Thesis (M. S.)--Materials Science and Engineering, Georgia Institute of Technology, 2009. / Committee Chair: Tummala, Rao; Committee Member: Iyer, Mahadevan; Committee Member: Saxena, Ashok; Committee Member: Swaminathan, Madhavan; Committee Member: Wong, Chingping.

Thesis (Ph.D.)--Hong Kong University of Science and Technology, 2009. / Includes bibliographical references.

Thesis (Ph.D)--Electrical and Computer Engineering, Georgia Institute of Technology, 2010. / Committee Chair: Jeffrey A. Davis; Committee Co-Chair: James D. Meindl; Committee Member: Azad J. Naeemi; Committee Member: Dennis W. Hess; Committee Member: George F. Riley; Committee Member: Linda S. Milor. Part of the SMARTech Electronic Thesis and Dissertation Collection.

Thesis (Ph. D.)--University of Texas at Austin, 2005. / Supervisor: Paul S. Ho. Vita. Includes bibliographical references.

Thesis (Ph. D.)--University of Texas at Austin, 2007. / Vita. Includes bibliographical references.

Undergraduate honors paper--Mount Holyoke College, 2007. Dept. of Physics. / Includes bibliographical references (leaves 99-100).

The path towards realizing next-generation petascale and exascale computing is increasingly dependent on building supercomputers with unprecedented numbers of processors. Given the rise of multicore processors, the number of network endpoints both on-chip and off-chip is growing exponentially, with systems in 2018 anticipated to contain thousands of processing elements on-chip and billions of processing elements system-wide. To prevent the interconnect from dominating the overall cost of future systems, there is a critical need for scalable interconnects that capture the communication requirements of target ultrascale applications. It is therefore essential to understand high-end application communication characteristics across a broad spectrum of computational methods, and utilize that insight to tailor interconnect designs to the specific requirements of the underlying codes. This work makes several unique contributions towards attaining that goal. First, the communication traces for a number of high-end application communication requirements, whose computational methods include: finite-difference, lattice-Boltzmann, particle-in-cell, sparse linear algebra, particle mesh ewald, and FFT-based solvers. This thesis presents an introduction to the fit-tree approach for designing network infrastructure that is tailored to application requirements. A fit-tree minimizes the component count of an interconnect without impacting application performance compared to a fully connected network. The last section introduces a methodology for reconfigurable networks to implement fit-tree solutions called Hybrid Flexibly Assignable Switch Topology (HFAST). HFAST uses both passive (circuit) and active (packet) commodity switch components in a unique way to dynamically reconfigure interconnect wiring to suit the topological requirements of scientific applications. Overall the exploration points to several promising directions for practically addressing both the on-chip and off-chip interconnect requirements of future ultrascale systems. / Master of Science

<p>The continuous miniaturization of integrated circuits has opened the path towards System-on-Chip realizations. Process shrinking into the nanometer regime improves transistor performancewhile the delay of global interconnects, connecting circuit blocks separated by a long distance, significantly increases. In fact, global interconnects extending across a full chip can have a delay corresponding to multiple clock cycles. At the same time, global clock skew constraints, not only between blocks but also along the pipelined interconnects, become even tighter. On-chip interconnects have always been considered <em>RC</em>-like, that is exhibiting long <em>RC</em>-delays. This has motivated large efforts on alternatives such as on-chip optical interconnects, which have not yet been demonstrated, or complex schemes utilizing on-chip F-transmission or pulsed current-mode signaling.</p><p>In this thesis, we show that well-designed electrical global interconnects, behaving as transmission lines, have the capacity of very high data rates (higher than can be delivered by the actual process) and support near velocity-of-light delay for single-ended voltage-mode signaling, thus mitigating the <em>RC</em>-problem. We critically explore key interconnect performance measures such as data delay, maximum data rate, crosstalk, edge rates and power dissipation. To experimentally demonstrate the feasibility and superior properties of on-chip transmission line interconnects, we have designed and fabricated a test chip carrying a 5 mm long global communication link. Measurements show that we can achieve 3 Gb/s/wire over the 5 mm long, repeaterless on-chip bus implemented in a standard 0.18 μm CMOS process, achieving a signal velocity of 1/3 of the velocity of light in vacuum.</p><p>To manage the problems due to global wire delays, we describe and implement a Synchronous Latency Insensitive Design (SLID) scheme, based on source-synchronous data transfer between blocks and data re-timing at the receiving block. The SLIDtechnique not onlymitigates unknown globalwire delays, but also removes the need for controlling global clock skew. The high-performance and high robustness capability of the SLID-method is practically demonstrated through a successful implementation of a SLID-based, 5.4 mm long, on-chip global bus, supporting 3 Gb/s/wire and dynamically accepting ± 2 clock cycles of data-clock skew, in a standard 0.18 μm CMOS porcess.</p><p>In the context of technology scaling, there is a tendency for interconnects to dominate chip power dissipation due to their large total capacitance. In this thesis we address the problem of interconnect power dissipation by proposing and analyzing a transition-energy cost model aimed for efficient power estimation of performancecritical buses. The model, which includes properties that closely capture effects present in high-performance VLSI buses, can be used to more accurately determine the energy benefits of e.g. transition coding of bus topologies. We further show a power optimization scheme based on appropriate choice of reduced voltage swing of the interconnect and scaling of receiver amplifier. Finally, the power saving impact of swing reduction in combination with a sense-amplifying flip-flop receiver is shown on a microprocessor cache bus architecture used in industry.</p>

