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Package design for children: do practitioners get it right?Chareonsakdi, Thidarat January 2009 (has links)
The literature indicates that children are highly influenced by product packaging and that it is the packaging that will make the product stand out from the crowd and hopefully making a sale. There have been a number of valuable studies offering practitioners principles and guidelines on how to enhance package design for products that target children; however the extent to which practitioners adhere to the principles proposed by academics has had limited attention. This study is therefore aimed at examining the degree to which practitioners implement current knowledge relating to the principles of package design in the context of packages designed to attract children, while simultaneously assessing the relationship between package design and brand performance. An extensive secondary research of the literature has been made to establish a list of criterion for package design for children elements assessment. At the same time, attempts have been made to gather brand performance data. Product samples have been collected from major supermarkets in New Zealand and then analysed against the criterion using the principle of content analysis. The result generated by this study shows that practitioners are mostly adhering to the principles of children’s package design established by academic research. However, the relationship between brand performance and package design was not established in this study.
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Optische 3D-Inspektion von Bauelementen der SystemintergrationSchaulin, Michael January 2006 (has links)
Zugl.: Dresden, Techn. Univ., Diss., 2006
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Electrical and electromechanical properties of ferroelectric thin films /Gerber, Peter. January 2007 (has links)
Aachen, Techn. Hochsch., Diss., 2007.
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Εκπαιδευτικό λογισμικό για την ανάλυση διαστημάτωνΓκανά, Αλεξάνδρα 11 January 2010 (has links)
Η διπλωματική εργασία αυτή,ασχολείται με τη δημιουργία ενός διδακτικού πακέτου που θα χρησιμοποιείται για τη διδασκαλία του μαθήματος "Ανάλυση Διαστημάτων" από απόσταση. Σκοπός του είναι η αξιοποίησή του από τον φοιτητή για περαιτέρω εξάσκηση στο σπίτι και για εμπέδωση των όσων διδάχθηκε στην τάξη. Πριλαμβάνει συνοπτική θεωρία στα πλαίσια του μαθήματος που διδάσκεται σε προπτυχιακό επίπεδο στο τμήμα Μαθηματικών του Παν/μιου Πατρών καθώς και παραδείγματα συνδεδεμένα άμεσα με τη θεωρία που έχει διδαχθεί. Υπάρχει σύνδεση κάθε παραγράφου της θεωρίας με τα αντίστοιχα παραδείγματα, τα οποία είναι σε μορφή video. Υλοποιούνται όλες οι μέθοδοι που αναφέρονται στο βιβλίο και υπάρχει γραφική απεικόνιση κάθε βήματος του αλγορίθμου τους και ηχητική επεξήγηση αυτών, με σκοπό την καλύτερη κατανόησή τους. Μέσα στο πακέτο υπάρχουν και ασκήσεις πολλαπλής επιλογής, αντιστοίχησης και σταυρόλεξο, όπου είτε θα μπορεί ο αναγνώστης φοιτητής να ασχοληθεί μόνος του στο σπίτι, είτε να αξιοποιηθούν από τον διδάσκοντα με τη χρήση μηχανής προβολής για εξάσκηση στην τάξη. / This diplomatic essay is related to the creation of a teaching package which will be used in the teaching process of "Interval Analysis" through distant learning. Its aim is to be fully used by the student for further practice at home and to consolidate everything they have been taught within the classroom. More analytically, it includes concise theory of the subject framework whivh is taught in Mathematics Department of Patra University in the Bachelor's level. It also includes examples directly connected to the already taught theory. Specifically, there is a connection of each theory paragraph to the corresponding examples which exist in the form of a video clip. In addition, every method mentioned in the book is accomplished and there is a graph of every step in their algprithm as well as sound effect explanation in order to their being better understood. This package includes multiple choice exercises, mathing exercises and a crossword puzzle with which the student reader will be able either to be busy with at home or the teacher will be able to fully used them with the use of a projector for practice in classroom.
