avons traité dans un premier temps la croissance de GaN à basse température, c'est-à-dire en dessous de 1050degres C. La fabrication de multipuits impliquant l’alternance des couches de GaN et d'InAlN ou InGaAlN nous contraint de travailler à ces températures ce qui génère l’apparition d’un défaut en surface du GaN que l’on nomme V-defect. Une étude expérimentale poussée nous a permis de comprendre comment apparaissent et évoluent ces défauts selon les paramètres de croissance. Un modèle basé sur les énergies de surface à pu être élaboré et explique l’évolution de ces défauts. Ensuite nous avons défini l'influence de nombreux paramètre de croissance par MOCVD et tiré, des multiples tendances mises en relief, des modèles et explications justifiant telle ou telle propriété physique et chimique du matériau. En aval, ce sont des caractérisations électriques et principalement des mesures de résistivités qui ont été traitées afin de comparer la performance de nos échantillons à base d'indium à ceux de type AlGaN/GaN. Le problème de la pollution au gallium dans les réacteurs MOCVD verticaux a été mis en évidence et nous avons proposé différentes solutions pour la limiter, voire l’annihiler. Pour terminer ce sont des couches de protection à base de SiN et GaN que nous avons tenté de développer afin de protéger nos alliages à base d’indium pour la suite des étapes technologiques nécessaires à la fabrication d’un composant par exemple. / This thesis is mainly focused on the development of III-N materials for HEMTs power transistors, as well as quantum wells and optronics applications that result to a lesser extent. Following a reminder of the properties of nitrides, the different possible applications, the principle of the MOCVD and the different characterizations used for this work, we first treated the growth of GaN at low temperature, that is to say below 1050degres C. The manufacture of multiple quantum wells involving the alternation of GaN and InAlN or InGaAlN layers forces us to work at these temperatures, which generates the appearance of a defect in surface of the GaN which is called V-defect. An advanced experimental study allowed us to understand how these defects appear and evolve according to the growth parameters. A model based on surface energies could be developed and explains the evolution of these defects. Then we defined the influence of many MOCVD growth parameters by MOCVD and derived, from the multiple trends highlighted, the models and explanations justifying this or that physical and chemical property of the material. Downstream, these are electrical characterizations and mainly resistivity measurements that have been processed to compare the performance of our indium-based samples to those of AlGaN/GaN type. The problem of gallium pollution in vertical MOCVD reactors has been highlighted and we have proposed different solutions to limit or even annihilate it. Finally, we have tried to develop protective layers based on SiN and GaN in order to protect our indium-based alloys for the next technological steps required to manufacture a component, for example.

Les transistors HEMTs (High Electron Mobility Transistors) de la filière GaN sont destinés à des applications dans les domaines militaire et spatial. C’est pourquoi nous avons étudié l’influence de trois types de stress électriques : à canal ouvert, à canal pincé et NGB (Negative Gate Bias), ainsi que l’influence de neutrons thermalisés avec une fluence pouvant aller jusqu’à 1,7.1012 neutrons.cm-2, sur leurs performances électriques dc.Dans un premier temps, nous avons étudié des HEMTs AlInN/GaN de laboratoire. Pour les trois stress, nous avons observé une dégradation due à la création de pièges accepteurs et donneurs au cours des différents stress et à la présence de pièges préexistants. Nous avons ensuite irradié ces composants par des neutrons thermalisés et avons observé une légère dégradation des performances électriques des transistors non stressés et stressés à canal ouvert ou pincé. En revanche, nous avons mis en lumière une légère amélioration pour les transistors ayant subi un stress NGB. Nous avons également irradié des MOS-HEMTs AlInN/GaN et conclu que ceux-ci étaient plus sensibles vis à vis des irradiations.Dans un deuxième temps, nous avons stressé de manière analogue des HEMTs AlGaN/GaN du commerce. Dans le cas du stress à canal ouvert, nous avons observé une diminution importante du courant de drain tandis que pour les stress à canal pincé et NGB le courant de drain augmente légèrement à cause d’une libération de pièges préexistants sous l’action du champ électrique vertical. Lors des irradiations avec des neutrons thermalisés, ces