• Refine Query
  • Source
  • Publication year
  • to
  • Language
  • 136
  • 38
  • 22
  • 18
  • 18
  • 18
  • 18
  • 18
  • 18
  • 3
  • Tagged with
  • 217
  • 217
  • 217
  • 217
  • 217
  • 216
  • 87
  • 69
  • 52
  • 34
  • 27
  • 26
  • 23
  • 23
  • 22
  • About
  • The Global ETD Search service is a free service for researchers to find electronic theses and dissertations. This service is provided by the Networked Digital Library of Theses and Dissertations.
    Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.
71

A distributed design rule checker for VLSI layouts

Al-Mahmood, Saiyid Jami Islah Ahmad 01 November 2008 (has links)
VLSI technology is continually fueling the need for more efficient computer aided design tools. Parallel or distributed processing is a possible solution to this problem. Advances in computer networking have made distributed processing over a local area network very attractive and cost-effective. This research investigates the application of such a large-grained parallel processing method to the task of checking geometric constraints or design rules that are imposed on the layout of VLSI circuits to ensure a correct implementation of the design despite imperfections in the fabrication process. The thesis begins with a study of design rule checking algorithms including algorithms for parallel processing as applied to design rule checking. Then, the algorithms for a technology independent design rule verification tool are developed. For distributed processing, two separate approaches are examined. One approach, called the data partitioning method, divides a fully instantiated or non-hierarchical layout into several sections and then processes each section on a different computer. The second approach looks for smaller tasks within the design rule checking process that can be executed in parallel and is called the task partitioning method. A dynamic task-scheduling algorithm is used to assign the tasks to the available processors. Implementations of both of these parallel processing schemes on a local area network of workstations are described. Experiments are performed to assess the performance of the programs and the results of testing a few layouts are presented. / Master of Science
72

Analytical modeling and simulation of bicmos for VLSI circuits

Narayanan, Prakash 25 April 2009 (has links)
Interest in BiCMOS technology has been generated recently due to the potential advantages this technology offers over conventional CMOS which enjoys widespread use in today’s semiconductor industry. However, before BiCMOS can be readily adopted by the VLSI community, an understanding of the design issues and tradeoffs involved when utilizing it, must be achieved. The principal focus of this research is to move towards such an understanding through the means of analytical modeling and circuit simulation using PSPICE [1]. The device chosen for the modeling approach is the basic BiCMOS Inverting Buffer Driver. The model yields equations that characterize output rise and fall transients and quantify the delays incurred therein. At the end of the analysis, we have a composite set of delay equations that are a measure of the total gate delay and reflect the importance of individual device and circuit parameters in determining this delay. Further investigations conducted to determine the influence of device, circuit and process parameters on BiCMOS, indicate that this technology is far more resilient to variations in such parameters than CMOS. At the end of this research, we are able to make a definitive judgement about BiCMOS performance and its superiority over CMOS in the switching speed domain. / Master of Science
73

Analysis techniques for nanometer digital integrated circuits

Ramalingam, Anand, 1979- 29 August 2008 (has links)
As technology has scaled into nanometer regime, manufacturing variations have emerged as a major limiter of performance (timing) in VLSI circuits. Issues related to timing are addressed in the first part of the dissertation. Statistical Static Timing Analysis (SSTA) has been proposed to perform full-chip analysis of timing under uncertainty such as manufacturing variations. In this dissertation, we propose an efficient sparse-matrix framework for a path-based SSTA. In addition to an efficient framework for doing timing analysis, to improve the accuracy of the timing analysis one needs to address the accuracy of: waveform modeling, and gate delay modeling. We propose a technique based on Singular Value Decomposition (SVD) that accurately models the waveform in a timing analyzer. To improve the gate delay modeling, we propose a closed form expression based on the centroid of power dissipation. This new metric is inspired by our key observation that the Sakurai-Newton (SN) delay metric can be viewed as the centroid of current. In addition to accurately analyzing the timing of a chip, improving timing is another major concern. One way to improve timing is to scale down the threshold voltage (Vth). But scaling down increases the subthreshold leakage current exponentially. Sleep transistors have been proposed to reduce leakage current while maintaining performance. We propose a path-based algorithm to size the sleep transistor to reduce leakage while maintaining the required performance. In the second part of dissertation we address power grid and thermal issues that arise due to the scaling of integrated circuits. In the case of power grid simulation, we propose fast and efficient techniques to analyze the power grid with accurate modeling of the transistor network. The transistor is modeled as a switch in series with an RC and the switch itself is modeled behaviorally. This model allows more accurate prediction of voltage drop compared to the current source model. In the case of thermal simulation, we address the issue of ignoring the nonlinearity of thermal conductivity in silicon. We found that ignoring the nonlinearity of thermal conductivity may lead to a temperature profile that is off by 10° C.
74

Complexity management and modelling of VLSI systems

Dickinson, Alex. January 1988 (has links) (PDF)
Bibliography: leaves 249-260.
75

Dynamic testibility measures and their use in ATPG

Ivanov, André. January 1985 (has links)
No description available.
76

Dynamic testibility measures and their use in ATPG

Ivanov, André January 1985 (has links)
No description available.
77

Design and implementation of an integrated VLSI packaging support software environment

Whipple, Thomas Driggs, 1961- January 1989 (has links)
An interactive software shell has been developed which integrates several packaging simulation tools developed at the University of Arizona which are used to analyze electro-magnetic coupling between interconnects in an integrated circuit. This software shell uses experimental frames to manage this simulation process. Through the experimental frames, the model descriptions and the model inputs are separated, and input data is verified for correctness. This model/input separation allows several model variations to be tested based on several input variations. The results of these simulations are then analyzed and displayed graphically. Further work for the software shell is discussed. This tool provides a user-friendly, efficient method for performing coupled-line analyses in interconnect systems.
78

Passivity checking and enforcement in VLSI model reduction exercise

Liu, Yansong., 劉岩松. January 2008 (has links)
published_or_final_version / Electrical and Electronic Engineering / Master / Master of Philosophy
79

Geometric programming and signal flow graph assisted design of interconnect and analog circuits

張永泰, Cheung, Wing-tai. January 2007 (has links)
published_or_final_version / abstract / Electrical and Electronic Engineering / Master / Master of Philosophy
80

S-parameter VLSI transmission line analysis.

Cooke, Bradly James. January 1989 (has links)
This dissertation investigates the implementation of S-parameter based network techniques for the analysis of multiconductor, high speed VLSI integrated circuit and packaging interconnects. The S-parameters can be derived from three categories of input parameters: (1) lossy quasi-static R,L,C and G, (2) lossy frequency dependent (dispersive) R,L,C,G and (3) the propagation constants, Γ, the characteristic impedance, Z(c) and the conductor eigencurrents, I, derived from full wave analysis. The S-parameter network techniques developed allow for: the analysis of periodic waveform excitation, the incorporation of externally measured or calculated scattering parameter data and large system analysis through macro decomposition. The inclusion of non-linear terminations has also been developed.

Page generated in 0.2864 seconds