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Orientador: Jose Antonio Siqueira Dias / Dissertação (mestrado) - Universidade Estadual de Campinas, Faculdade de Engenharia Eletrica e de Computação / Made available in DSpace on 2018-08-09T20:31:51Z (GMT). No. of bitstreams: 1 Tozetto_EduardoHenrique_M.pdf: 2634313 bytes, checksum: 16d70c7f88dab18e657af6ec34a2defb (MD5) Previous issue date: 2007 / Resumo: O contexto econômico competitivo em que as empresas que desenvolvem ferramentas para projeto de CIs estão inseridas dificulta o estabelecimento de padrões e plataformas de desenvolvimento comuns. Em geral, a necessidade de inúmeras ferramentas resulta em um ambiente de projeto fragmentado. Este trabalho apresenta uma ferramenta desenvolvida através da implementação de interfaces gráficas paramétricas em TCL/TK, que integra funções gerais, permitindo a rápida codificação de procedimentos e seu acesso através de elementos gráficos. A ferramenta desenvolvida serve para facilitar e otimizar as tarefas envolvidas no aprimoramento das técnicas de projeto de Circuitos ntegrados através da elaboração de métodos e scripts visando à automação de etapas do fluxo de projeto / Abstract: The competitive environment in which the companies who develop software tools for the design of integrated circuits creates many barriers to the establishment of standards and common platforms. Usually the need for several software tools leads to a design environment which is fragmented and difficult to manage. This work presents the development of software tool, based on graphical parametric user interfaces in TCL/TK, which integrates many general functions and allows for a quick codification of procedures and its access through the graphics elements. The developed tool optimizes and facilitates the tasks employed in the improvement of the techniques used in integrated circuits design through the elaboration of methods and scripts dedicated to the automation of the design flow steps / Mestrado / Eletrônica, Microeletrônica e Optoeletrônica / Mestre em Engenharia Elétrica

Abstract The developing trend toward the integreation of many function in application market of semiconductor, makes the original business model of IC design industry to change. From open structure (named ¡§Wintel¡¨ structure) till today, what we can see it shows as transition stage. It will be end in the situation the all devices can interlink to each other. All of us don¡¦t know how long we will overcome this transition stage. But it really challenges the orginal business model of IC design industry. The business model of IC design industry changes along with the changing in product application market. In this study, we do analysis of IC design industry¡¦s business model by four dimensions¡Xmarket strategies, capabilities of technology, the types of organization, financial resources. We will discuss the differents between Taiwan and American IC design industry In market strategy dimension, there are more and more difficults to distinguish between past strategy model including niche and volume strategies. Because the revolution of electronics application market, the better ways for Taiwan IC design industry to develop its market strategy are depending on capability focusing and the capture of market demend. When mentioning about the IC design skill, Taiwan IC design industry can choose several ways to cumulate its design capabilities according to the market strategy it chose. About types of the organization, the combination of fabless and fabless is the trend. Also 1¡¦st tier IDM will be the key roles who dominate the future IC industry. More than all, fabless who belong to system assembly factory or fabless who belong to foundry will be the mainstream in the IC industry and in electronics application market, too. Depending on what kinds of organzation IC design companies chose, it will affect the ability when they rising money. These four factors interaction built the business model of the Taiwan IC design industry.