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Prédiction de la fiabilité de composants élecroniques de type WL-CSP soumis à des sollicitations mécaniques / Reliability study of electronic wafer-level chip-scale packaged components subjected to mechanical loadingsLe Coq, Cédric 07 July 2010 (has links)
L’étude présentée s’inscrit dans le cadre général de l’amélioration de la fiabilité mécanique des composants électroniques. Les composants de type WL-CSP (Wafer-Level Chip-Scale Package : boîtier aux dimensions comparables à celles de la puce) sont couramment utilisés dans les appareils nomades (par exemple les téléphones) et assurent de nombreuses fonctions. La tenue dans le temps de ces appareils passe par l’allongement de la durée de vie de leurs éléments. Ce sujet est une problématique complexe car la structure des composants peut varier selon les technologies employées et nécessite des essais spécifiques, qui consomment beaucoup de temps et de ressources.Un modèle numérique est développé afin d’accélérer le développement des boîtiers de ces composants et d’optimiser les ressources disponibles. Des essais de fiabilité sont menés sur le test de chute et un banc d’essai de flexion est mis en place. Les résultats de ces essais permettent de valider la simulation numérique et de mettre au point un modèle de fatigue.D’autre part, une campagne de caractérisation des matériaux permet de déterminer les propriétés mécaniques de la structure étudiée. La caractérisation concerne notamment les couches minces pour lesquelles les propriétés mécaniques sont fortement dépendantes de leurs conditions de dépôts.Ces éléments sont incorporés dans un modèle numérique incluant un certain nombre d’hypothèses. Le modèle est confronté à l’expérience pour déterminer les constantes d’un modèle de fatigue. Ensuite, la simulation et le modèle de fatigue sont utilisés conjointement pour évaluer l’influence de paramètres géométriques et matériaux sur la fiabilité des composants de type WL-CSP. / The work described in this report is related to the mechanical improvement of electronicdevices mechanical reliability. WL-CSP (Wafer-Level Chip-Scale Package) components are widely used in handheld devices and run many functions. The longevity increase of such adevice necessarily requires progresses in its components reliability. This subject is complexas the component structure can vary depending on the employed technologies. So, it requires time and ressources.A numerical model is developed to enhance the packages development as well as available resources. Reliability tests are performed on the drop-test bench and a bend-testbench is designed. These tests provide results to validate the numerical results and to establish a fatigue model.Aside from these tests, the component materials are characterized to determine the studied structure properties. It specifically concerns the thin layers for which mechanical properties strongly depends on the deposition process. All of this is incorporated in a numerical model which includes hypotheses. The model is compared with the experiments to determine fatigue model constants. Then, modeling and experiments are used together to evaluate material and geometrical parameters influence.
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Seleção de materiais para embalado de transporte de Mo-99 / Material selection for a transportation package of Mo-99Débora Harumi Suzuki Hara 05 March 2015 (has links)
O transporte de materiais radioativos deve ser realizado em embalados capazes de suportar tanto condições normais, quanto acidentais de transporte. O objetivo deste trabalho foi a seleção de materiais que possam viabilizar a fabricação de um embalado para o transporte de substâncias que sejam fontes de alta radioatividade, em especial o Mo-99, cujo produto do decaimento radioativo é o Tc-99m, utilizado para fins diagnósticos na medicina nuclear. Para tanto, foi realizada a seleção dos possíveis materiais que podem ser utilizados para a fabricação de um embalado, com o auxílio do programa CES EduPack e a metodologia desenvolvida por Ashby. O programa ESTAR foi utilizado para verificar a ocorrência de radiação de freamento e o programa XCOM para o cálculo do coeficiente de atenuação da radiação gama de alguns dos materiais selecionados para compor a blindagem do embalado. Posteriormente, a espessura necessária para a blindagem da radiação foi calculada. A partir dos resultados obtidos, os materiais selecionados como candidatos potenciais para a fabricação da blindagem foram as ligas de tungstênio. Com relação à parte do embalado que oferece isolamento térmico e proteção ao impacto, destacam-se as madeiras, os aglomerados e os compensados. No que concerne ao revestimento interno e externo, os materiais selecionados se concentram nos aços. / The transport of radioactive materials must be done in packages able to withstand both normal and accidental conditions of transport. The aim of this work was the material selection that can enable the manufacture of a package for the transport of substances which are of high radioactivity sources, especially Mo-99, whose radioactive decay product is Tc-99m, used for diagnosis purposes in nuclear medicine. For this, the selection of possible materials that can be used for the manufacture of the main parts of the package was performed with the aid of CES Edupack program and the methodology developed by Ashby. The ESTAR program was used to check occurrence of Bremsstrahlung and the XCOM program was used to calculate the attenuation coefficient of gamma radiation from some of the selected materials for the shield. After, the thickness needed for the radiation shielding was calculated. From the results, the materials selected as potential candidates for the manufacture of the shielding was the tungsten alloys. Related to the thermal insulation and the impact protection, woods, plywoods and particleboards stand out. With regard to internal and external recipients, the selected materials focus on steels.