transistors, stressés ou non, subissent là encore des dégradations. / The GaN based HEMTs (High Electron Mobility Transistors) are excellent candidates for military and spatial applications. That’s why we have analysed the influence of three different types of bias stress: on-state stress, off-state stress and NGB (Negative Gate Bias), and the influence of thermalized neutrons with a fluence up to 1.7x1012 neutrons.cm-2, on their dc electrical performances.First, we have studied laboratory AlInN/GaN HEMTs. For the three conditions of stress, we have observed a degradation due to pre-existing traps and to the creation of acceptor and donor traps during the stress. Then, we have irradiated these components with thermalized neutrons and we have found a small degradation of the electrical performances of unstressed and on-state stressed and off-state stressed transistors. On the other hand, we have highlighted a slight improvement for NGB stressed components. We have also irradiated AlInN/GaN MOS-HEMTs and we have concluded that they are more sensible to irradiation.In a second time we have stressed in the same way commercial AlGaN/GaN HEMTs. For the on-state stress, we have observed an important increase in the drain current. However, the drain current increases for the on-state and NGB stressed components due to a release of electrons from pre-existing traps under vertical electrical field. During the irradiation with thermalized neutrons, the unstressed and stressed transistors are degraded and a small decrease in the drain current is visible.

The increased power consumption and power density demands of modern technologies have increased the technical requirements of DC/DC and AC/DC power supplies. In this regard, the primary objective of the power supply researcher/engineer is to build energy efficient, high power density converters by reducing the losses and increasing the switching frequency of converters respectively. Operating the converter circuits at higher switching frequencies reduces the size of the passive components such as transformers, inductors, and capacitors, which results in a compact size, weight, and increased power density of the converter. Therefore, the thesis work is focussed on the design, analysis and evaluation of isolated converters operating in the 1 - 5MHz frequency region with the assistance of the latest semi conductor devices, both coreless and core based planar power transformers designed in Mid Sweden University and which are suitable for consumer applications of varying power levels ranging from 1 – 60W. In high frequency converter circuits, since the MOSFET gate driver plays a prominent role, different commercially available MOSFET gate drivers were evaluated in the frequency range of 1 - 5MHz in terms of gate drive power consumption, rise/fall times and electromagnetic interference (EMI) and a suitable driver was proposed. Initially, the research was focused on the design and evaluation of a quasi resonant flyback converter using a multilayered coreless PCB step down transformer in the frequency range of 2.7 – 4MHz up to the power level of 10W. The energy efficiency of this converter is found to be 72 - 84% under zero voltage switching conditions (ZVS). In order to further improve the energy efficiency of the converter in the MHz frequency region, the new material device GaN HEMT was considered. The comparisons were made on a quasi resonant flyback DC-DC converter using both the Si and GaN technology and it was found that an energy efficiency improvement of 8 – 10% was obtained with the GaN device in the frequency range of 3.2 – 5MHz. In order to minimize the gate drive power consumption, switching losses and to increase the frequency of the converter in some applications such as laptop adapters, set top box (STB) etc., a cascode flyback converter using a low voltage GaN HEMT and a high voltage Si MOSFET was designed and evaluated using a multi-layered coreless PCB transformer in the MHz frequency region. Both the simulation and experimental results have shown that, with the assistance of the cascode flyback converter, the switching speeds of the converter can be increased with the benefit of obtaining a significant improvement in the energy efficiency as compared to that for the single switch flyback converter. In order to further maximize the utilization of the transformer, to reduce the voltage stress on MOSFETs and to obtain the maximum power density from the converter circuit, double ended topologies were considered. Due to the lack of high voltage high side gate drivers in the MHz frequency region, a gate drive circuitry utilizing the multi-layered coreless PCB signal transformer was