Durant la dernière décennie, la miniaturisation des technologies de semi-conducteurs et de l’intégration à grande échelle a donné lieu à la conception de systèmes complexes, notamment l’intégration de plusieurs milliards de transistors sur un même die. Cette tendance pose de nombreux défis de fabrication et de fiabilité tels que la dissipation de puissance, la variabilité technologique et la polyvalence des applications. Les problèmes de fiabilité, représentées par la présence de points chauds thermiques peuvent accélérer la dégradation des transistors, et par conséquent réduire la durée de vie des puces, également appelée "vieillissement". Afin de relever ces défis, de nouvelles solutions sont nécessaires, basées notamment sur des systèmes auto-adaptatifs. Ces systèmes sont principalement composées d’une boucle de contrôle avec trois processus : (i) la surveillance, qui est chargée d’observer l’état du système, (ii) la prise de décision, qui analyse les informations collectées et prend des décisions pour optimiser le comportement du système et (iii) l’action qui ajuste les paramètres du système en conséquence. Cependant, une adaptation dépendre de façon critique sur le processus de suivi qui devrait fournir une estimation précise sur l’état du système de façon rentable. Dans cette thèse, nous étudions d’abord le suivi de la consommation d’énergie. Nous développons une méthode basée sur plusieurs algorithmes de fouille de données "data mining", pour surveiller l’activité de commutation sur quelques signaux pertinents sélectionnés au niveau RTL. La méthode proposée se compose d’un flot générique qui peut être utilisé pour modéliser la consommation d’énergie pour n’importe quel circuit RTL sur n’importe quelle technologie. Deuxièmement, nous améliorons le flot proposé pour estimer le comportement thermique globale de puce et de développer une nouvelle technique de placement des capteurs thermique sur puce. Les algorithmes proposés choisissent systématiquement le meilleur compromis entre la précision de l’observation et le coût représenté par le nombre de capteurs intégrés sur puce. La surface de la puce est décomposée en plusieurs zones thermiquement homogènes.Outre la partie conception, les systèmes embarqués modernes intègrent des capteurs matériels (analogiques ou numériques) qui peuvent être utilisés pour surveiller l’état du système. Ces méthodes industrielles sont généralement très coûteuses et nécessitent un grand nombre d’unités pour produire des informations précises avec une résolution à grain fin. Une solution alternative pour fournir une estimation précise de l’état du système est réalisée avec un ensemble de compteurs de performance qui peut être configuré pour effectuer le suivi des événements logiques à différents niveaux. Dans ce cas, nous proposons un nouvel algorithme pour la sélection des événements performance pertinents à partir des ressources locales, partagées et système. Nous proposons ensuite une implémentation d'un algorithme d'estimation basé sur un réseau neuronal. La méthode proposée est robuste contre les variations de température extérieure. En outre, estimation thermique est aussi peut être réalisé en utilisant les événements logiques actuelles et historiques, et la précision est évaluée sur la base de la profondeur dans le passé.Enfin, une fois la méthode de suivi et la cible définies et le système est configuré, la méthode de surveillance doit être utilisée au moment de "Run-time". Nous avons mis en place une boucle d’adaptation complète, avec un suivi dynamique de l’état du système afin atteindre une meilleure efficacité énergétique. / Over the last decade, the miniaturization of semiconductor technologies and the large-scale integration has given rise to complex system design, including the integration of several billions of transistors on a single die. This trend poses many manufacturing and reliability challenges such as power dissipation, technological variability and application versatility. The reliability issues represented by the presence of thermal hotspots can accelerate the degradation of the transistors, and consequently reduce the chip lifetime, also referred to as “aging”. In order to address these challenges, new solutions are required, based in particular on self-adaptive systems. Such systems are mainly composed of a control loop with three processes: (i) the monitoring, which is responsible for observing the state of the system, (ii) the diagnosis, which analyzes the information collected and makes decisions to optimize the behavior of the system, and (iii) the action that adjusts the system parameters accordingly. However, effective adaptations depend critically on the monitoring process that should provide an accurate estimation about the system state in a cost-effective manner. In this thesis, we firstly investigate the monitoring of the power consumption. We develop a method, based on several data mining algorithm, to monitor the toggling activity on a few relevant signals selected at the RTL level. The proposed method consists of a generic flow that can be used to model the power consumption for any RTL circuit on any technology. Secondly, we improve the proposed flow by estimating the overall chip thermal behavior and developing a new technique of on-die thermal sensor placement. The proposed algorithms systematically choose the best trade-off between accuracy and overhead. The surface of the chip is decomposed into several thermally homogeneous regions.Besides the design part, modern embedded systems integrates hardware sensors (analog or digital) that can be used to monitor the system’s state. These industrial methods are usually very expensive, and require a large number of units to produce precise information at a fine-grained resolution. An alternative solution to provide an accurate estimation of system’s state is achieved with a set of performance counters that can be configured to track logical events at different levels. To this end, we propose a novel algorithm for the selection of the relevant performance events from the local, shared and system resources. We propose then an implementation of a neural network based estimation algorithm. The proposed method is robust against the external temperature variations. Furthermore, thermal estimation is also can be achieved using the current and historic logical events, and the accuracy is evaluated on the basis of the depth in the past.Finally, once the tracking method and target are defined and the system is configured, the monitoring method should be used at “Run-time”. We implemented a complete adaptation loop, with a dynamic monitoring of the system’s state in order to achieve better energy efficiency.