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Development of a technological package for sustainable use of Dambos by small-scale farmersDaka, Angel Elias 06 September 2001 (has links)
The sustainable use of Dambos for crop production using a technological package is presented. Dambos which are known as vleis in South Africa and Zimbabwe, fadamas in West Africa and mbugas in East Africa are identified as potential environments and key-resource areas for alleviating poverty and hunger in arid and semi-arid areas where drought occurrences are characteristic and limit upland crop production. Dambos present themselves as environments with soil moisture potential and high water tables ranging from 50 - 100 cm below the ground surface for most part of the year. Particular difficulties arise in abstracting this water for use to irrigate crops in Dambos. Most small-scale farmers use a rope and a bucket to draw water from hand dug wells. These methods are labour intensive and thus limited lands are cultivated by small-scale farmers. This study has identified, modified and introduced a treadle pump as a technology for lifting water from shallow water tables such as in Dambos. The treadle pump also lifts water from rivers, swamps, wells and dams within a suction lift of 0-8 m to the intended place of use i.e. vegetable garden, domestic application, livestock watering and in construction. The study has further investigated and introduced the clay pot as a water saving device. The clay pot sub-surface irrigation technology saves between 50 and 70 % of water as compared to conventional watering can and bucket systems. This technology can combine well with the treadle pump by using the latter to refill water in the former, thus making it easy to fill the system once the water is depleted. The use of the treadle pump has demonstrated its impact on the society in many ways. Firstly: the small-scale farmer is now able to increase the size of his/her garden from 0.1 ha irrigating using watering cans/buckets to between 0.25 ha and 0.5 ha using the treadle pump. With this innovative way of irrigating, farmers have thus been able to diversify cropping. Secondly: farmers have been able to increase household income from a meager US$125 without a treadle pump to US$850 and US$1700 on a 0.25 ha piece of land with a treadle pump on a 300% cropping intensity (growing crops three times a year). This has helped the country reduce on imported vegetables and thus save the much needed foreign exchange. Thirdly: the technology has contributed to employment creation, notably from the manufacturing point of view where artisans are employed to make the pump and carpenters to make the wooden parts. On the output side for buyers (merchants/hawkers) and transport contractors who trade and transport the produce. The study essentially alludes to the great impact the treadle pump has made by noting the brand naming of the pump as 'Chova pump' by the small-scale farmers. Chova is a local name, which means to boost one's income or to pedal signifying the manner in which the pump is operated. Dambos, cover about 3.6 million hectares of land in Zambia and are suitable environments for application of the treadle pump. The potentials and limitations of Dambos are highlighted and the impact of their use using treadle pumps elucidated. Marketing of Dambo produce is discussed with respect to the adoption of the technology. The study notes that Dambos are highly accessible with no land tenure limitations. Thus the more than 800,000 small-scale farmers in Zambia have an opportunity to utilize Dambos for crop production and help reduce poverty and food insecurity at household level. / Dissertation (PhD(Land Use Planning))--University of Pretoria, 2002. / Plant Production and Soil Science / unrestricted
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A critical evaluation of the performance management system used by Nampak Research and DevelopmentSolomons, Neville January 2006 (has links)