A novel method for modeling bends in coplanar waveguides (CPWs) is described. The CPW can be viewed as a pair of parallel coupled quasi-slot lines. Bends in the CPW are modeled as a non-uniform coupled line system in terms of their even- and odd- mode characteristics. This modeling approach is general and can be applied for bends with different angles and other similar discontinuities in the CPW. The salient feature of the model is the simplified illustration of frequency dependent effects in the bend. Right-angle, 45 degree, and mitered right-angle bends in the CPW are analyzed, and models are developed for each bend structure. The procedure for extracting the modal scattering matrix from the model is presented. To demonstrate the accuracy of the model, modal transmission coefficients obtained from the model are compared with full-wave electromagnetic simulations. Good agreement between the model and full-wave simulation results over a wide frequency range is demonstrated. The transfer of energy between even and odd modes in the bend is investigated and the effect of the physical properties of the CPW on mode conversion is analyzed in detail. Mode conversion at discontinuities like the bend in CPWs cause non-ideal behavior in the two-port (even-mode) measurements of such circuits. Theoretical prediction of the measured response is discussed along with the predicted response for transmission coefficient from model and full-wave simulations. Comparison between the measurements of a right-angle bend and the corresponding model results shows good agreement. Implementation of the model in SPICE is also discussed. / Graduation date: 2004

The continuous miniaturization of integrated circuits has opened the path towards System-on-Chip realizations. Process shrinking into the nanometer regime improves transistor performancewhile the delay of global interconnects, connecting circuit blocks separated by a long distance, significantly increases. In fact, global interconnects extending across a full chip can have a delay corresponding to multiple clock cycles. At the same time, global clock skew constraints, not only between blocks but also along the pipelined interconnects, become even tighter. On-chip interconnects have always been considered RC-like, that is exhibiting long RC-delays. This has motivated large efforts on alternatives such as on-chip optical interconnects, which have not yet been demonstrated, or complex schemes utilizing on-chip F-transmission or pulsed current-mode signaling. In this thesis, we show that well-designed electrical global interconnects, behaving as transmission lines, have the capacity of very high data rates (higher than can be delivered by the actual process) and support near velocity-of-light delay for single-ended voltage-mode signaling, thus mitigating the RC-problem. We critically explore key interconnect performance measures such as data delay, maximum data rate, crosstalk, edge rates and power dissipation. To experimentally demonstrate the feasibility and superior properties of on-chip transmission line interconnects, we have designed and fabricated a test chip carrying a 5 mm long global communication link. Measurements show that we can achieve 3 Gb/s/wire over the 5 mm long, repeaterless on-chip bus implemented in a standard 0.18 μm CMOS process, achieving a signal velocity of 1/3 of the velocity of light in vacuum. To manage the problems due to global wire delays, we describe and implement a Synchronous Latency Insensitive Design (SLID) scheme, based on source-synchronous data transfer between blocks and data re-timing at the receiving block. The SLIDtechnique not onlymitigates unknown globalwire delays, but also removes the need for controlling global clock skew. The high-performance and high robustness capability of the SLID-method is practically demonstrated through a successful implementation of a SLID-based, 5.4 mm long, on-chip global bus, supporting 3 Gb/s/wire and dynamically accepting ± 2 clock cycles of data-clock skew, in a standard 0.18 μm CMOS porcess. In the context of technology scaling, there is a tendency for interconnects to dominate chip power dissipation due to their large total capacitance. In this thesis we address the problem of interconnect power dissipation by proposing and analyzing a transition-energy cost model aimed for efficient power estimation of performancecritical buses. The model, which includes properties that closely capture effects present in high-performance VLSI buses, can be used to more accurately determine the energy benefits of e.g. transition coding of bus topologies. We further show a power optimization scheme based on appropriate choice of reduced voltage swing of the interconnect and scaling of receiver amplifier. Finally, the power saving impact of swing reduction in combination with a sense-amplifying flip-flop receiver is shown on a microprocessor cache bus architecture used in industry.