This thesis researchs the design of quadrature modulator consists of 120MHz quadrature modulator that is fabricated using hybrid elements and print circuit board (PCB) technology for digital signal generator and quadrature modulator monolithic-microwave integrated-circuit (MMIC) that is fabricated using GaAs heterojunction bipolar transistor (HBT) technology for Personal Communication Service (PCS) applications. The 120MHz quadrature modulator incorporates power divider/combiner, phase shifter and doubly balanced mixer; the design architecture, principle and measurement results of division are presented in this thesis. A quadrature modulator is implemented by combining every division and measures specifications accurately, comparing with that of Agilent ESG-D series digital signal generator with the same carrier frequency and digital modulation. The quadrature modulator MMIC for PCS applications incorporates phase shifter, Gilbert cell mixer, differential to single-ended converter and RF amplifier at output; the design architecture, principle and simulation results of division are presented in this thesis. A quadrature modulator is integrated by combining every division and simulates parameters strictly.For troublesome specification measurement of quadrature modulator, this thesis also presents measurement method and instrument setup detailedly.

O avanço das tecnologias de circuitos integrados (CIs) levanta importantes questões relacionadas à confiabilidade e à robustez de sistemas eletrônicos. A diminuição da geometria dos transistores, a redução dos níveis de tensão, as menores capacitâncias e portanto menores correntes e cargas para alimentar os circuitos, além das freqüências de relógio elevadas, têm tornado os CIs mais vulneráveis a falhas, especialmente àquelas causadas por ruído elétrico ou por efeitos induzidos pela radiação. Os efeitos induzidos pela radiação conhecidos como Soft Single Event Effects (Soft SEEs) podem ser classificados em: Single Event Upsets (SEUs) diretos em nós de elementos de armazenagem que resultam em inversões de bits; e pulsos transientes Single Event Transients (SETs) em qualquer nó do circuito. Especialmente SETs em circuitos combinacionais podem se propagar até os elementos de armazenagem e podem ser capturados. Estas errôneas armazenagens podem também serem chamadas de SEUs indiretos. Falhas como SETs e SEUs podem provocar erros em operações funcionais de um CI. Os conhecidos Soft Errors (SEs) são caracterizados por valores armazenados erradamente em elementos de memória durante o uso do CI. SEs podem produzir sérias conseqüências em aplicações de CIs devido à sua natureza não permanente e não recorrente. Por essas razões, mecanismos de proteção para evitar SEs através de técnicas de tolerância a falhas, no mínimo em um nível de abstração do projeto, são atualmente fundamentais para melhorar a confiabilidade de sistemas. Neste trabalho de dissertação, uma versão tolerante a falhas de um microprocessador 8-bits de produção em massa da família M68HC11 foi projetada. A arquitetura é capaz de tolerar SETs e SEUs. Baseado nas técnicas de Redundância Modular Tripla (TMR) e Redundância no Tempo (TR), um esquema de proteção foi projetado e implementado em alto nível no microprocessador alvo usando apenas portas lógicas padrões. O esquema projetado preserva as características da arquitetura padrão de tal forma que a reusabilidade das aplicações do microprocessador é garantida. Um típico fluxo de projeto de circuitos integrados foi desenvolvido através de ferramentas de CAD comerciais. Testes funcionais e injeções de falhas através da simulação de execuções de benchmarks foram realizados como um teste de verificação do projeto. Além disto, detalhes do projeto do circuito integrado tolerante a falhas e resultados em área, performance e potência foram comparados com uma versão não protegida do microprocessador. A área do core aumentou 102,64 % para proteger o circuito alvo contra SETs e SEUs. A performance foi degrada em 12,73 % e o consumo de potência cresceu cerca de 49 % para um conjunto de benchmarks. A área resultante do chip robusto foi aproximadamente 5,707 mm². / The advance of the IC technologies raises important issues related to the reliability and robustness of electronic systems. The transistor scale by shrinking its geometry, the voltage reduction, the lesser capacitances and therefore smaller currents and charges to supply the circuits, besides the higher clock frequencies, have made the IC more vulnerable to faults, especially those faults caused by electrical noise or radiationinduced effects. The radiation-induced effects known as Soft Single Event Effects (Soft SEEs) can be classified into: