Yang, Xiaoqing. / Thesis (Ph.D.)--Chinese University of Hong Kong, 2011. / Includes bibliographical references (leaves 113-120). / Electronic reproduction. Hong Kong : Chinese University of Hong Kong, [2012] System requirements: Adobe Acrobat Reader. Available via World Wide Web. / Abstract also in Chinese.

Among the many efforts to improve the IC test process are tests that attempt to differentiate between healthy and defective or low reliability ICs by manipulating the operating conditions of the IC being tested. This thesis attempts to improve the common understanding of multiple and targeted temperature testing by evaluating work published on the subject to date and by presenting previously unpublished empirical observations. The empirical observations are made from SCAN and LBIST based MinVDD measurements, Static IDD measurements, as well as parametric measurements of transistor characteristics. The test vehicles used are 0.25μm and 0.18μm CMOS ASICs fabricated by LSI Logic. An IC’s performance is bound by a three dimensional space defined by VDD, frequency, and temperature. A model is presented to explain the boundaries of the performance region in terms of the ability of the IC’s constituent transistors to provide power and the Zero-Temperature-Coefficient (ZTC). Also, it is determined that multiple temperature testing can add new tests to current test suites to improve the resolution between healthy and defective ICs.

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Thesis: Ph. D., Massachusetts Institute of Technology, Department of Electrical Engineering and Computer Science, 1981 / Includes bibliographical references. / by David Carl Shaver. / Ph. D. / Ph. D. Massachusetts Institute of Technology, Department of Electrical Engineering and Computer Science

This thesis proposes a multifaceted production test and post-manufacture yield enhancement framework for RF systems. This framework uses low-cost test and post-manufacture calibration/tuning techniques. Since the test cost and the yield of the RF circuits/sub-system directly contribute to the manufacturing cost of RF systems, the proposed framework minimizes overall RF systems' manufacturing cost by taking two approaches. In the first approach, low-cost testing methodologies are proposed for RF amplifiers and integrated RF substrates with an embedded RF passive filter and interconnect. Techniques are developed to test RF circuits by the analysis of low-frequency signal of the order of few MHz and without using any external RF test-stimulus. Oscillation principles are used to enable testing of RF circuits without any external test-stimulus. In the second approach, to increase the yield of the RF circuits for parametric defects, RF circuits are tuned to compensate for a performance loss during production test using on-board or on-chip resources. This approach includes a diagnosis algorithm to identify faulty circuits within the system, and performs a compensation process that adjusts tunable components to enhance the performance of the RF circuits. In the proposed yield improvement methodologies, the external test stimulus is not required because the stimulus is generated by the RF circuit itself with the help of additional circuitry and faulty circuits are detected using low-cost test methods developed in this research. As a result, the proposed research enables low-cost testing and self-healing of RF systems.