Robotics has been considered as a viable automation solution for the aerospace industry to address manufacturing cost. Many of the existing robot systems augmented with guidance from a large volume metrology system have proved to meet the high dimensional accuracy requirements in aero-structure assembly. However, they have been mainly deployed as costly and dedicated systems, which might not be ideal for aerospace manufacturing having low production rate and long cycle time. The work described in this thesis is to provide technical solutions to improve the flexibility and cost-efficiency of such metrology-integrated robot systems. To address the flexibility, a software framework that supports reconfigurable system integration is developed. The framework provides a design methodology to compose distributed software components which can be integrated dynamically at runtime. This provides the potential for the automation devices (robots, metrology, actuators etc.) controlled by these software components to be assembled on demand for various assembly applications. To reduce the cost of deployment, this thesis proposes a two-stage error compensation scheme for industrial robots that requires only intermittent metrology input, thus allowing for one expensive metrology system to be used by a number of robots. Robot calibration is employed in the first stage to reduce the majority of robot inaccuracy then the metrology will correct the residual errors. In this work, a new calibration model for serial robots having a parallelogram linkage is developed that takes into account both geometric errors and joint deflections induced by link masses and weight of the end-effectors. Experiments are conducted to evaluate the two pieces of work presented above. The proposed framework is adopted to create a distributed control system that implements calibration and error compensation for a large industrial robot having a parallelogram linkage. The control system is formed by hot-plugging the control applications of the robot and metrology used together. Experimental results show that the developed error model was able to improve the 3s positional accuracy of the loaded robot from several millimetres to less than one millimetre and reduce half of the time previously required to correct the errors by using only the metrology. The experiments also demonstrate the capability of sharing one metrology system to more than one robot.

[pt] O objetivo desta pesquisa é propor o desenvolvimento de uma metodologia baseada em métodos estatísticos para mensurar, a priori, as variáveis que compõem o índice de cobrabilidade de uma empresa distribuidora de energia elétrica brasileira. Tal índice, definido como a razão entre a arrecadação do mês corrente e o faturamento anterior, representa, para a cadeia de valor das empresas distribuidoras de energia elétrica, o retorno dos custos e a geração de excedentes para investimentos. O uso de métodos estatísticos tem propiciado às organizações modelar e quantificar as incertezas presentes nas variáveis do processo de tomada de decisão. A motivação para o desenvolvimento do trabalho ocorreu devido à necessidade empresarial de uma distribuidora em atribuir confiabilidade ao índice supracitado. A pesquisa foi realizada considerando uma amostra dos clientes cativos que pertencem ao grupo A de uma distribuidora de energia elétrica brasileira. A metodologia proposta consiste em: (i) utilizar estatísticas descritivas e modelo de previsão em séries temporais para fornecer a projeção de faturamento e de arrecadação mensal da distribuidora de energia elétrica visando estabelecer, a priori, o índice de cobrabilidade mensal desta e, (ii) adaptar e aplicar os gráficos de controle Wineglass, Shipwreck e Outlook a fim de monitorar diariamente a relação arrecadação prevista versus arrecadação real. Os resultados revelaram que a metodologia proposta estabelece uma estimativa confiável das variáveis que compõem o índice de cobrabilidade visto que o erro percentual de previsão é mínimo. / [en] The objective of this research is to a propose the development of a methodology based on statistical methods to measure, a priori, the variables which compose the index of collectability of a Brazilian company distributing electric energy. This index, defined as the ratio between the revenue of current month by previous billing, represents for the value chain of the companies distributing electric energy, the return costs and generate surpluses for investment. The use of statistical methods has enabled organizations to model and quantify the uncertainties present in the variables of the process of decision making. The motivation for development of the work was due to need of the companies distributing to assign reliability to the aforementioned index. The research was conducted considering a sample of captive customers who belong to the group A of a Brazilian company distributing electric energy. The proposed methodology consists of: (i) use descriptive statistic and forecasting model to provide a projection of billing and revenue monthly of companies distributing electric energy for the purpose of establish, a priori, the monthly index of collectability and, (ii) adapt and apply the control charts Wineglass, Shipwreck and Outlook for the monitoring daily of the relation forecast revenue against real revenue. The results showed that the proposed methodology provides a reliable estimate of the variables which compose the collectability index since the percentage error of prediction is minimal.

We present the development of a far-field magneto-optical Kerr effect microscope. An inverted optical microscope was constructed to accommodate Kerr imaging and atomic force microscopy. In Kerr microscopy, magnetic structure is investigated by measuring the polarization rotation of light reflected from a sample in the presence of a magnetic field. Atomic force microscopy makes use of a probe which is scanned over a sample surface to map the topography. The design was created virtually in SolidWorks, a three-dimensional computer-aided drafting environment, to ensure compatibility and function of the various components, both commercial and custom-machined, required for the operation of this instrument. The various aspects of the microscope are controlled by custom circuitry and a field programmable gate array data acquisition card at the direction of the control code written in National Instrument LabVIEW. The microscope has proven effective for both Kerr and atomic force microscopy. Kerr images are presented which reveal the bit structure of magneto-optical disks, as are atomic force micrographs of an AFM calibration grid. Also discussed is the future direction of this project, which entails improving the resolution of the instrument beyond the diffraction limit through near-field optical techniques. Preliminary work on fiber probe designs is presented along with probe fabrication work and the system modifications necessary to utilize such probes.