direct Single Event Upsets (SEUs) at nodes of storage elements that result in bit flips; and Single Event Transient (SET) pulses at any circuit node. Especially SETs on combinational circuits might propagate itself up to the storage elements and might be captured. These erroneous storages can be also called indirect SEUs. Faults like SETs and SEUs can provoke errors in functional operations of an IC. The known Soft Errors (SEs) are characterized by values stored wrongly on memory elements during the use of the IC. They can make serious consequences in IC applications due to their non-permanent and non-recurring nature. By these reasons, protection mechanisms to avoid SEs by using fault-tolerance techniques, at least in one abstraction level of the design, are currently fundamental to improve the reliability of systems. In this dissertation work, a fault-tolerant IC version of a mass-produced 8-bit microprocessor from the M68HC11 family was designed. It is able to tolerate SETs and SEUs. Based on the Triple Modular Redundancy (TMR) and Time Redundancy (TR) fault-tolerance techniques, a protection scheme was designed and implemented at high level in the target microprocessor by using only standard logic gates. The designed scheme preserves the standard-architecture characteristics in such way that the reusability of microprocessor applications is guaranteed. A typical IC design flow was developed by means of commercial CAD tools. Functional testing and fault injection simulations through benchmark executions were performed as a design verification testing. Furthermore, fault-tolerant IC design issues and results in area, performance and power were compared with a non-protected microprocessor version. The core area increased by 102.64 % to protect the target circuit against SETs and SEUs. The performance was degraded in 12.73 % and the power consumption grew around 49 % for a set of benchmarks. The resulting area of the robust chip was approximately 5.707 mm².

O advento da utilização de circuitos integrados pela sociedade se deu por dois motivos. O primeiro consiste na miniaturização das dimensões dos dispositivos integrados. Essa miniaturização permitiu a construção de dispositivos menores, mais rápidos e que consomem menos frequência. O outro fator é a utilização da metodologia baseada em biblioteca de células. Esta metodologia permite o projeto de um circuito eficiente em um curto espaço de tempo. Com a redução dos dispositivos, novos fatores que eram desconsiderados no fluxo automático passaram a ter importância. Dentre eles podemos citar o consumo estático, a variabilidade, a manufaturabilidade e o envelhecimento. Alguns desses fatores, como o consumo estático e a variabilidade, já estão integrados à metodologia baseada em biblioteca de células. Os efeitos de envelhecimento tem sua degradação aumentada a cada novo processo tecnológico, assim como tem aumentado também a sua importância em relação à confiabilidade do circuito ao longo da sua vida útil. Este trabalho irá explorar estes efeitos de envelhecimento no projeto de circuitos integrados digitais. Dentre as principais contribuições pode-se destacar a definição de um custo de envelhecimento na definição de portas lógicas, que pode ser explorado pelos algoritmos de síntese lógica para obterem um circuito mais confiável. Este custo também pode ser utilizado pelas ferramentas de análise a fim de obter uma estimativa da degradação que o circuito proposto irá sofrer ao longo da sua vida útil. Além disso, é apresentada uma proposta de reordenamento estrutural do arranjo de transistores em portas lógicas, a fim de tratar os efeitos de envelhecimento nos níveis mais iniciais do fluxo. Por fim, uma análise simplificada de características a serem exploradas ao nível de circuito é discutida utilizando o auxílio do projeto de portas lógicas complexas. Os resultados apresentam uma boa e rápida estimativa da degradação das portas lógicas. A reestruturação do arranjo dos transistores tem se apresentado como uma boa alternativa ao projeto de circuitos mais confiáveis. Além disso, a utilização de arranjos mais complexos também é uma excelente alternativa que explora a robustez intrínseca da associação de transistores em série. Além disso, as alternativas propostas podem ser utilizadas em conjunto com técnicas já existentes na literatura. / The increased presence of integrated circuit (IC) in the people’s life has occurred for main two reasons. The first is the aggressive scaling of integrated device dimensions. This miniaturization enabled the construction of smaller, faster and lower power consumption devices. The other factor is the use of a cell based methodology in IC design. This methodology is able