designed and evaluated in both a half-bridge and series resonant converter (SRC). It was found that the gate drive power consumption using this transformer was around 0.66W for the frequency range of 1.5 - v 3.75 MHz. In addition, by using this gate drive circuitry, the maximum energy efficiency of the SRC using multilayered coreless PCB power transformer was found to be 86.5% with an output power of 36.5W in the switching frequency range of 2 – 3MHz. In order to further enhance the energy efficiency of the converter to more than 90%, investigations were carried out by using the multiresonant converter topology (LCC and LLC), novel hybrid core high frequency planar power transformer and the GaN HEMTs. The simulated and experimental results of the designed LCC resonant converter show that it is feasible to obtain higher energy efficiency isolated DC/DC converters in the MHz frequency region. The peak energy efficiency of the LCC converter at 3.5MHz is reported to be 92% using synchronous rectification. Different modulation techniques were implemented to regulate the converter for both line and load variations using a digital controller. In order to realize an AC/DC converter suitable for a laptop adapter application, consideration was given to the low line of the universal input voltage range due to the GaN switch limitation. The energy efficiency of the regulated converter operating in the frequency range of 2.8 – 3.5MHz is reported to be more than 90% with a load power of 45W and an output voltage of 22V dc. In order to determine an efficient power processing method on the secondary side of the converter, a comparison was made between diode rectification and synchronous rectification and optimal rectification was proposed for the converters operating in the MHz frequency range for a given power transfer application. In order to maintain high energy efficiency for a wide load range and to maintain the narrow switching frequency range for the given input voltage specifications, the LLC resonant converter has been designed and evaluated for the adapter application. From the observed results, the energy efficiency of the LLC resonant converter is maintained at a high level for a wide load range as compared to that for the LCC resonant converter. Investigations were also carried out on isolated class E resonant DC-DC converter with the assistance of GaN HEMT and a high performance planar power transformer at the switching frequency of 5MHz. The simulated energy efficiency of the converter for the output power level of 16W is obtained as 88.5% which makes it feasible to utilize the designed isolated converter for various applications that require light weight and low profile converters. In conclusion, the research in this dissertation has addressed various issues related to high frequency isolated converters and has proposed solution by designing highly energy efficient converters to meet the current industrial trends by using coreless and core based planar transformer technologies along with the assistance of GaN HEMTs. With the provided solution, in the near future, it is feasible to realize low profile, high power density DC/DC and AC/DC converters operating in MHz frequency region suitable for various applications. / High Frequency Switch Mode Power Supplies

Depuis quelques années, nous assistons à l’essor d’une nouvelle filière d’électronique basée sur des supports flexibles. De nombreuses applications difficilement atteignables par l’électronique classique sont visées, c’est notamment le cas des tags RFID, des capteurs mobiles, des écrans flexibles…. Cette électronique est essentiellement basée sur des matériaux organiques pour lesquels la faible mobilité (<1cm2 /V.s) limite considérablement les performances hyperfréquences des composants. Dans ce contexte, l’intégration hétérogène de composants des filières GaN et graphène sur substrat flexible apparait comme une solution prometteuse pour des applications de puissance hyperfréquence où la conformabilité sur surface non plane est souhaitée. Ces travaux présentent d’une part, une méthode de transfert de composants HEMTs AlGaN/GaN sur ruban flexible et d’autre part, une technique de manipulation du substrat souple et de fabrication directe des composants à base de graphène sur celui-ci. Des HEMTs AlGaN/GaN à faible longueur de grille (LG = 100nm) ont été transférés sur ruban flexible et ont permis d’atteindre des résultats à l’état de l’art en termes de puissance hyperfréquence avec un gain de puissance linéaire (Gp) de 15,8 dB, une densité de puissance de sortie (Pout) de 420 mW / mm et une puissance ajoutée (PAE) de 29,6%. Pour les composants à base de graphène, une technique