Group III-A nitrides (GaN, AlN, InN and alloys) are materials of considerable contemporary interest and currently enable a wide variety of optoelectronic and high-power, high-frequency electronic applications. All of these applications utilize device structures that employ a single or multiple hetero-junctions, with material compositions varying across the interface. For example, the workhorse of GaN based electronic devices is the high electron mobility transistor (HEMT) which is usually composed of an AlGaN/GaN hetero-junction, where a two-dimensional electron gas (2DEG) is formed due to differences in polarization between the two layers. In addition to such hetero-junctions in the same material family, formation of hetero-interfaces in nitrides begins right from the epitaxy of the very first layer due to the lack of native substrates for their growth. The consequences of such "dissimilar" hetero-junctions typically manifest as large defect densities at this interface which in turn gives rise to defective films. Additionally, if the substrate is also a semiconductor, the electrical properties at such dissimilar semiconductor-nitride hetero-junctions are particularly important in terms of their influence on the performance of nitride devices. Nevertheless, the large defect densities at such dissimilar 3D-3D semiconductor interfaces, which translate into more trap states, also prevents them from being used as active device layers to say nothing of reliability considerations arising because of these defects. Recently, the advent of 2D materials such as graphene and MoS2 has opened up avenues for Van der Waal’s epitaxy of these layered films with practically any other material. Such defect-free integration enables dissimilar semiconductor hetero-junctions to be used as active device layers with carrier transport across the 2D-3D hetero-interface. This thesis deals with hetero-epitaxial growth platforms for reducing defect densities, and the material and electrical properties of dissimilar hetero-junctions with the group III-A nitride material system.

High Electron Mobility Transistoren (HEMTs), basierend auf dem Materialsystem GaN/AlGaN/GaN, wurden entworfen, hergestellt und elektrisch charakterisiert. Für das Maskendesign kam das CAD-Programm LasiCAD zum Einsatz. Das Design umfasste bis zu sechs Lithographieebenen. Die Herstellung der Bauelemente geschah unter Reinraumbedingungen und unter Nutzung einer vorhandenen Technologie für Transistoren mit kleiner Gate-Peripherie (Doppelgate-Transistoren), die teilweise optimiert wurde. Daneben wurden Prozesse zur Herstellung von Multifinger-HEMTs entwickelt, wobei die Metallisierung der Drainkontakte mittels Electroplating von Gold vorgenommen wurde. Zur elektrischen Charakterisierung der Bauelemente wurden sowohl Gleichstromcharakteristiken, d.h. die Ausgangskennlinienfelder und Verläufe der Steilheit, als auch das Großsignalverhalten für cw-Betrieb bei 2 GHz gemessen. Dabei zeigten die Transistoren eine auf die Gatebreite bezogene Ausgangsleistungsdichte von mehr als 8 W/mm und eine Effizienz größer als 40%, einhergehend mit vernachlässigbarer Drainstromdispersion der unpassivierten Bauelemente.

Ohmic contacts are crucial components in semiconductor devices such as transistors and diodes, and lowering their contact resistance is an important factor in device performance enhancement. This is especially important for low-noise amplifiers (LNAs) where device noise temperature decreases both directly and indirectly with decreasing contact resistance. This becomes relevant in quantum computers operated at cryogenic temperatures as LNAs constitutes the 4 K quantum bit (qubit) readout signal amplification chain. The goal of this project is to investigated the superconducting element niobium (Nb) as contact material for indium phosphide (InP) high-electron-mobility transistors (HEMTs), being the active component in cryogenic high-frequency LNAs. For contact and barrier resistance determination, test structures were fabricated and utilized according to the transfer length method(TLM) and the recess TLM respectively. Measurements were performed in room temperature as well as in cryogenic temperatures below and above Nb’s bulk transition temperature of 9.25 K. The results show low-resistance Nb-based ohmic contacts for n-In0.65Ga0.35As, with the non-alloyed Nb(50 nm)/Au(100 nm) stack yielding a room temperature contact resistivity of (9.4 ± 0.5) × 10−8 Ωcm2. For all contacts the contact resistivity increased moving to cryogenic temperatures, as expected when electron occupation of high-energy states decreases. At cryogenic temperatures nosuperconducting transition was observed, attributed to the Nb layer thickness being roughly equal to its coherence length. Considering the effective barrier resistance, the Ni/Ge/Au/Nb/Au alloyed contact had the lowest room temperature resistance, reporting 143 Ω µm. In cryogenic temperatures the effective barrier resistance unexpectedly decreased in all contacts. The Nb/Au contact showed the best cryogenic performance, with a barrier resistance of 28 − 37 Ω µm. This indicates great potential for non-alloyed Nb/Au contacts in cryogenic InP HEMTs. / Alla halvledarkomponenter, som dioder och transistorer, har ohmska kontakter. Att sänka kontaktresistansen hos de ohmska kontakterna är ett sätt att höja prestandan hos en komponent. Särskilt gäller detta för lågbrusförstärkare, som har en brustemperatur som minskar både direkt och indirekt med avtagande kontaktresistans. För kvantdatorer som måste kylas till kryogena temperaturer för att fungera är detta relevant eftersom förstärkningen av utläsningssignalen från kvantbitar sker via lågbrusförstärkare vid 4 K. Målet för detta examensprojekt är att undersöka ohmska kontakter baserade på det supraledande materialet niobium (Nb) i indiumfosfidbaserade högelektronmobilitetstransistorer, som är den aktivakomponenten i kryogena högfrekvens-lågbrusförstärkare. För bestämning av kontaktoch barriärresistans producerades teststrukturer enligt Transfer Length-metoden (TLM) respektive etsad TLM. Mätningar genomfördes i rumstemperatur samt vid kryogena temperaturer både över och under niobiumets kritiska temperatur på 9.25 K. Resultatet visar låg kontaktresistans för Nb-baserade ohmska kontakter på n-In0.65Ga0.35As. Den icke-legerade Nb(50 nm)/Au(100 nm)-kontakten hade en kontaktresistivitet på (9.4 ± 0.5) × 10−8 Ωcm2 . Vid kryogena temperaturer ökade kontaktresistansen för samtliga Nb-baserade kontakter, vilket är förväntat då färre elektroner fyller högenergitillstånd. Inget supraledande tillstånd observerades vid kryogena temperaturer, vilket kan förklaras av att tjockleken på niobiumlagret var ungefär lika med dess koherenslängd. Lägst barriärresistans vid rumstemperatur hade den legerade Ni/Ge/Au/Nb/Au-kontakten, med ett värde på 143 Ω µm. Vid kryogena temperaturer skedde en oväntad minskning hos barriärsresistansen hos samtliga kontakter, där den lägst barriärsresistans uppmättes på den icke-legerade Nb/Au-kontakten, 28 − 37 Ω µm. Slutsatsen som dras är att det finns stor potential för användning av icke-legerade Nb/Au-kontakter för kryogena lågbrusförstärkare baserade på indiumfosfid.