to provide efficient circuits in a short time. With the devices scaling, new factors that were usually ignored in micrometer technologies have become relevant in nanometer designs. Among them, it can be mentioned the static consumption, process parameters variability, manufacturability and aging effects. Some of these factors, such as static consumption and variability, are already taken into account by the standard cell design methodology. On the other hand, the degradation caused by aging effects has increased at each new technology node, as well as the importance in relation to the circuit reliability throughout its entire lifetime has also increased. This thesis explores such aging effects in the design of digital IC. The main contributions can be highlighted as the definition of a cost of aging that can be exploited by logic synthesis algorithms to produce a more reliable circuit. This cost can be also used by the analysis tools in order to obtain an estimative of the degradation that specific circuit experiences throughout their lifetime. In addition, a proposal to reorder the transistor structural arrangement of logic gates is presented in order to treat the effects of aging on initial steps in the design flow. Finally, a simplified analysis of the characteristics to be exploited at circuit level is performed exploring details of the design of complex logic gates. The aging cost results have given a good and fast prediction of logic gates degradation. The transistor arrangement restructuring approach is a good alternative to design more reliable circuits. Furthermore, the use of complex arrangements is also an excellent alternative which exploits the intrinsic robustness of series transistors association. Moreover, the discussed approaches can be easily used together with existing techniques in the literature to achieve better results.

O avanço das tecnologias de circuitos integrados (CIs) levanta importantes questões relacionadas à confiabilidade e à robustez de sistemas eletrônicos. A diminuição da geometria dos transistores, a redução dos níveis de tensão, as menores capacitâncias e portanto menores correntes e cargas para alimentar os circuitos, além das freqüências de relógio elevadas, têm tornado os CIs mais vulneráveis a falhas, especialmente àquelas causadas por ruído elétrico ou por efeitos induzidos pela radiação. Os efeitos induzidos pela radiação conhecidos como Soft Single Event Effects (Soft SEEs) podem ser classificados em: Single Event Upsets (SEUs) diretos em nós de elementos de armazenagem que resultam em inversões de bits; e pulsos transientes Single Event Transients (SETs) em qualquer nó do circuito. Especialmente SETs em circuitos combinacionais podem se propagar até os elementos de armazenagem e podem ser capturados. Estas errôneas armazenagens podem também serem chamadas de SEUs indiretos. Falhas como SETs e SEUs podem provocar erros em operações funcionais de um CI. Os conhecidos Soft Errors (SEs) são caracterizados por valores armazenados erradamente em elementos de memória durante o uso do CI. SEs podem produzir sérias conseqüências em aplicações de CIs devido à sua natureza não permanente e não recorrente. Por essas razões, mecanismos de proteção para evitar SEs através de técnicas de tolerância a falhas, no mínimo em um nível de abstração do projeto, são atualmente fundamentais para melhorar a confiabilidade de sistemas. Neste trabalho de dissertação, uma versão tolerante a falhas de um microprocessador 8-bits de produção em massa da família M68HC11 foi projetada. A arquitetura é capaz de tolerar SETs e SEUs. Baseado nas técnicas de Redundância Modular Tripla (TMR) e Redundância no Tempo (TR), um esquema de proteção foi projetado e implementado em alto nível no microprocessador alvo usando apenas portas lógicas padrões. O esquema projetado preserva as características da arquitetura padrão de tal forma que a reusabilidade das aplicações do microprocessador é garantida. Um típico fluxo de projeto de circuitos integrados foi desenvolvido através de ferramentas de CAD comerciais. Testes funcionais e injeções de falhas através da simulação de execuções de benchmarks foram realizados como um teste de verificação do projeto. Além disto, detalhes do projeto do circuito integrado tolerante a falhas e resultados em área, performance e potência foram comparados com uma versão não protegida do microprocessador. A área do core aumentou 102,64 % para proteger o circuito alvo contra SETs e SEUs. A performance foi degrada em 12,73 % e o consumo de potência cresceu cerca de 49 % para um conjunto de benchmarks. A área resultante do chip robusto foi aproximadamente 5,707 mm². / The advance of the IC technologies raises