de manipulation du substrat flexible a été développée et a permis de fiabiliser le procédé technologique de fabrication. Une fréquence de coupure ft de 1GHz et une fréquence maximale d’oscillation fmax de 3 GHz ont été obtenues. / In recent years, the field of flexible electronics has been expanding. Many applications difficult to achieve by conventional electronics are targeted as RFID tags, mobile sensors, flexible screens… This field is essentially based on organic material for which the poor mobility (<1cm2 /V.s) limits considerably the device performances. In this context, the heterogeneous integration of GaN and graphene devices on a flexible substrate appears to be a promising solution for microwave power applications where conformability on a non-planar surface is needed. This work presents, on the one hand, a method to transfer AlGaN/GaN HEMTs onto flexible tape and, on the other hand, a technique for handling and manufacturing graphene-based components directly on the flexible substrate. HEMTs with short-gate length (LG = 100 nm) have been transferred onto flexible tape and showed state of the art results in terms of microwave power with a linear power gain (Gp) of 15.8 dB, an output power density (Pout) of 420 mW/ mm and an added power efficiency (PAE) of 29.6%. Concerning graphene-based devices, a flexible substrate handling technique has been developed making the manufacturing process more reliable. A cut-off frequency ft of 1 GHz and a maximum oscillation frequency fmax of 3 GHz were obtained.

Les composants HEMTs (High Electron Mobility Transistors) à base d’AlGaN/GaN sont à ce jour les candidats les plus prometteurs pour des applications hyperfréquences de puissance, dû essentiellement à leur forte densité de porteurs et des mobilités électroniques élevées. Cependant, la température générée en condition réelle est un paramètre capital à mesurer, afin d’estimer précisément la fiabilité des composants et leur durée de vie. Pour ces raisons, nous avons comparé les méthodes de caractérisation thermique par thermoréflectance et par spectroscopie Raman car elles sont non destructives et avec une résolution spatiale submicronique. Ces techniques ont déjà prouvé leur faisabilité pour la caractérisation thermique des transistors, en modes de fonctionnement continu et pulsé. Nous comparons dans cette étude leurs adaptabilité et performance dans le cadre de la réalisation d’un banc d’essai thermique dédié. Ces méthodes sont reconnues pour ne caractériser que certaines catégories de matériaux : les métaux pour la thermoréflectance et les semiconducteurs pour la spectroscopie Raman, ce qui nous a conduit à l’éventualité de les combiner. Nous avons confronté des résultats obtenus par thermoréflectance à partir des équipements de deux fabricants commercialisant cette méthode, nous permettant ainsi de mettre en évidence des résultats originaux sur des aspects et inconvénients qui ne sont pas relayés dans la littérature. Avec la spectroscopie Raman, nous avons identifié les paramètres de métrologie qui permettent de réaliser un protocole de mesure thermique le plus répétable possible, et nous présentons également une technique innovante pour sonder les matériaux en surface, à l'aide du même équipement, et notamment les métaux. / At the moment, AlGaN/GaN HEMTs (High Electron Mobility Transistors) are the most promising for high-power hyperfrequency applications, essentially due to their large carrier density and a high electronic mobility. However, the temperature generating during operational conditions is a crucial parameter to measure, in order to estimate the reliability and durability of components. For these reasons, we compared thermoreflectance and Raman spectroscopy, that are non-destructive and possessing a submicronic spatial resolution. These techniques have already proven their feasibility as thermal characterization methods in both continuous wave and pulsed operational modes. We compare here their adaptability and performance to the conception of a thermal test bench. These methods are known for characterizing specific types of material: metals for thermoreflectance and semiconductors for Raman spectroscopy, leading us to the eventuality to combine them. We compared several results measured by thermoreflectance method with equipment from two different manufacturers that commercialize this technology, so we could highlight some aspects and drawbacks that are note relayed in the literature. With Raman spectroscopy, we identified metrology parameters allowing to realize a thermal measurement setup as reproducible as possible, and we also present an innovative method to probe surface material, especially metals.