Introduction: Performance management is an important driver in most companies today. Companies regard this as the tool to ensure that the people working for them will deliver as per the agreed contract and objectives which were set mutually. This study will reveal the importance of a well managed performance management system and what benefits one will derive from it. Intent: The purpose of this research project is to conduct a critical analysis of the performance management system used by Nampak Research and Development. They have been using a system since 2001 to the present without any changes to the system. The study focused on key areas to ascertain the level of change in the above respect that needs to take place. The study addressed (a) the understanding of performance management, (b) the management attitude towards performance management, (c) staff development, (d) the mentoring system, and (e) the performance appraisal method used. Findings: the main findings were that: (a) loss of management skill due to retirement, (b) staff has a negative attitude towards the performance management system, (c) staff does not trust the system, (d) management is the only group that is positive about the system, (e) there are no staff development strategies and no staff development, (f) ineffective mentoring system, (g) no mentor and mentee relationship, and (h) the performance appraisal method raised concerns in terms of departments not being consistent with the rating scores. Conclusion: the researcher has recommended what needs to be put in place to help the system work. Due to the complexity of the system, the researcher then recommended that a specialist in the field of performance management be approached to resolve the situation.
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Systém odměňování ve výrobním podniku / Remuneration System in a Production CompanyVoborníková, Tereza January 2015 (has links)
The aim of the practical part is an analysis of remuneration system and its motivational role in company HKS-CZ Ltd., followed by improvement proposals. The main information source for the analysis and current system evaluation was internal documents together with questionnaire survey focused on employees' satisfaction with this system. The theoretical part deals with key terminology from the field of remuneration and employee motivation.
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System on Package (SoP) Millimeter Wave Filters for 5G ApplicationsShowail, Jameel 05 1900 (has links)
Bandpass filters are an essential component of wireless communication systems that only transmits frequencies corresponding to the communication band and rejects all other frequencies. As the deployment of 5G draws nearer, first deployments are expected in 2020 [1], the need for viable filters at the new frequency bands becomes more imminent.
Size and performance are two critical considerations for a filter that will be used in emerging mobile communication applications. The high frequency of 5G communication, 28 GHz as opposed to sub 6 GHz for nearly all previous communication protocols, means that previously utilized lumped component based solutions cannot be implemented since they are ill-suited for mm-wave applications.
The focus of this work is the miniaturization of a high-performance filter. The Substrate Integrated Waveguide (SIW) is a high performance and promising structure and Low Temperature Co-Fired Ceramic (LTCC) is a high-performance material that both can operate at higher frequencies than the technologies used for previous telecommunication generations.
To miniaturize the structure, a compact folded four-cavity SIW filter is designed, implemented and tested. The feeding structure is integrated into the filter to exploit the System on Package (SoP) attributes of LTCC and further reduce the total area of the filter individually and holistically when looking at the final integrated system.
Two unique three dimensional (3D) integrated SoP LTCC two-stage SIW single cavity filters and one unique four-cavity filter all with embedded planar resonators are designed, fabricated and tested. The embedded resonators create a two-stage effect in a single cavity filter. The better single cavity design provides a 15% fractional bandwidth at a center frequency of 28.12 GHz, and with an insertion loss of -0.53 dB. The fabricated four-cavity filter has a 3-dB bandwidth of .98GHz centered at 27.465 GHz, and with an insertion loss of -2.66 dB. The designs presented highlight some of the previously leveraged advantages of SoP designs while also including additions of embedded planar resonators to feed the SIW cavity. The integration of both elements realizes a compact and high-performance filter that is well suited for future mm-wave applications including 5G.
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