important issues related to the reliability and robustness of electronic systems. The transistor scale by shrinking its geometry, the voltage reduction, the lesser capacitances and therefore smaller currents and charges to supply the circuits, besides the higher clock frequencies, have made the IC more vulnerable to faults, especially those faults caused by electrical noise or radiationinduced effects. The radiation-induced effects known as Soft Single Event Effects (Soft SEEs) can be classified into: direct Single Event Upsets (SEUs) at nodes of storage elements that result in bit flips; and Single Event Transient (SET) pulses at any circuit node. Especially SETs on combinational circuits might propagate itself up to the storage elements and might be captured. These erroneous storages can be also called indirect SEUs. Faults like SETs and SEUs can provoke errors in functional operations of an IC. The known Soft Errors (SEs) are characterized by values stored wrongly on memory elements during the use of the IC. They can make serious consequences in IC applications due to their non-permanent and non-recurring nature. By these reasons, protection mechanisms to avoid SEs by using fault-tolerance techniques, at least in one abstraction level of the design, are currently fundamental to improve the reliability of systems. In this dissertation work, a fault-tolerant IC version of a mass-produced 8-bit microprocessor from the M68HC11 family was designed. It is able to tolerate SETs and SEUs. Based on the Triple Modular Redundancy (TMR) and Time Redundancy (TR) fault-tolerance techniques, a protection scheme was designed and implemented at high level in the target microprocessor by using only standard logic gates. The designed scheme preserves the standard-architecture characteristics in such way that the reusability of microprocessor applications is guaranteed. A typical IC design flow was developed by means of commercial CAD tools. Functional testing and fault injection simulations through benchmark executions were performed as a design verification testing. Furthermore, fault-tolerant IC design issues and results in area, performance and power were compared with a non-protected microprocessor version. The core area increased by 102.64 % to protect the target circuit against SETs and SEUs. The performance was degraded in 12.73 % and the power consumption grew around 49 % for a set of benchmarks. The resulting area of the robust chip was approximately 5.707 mm².

abstract: Time-interleaved analog to digital converters (ADCs) have become critical components in high-speed communication systems. Consumers demands for smaller size, more bandwidth and more features from their communication systems have driven the market to use modern complementary metal-oxide-semiconductor (CMOS) technologies with shorter channel-length transistors and hence a more compact design. Downscaling the supply voltage which is required in submicron technologies benefits digital circuits in terms of power and area. Designing accurate analog circuits, however becomes more challenging due to the less headroom. One way to overcome this problem is to use calibration to compensate for the loss of accuracy in analog circuits. Time-interleaving increases the effective data conversion rate in ADCs while keeping the circuit requirements the same. However, this technique needs special considerations as other design issues associated with using parallel identical channels emerge. The first and the most important is the practical issue of timing mismatch between channels, also called sample-time error, which can directly affect the performance of the ADC. Many techniques have been developed to tackle this issue both in analog and digital domains. Most of these techniques have high complexities especially when the number of channels exceeds 2 and some of them are only valid when input signal is a single tone sinusoidal which limits the application. This dissertation proposes a sample-time error calibration technique which bests the previous techniques in terms of simplicity, and also could be used with arbitrary input signals. A 12-bit 650 MSPS pipeline ADC with 1.5 GHz analog bandwidth for digital beam forming systems is designed in IBM 8HP BiCMOS 130 nm technology. A front-end sample-and-hold amplifier (SHA) was also designed to compare with an SHA-less design in terms of performance, power and area. Simulation results show that the proposed technique is able to improve the SNDR by 20 dB for a mismatch of 50% of the sampling period and up to 29 dB at 37% of the Nyquist frequency. The designed ADC consumes 122 mW in each channel and the clock generation circuit consumes 142 mW. The ADC achieves 68.4 dB SNDR for an input of 61 MHz. / Dissertation/Thesis / Doctoral Dissertation Electrical Engineering 2017

O advento da utilização de circuitos integrados pela sociedade se deu por dois motivos. O primeiro consiste na miniaturização das dimensões dos dispositivos integrados. Essa miniaturização permitiu a construção de dispositivos menores, mais rápidos e que consomem menos frequência. O outro fator é a utilização da metodologia baseada em biblioteca de células. Esta metodologia permite o projeto de um circuito eficiente em um curto espaço de tempo. Com a redução dos dispositivos, novos fatores que eram desconsiderados no fluxo automático passaram a ter importância. Dentre eles podemos citar o consumo estático, a variabilidade, a manufaturabilidade e o envelhecimento. Alguns desses fatores, como o consumo estático e a variabilidade, já estão integrados à metodologia baseada em biblioteca de células. Os efeitos de envelhecimento tem sua degradação aumentada a cada novo processo tecnológico, assim como tem aumentado também a sua importância em relação à confiabilidade do circuito ao longo da sua vida útil. Este trabalho irá explorar estes efeitos de envelhecimento no projeto de circuitos integrados digitais. Dentre as principais contribuições pode-se destacar a definição de um custo de envelhecimento na definição de portas lógicas, que pode ser explorado pelos algoritmos de síntese lógica para obterem um circuito mais confiável. Este custo também pode ser utilizado pelas ferramentas de análise a fim de obter uma estimativa da degradação que o circuito proposto irá sofrer ao longo da sua vida útil. Além disso, é apresentada uma proposta de reordenamento estrutural do arranjo de transistores em portas lógicas, a fim de tratar os efeitos de envelhecimento nos níveis mais iniciais do fluxo. Por fim, uma análise simplificada de características a serem exploradas ao nível de circuito é discutida utilizando o auxílio do projeto de portas lógicas complexas. Os resultados apresentam uma boa e rápida estimativa da degradação das portas lógicas. A reestruturação do arranjo dos transistores tem se apresentado como uma boa alternativa ao projeto de circuitos mais confiáveis. Além disso, a utilização de arranjos mais complexos também é uma excelente alternativa que explora a robustez intrínseca da associação de transistores em série. Além disso, as alternativas propostas podem ser utilizadas em conjunto com técnicas já existentes na literatura. / The increased presence of integrated circuit (IC) in the people’s life has occurred for main two reasons. The first is the aggressive scaling of integrated device dimensions. This miniaturization enabled the construction of smaller, faster and lower power consumption devices. The other factor is the use of a cell based methodology in IC design. This methodology is able to provide efficient circuits in a short time. With the devices scaling, new factors that were usually ignored in micrometer technologies have become relevant in nanometer designs. Among them, it can be mentioned the static consumption, process parameters variability, manufacturability and aging effects. Some of these factors, such as static consumption and variability, are already taken into account by the standard cell design methodology. On the other hand, the degradation caused by aging effects has increased at each new technology node, as well as the importance in relation to the circuit reliability throughout its entire lifetime has also increased. This thesis explores such aging effects in the design of digital IC. The main contributions can be highlighted as the definition of a cost of aging that can be exploited by logic synthesis algorithms to produce a more reliable circuit. This cost can be also used by the analysis tools in order to obtain an estimative of the degradation that specific circuit experiences throughout their lifetime. In addition, a proposal to reorder the transistor structural arrangement of logic gates is presented in order to treat the effects of aging on initial steps in the design flow. Finally, a simplified analysis of the characteristics to be exploited at circuit level is performed exploring details of the design of complex logic gates. The aging cost results have given a good and fast prediction of logic gates degradation. The transistor arrangement restructuring approach is a good alternative to design more reliable circuits. Furthermore, the use of complex arrangements is also an excellent alternative which exploits the intrinsic robustness of series transistors association. Moreover, the discussed approaches can be easily used together with existing techniques in the literature to achieve better results.