This dissertation describes research concerned with the use of advanced measurement techniques for the control of robotic manufacturing processes. The work focused on improving the state of technology in the precision robotic machining of components within the aerospace manufacturing industry within Australia. Specific contributions are the development of schemes for the use of advanced measurement equipment in precision machining operations and to apply flexible manufacturing techniques in automated manufacturing. The outcome of the research enables placement of a robotic end effector to drill a hole with a positional accuracy of 300 micron, employing an Indoor Global Positioning System for control of the drilling process. This can be accomplished within a working area of 35 square metres where the robot system and/or part positions may be varied dynamically during the process. Large aerospace structures are capable of flexing during manufacturing operations due to their physical size and low modulus of rigidity. This research work provided a framework for determining the appropriate type of automation and metrology systems needed for dynamic control suited to the precision drilling of holes in large aerospace components.

<p>This master's thesis addresses two main problems. The first is how to suppress a common mode voltage that appears for current shunts, and the second how to let a voltage divider work under an unloaded condition to prevent loading errors and thereby a decreased measurement accuracy. Both these problems occurs during calibration of power meters, and verification of current shunts and voltage dividers. To the first problem three alternative solutions are presented; prototype a proposed instrumentation amplifier circuit, evaluate the commercial available instrumentation amplifier Analog Devices AD8130 or let the voltage measuring device suppress the common mode voltage. It is up to the researchers at SP to choose a solution. To address the second problem, a prototype buffer amplifier is built and verified. Measurements of the buffer amplifier show that it performs very well. At 100 kHz, the amplitude error is less than 20 μV/V, the phase error is less than 20 μrad, and the input R_p is over 10 MΩ. This is performance in line with the required to make accurate measurements possible at 100 kHz and over that.</p>

Thesis (Ph. D.)--University of Washington, 2006. / Vita. Includes bibliographical references (p. 145-151).

Robotics has been considered as a viable automation solution for the aerospace industry to address manufacturing cost. Many of the existing robot systems augmented with guidance from a large volume metrology system have proved to meet the high dimensional accuracy requirements in aero-structure assembly. However, they have been mainly deployed as costly and dedicated systems, which might not be ideal for aerospace manufacturing having low production rate and long cycle time. The work described in this thesis is to provide technical solutions to improve the flexibility and cost-efficiency of such metrology-integrated robot systems. To address the flexibility, a software framework that supports reconfigurable system integration is developed. The framework provides a design methodology to compose distributed software components which can be integrated dynamically at runtime. This provides the potential for the automation devices (robots, metrology, actuators etc.) controlled by these software components to be assembled on demand for various assembly applications. To reduce the cost of deployment, this thesis proposes a two-stage error compensation scheme for industrial robots that requires only intermittent metrology input, thus allowing for one expensive metrology system to be used by a number of robots. Robot calibration is employed in the first stage to reduce the majority of robot inaccuracy then the metrology will correct the residual errors. In this work, a new calibration model for serial robots having a parallelogram linkage is developed that takes into account both geometric errors and joint deflections induced by link masses and weight of the end-effectors. Experiments are conducted to evaluate the two pieces of work presented above. The proposed framework is adopted to create a distributed control system that implements calibration and error compensation for a large industrial robot having a parallelogram linkage. The control system is formed by hot-plugging the control applications of the robot and metrology used together. Experimental results show that the developed error model was able to improve the 3 positional accuracy of the loaded robot from several millimetres to less than one millimetre and reduce half of the time previously required to correct the errors by using only the metrology. The experiments also demonstrate the capability of sharing one metrology system to more than one robot.

AlₓGa₁₋ₓN (x>0.6) based Ultraviolet Light Emitting Diodes (UV LEDs) emit in the UV C range of 200 - 290 nm and suffer from low external quantum efficiencies (EQEs) of less than 3%. This low EQE is representative of a large number of non-radiative recombination events in the multiple quantum well (MQW) layers, which leads to high device temperatures due to self-heating at the device junction. Knowledge of the device temperature is essential to implement and evaluate appropriate thermal management techniques, in order to mitigate optical degradation and lifetime reduction due to thermal overstress. The micro-scale nature of these devices and the presence of large temperature gradients in the multilayered device structure merit the use of several indirect temperature measurement techniques to resolve device temperatures. This work will study UV LEDs with AlₓGa₁₋ₓN active layers, grown on sapphire or AlN growth substrates, and flip-chip mounted onto submounts and package configurations with different thermal properties. Thermal metrology results will be presented for devices with different electrode geometries (i.e., interdigitated and micropixel), for bulk and thinned growth substrates. The body of this work will present a comparative study of optical techniques such as Infrared (IR), micro-Raman and Electroluminescence (EL) spectroscopy for the thermal metrology of UV LEDs. The presence of horizontal and vertical temperature gradients within the device layers will be studied using micro-Raman spectroscopy, while the occurrence of thermal anomalies such as hotspots and shorting paths will be studied using IR spectroscopy. The Forward Voltage (Vf) method, an electrical junction temperature measurement technique, will also be investigated. The Vf method will be applied to the Thermal Resistance Analysis by Induced Transient (TRAIT) procedure, whereby electrical data at short time scales from an operational device will be used to discretize the junction-to- package thermal resistance pathway from the total junction- to-ambient heat path. The TRAIT procedure will be conducted on several LEDs, for comparison. The scope and applicability of each thermal metrology technique will be examined, and the merits and demerits of each technique will be exhibited.

This thesis presents the theoretical and experimental framework for the development of accurate on-wafer S-parameter and noise parameter measurements of silicon devices in the upper millimetre-wave frequency range between 70 GHz and 300 GHz. Novel integrated noise parameter test setups were developed for nanoscale MOSFETs and SiGe HBTs and validated up to 170 GHz. In the absence of accurate foundry models in this frequency range, the experimental findings of this thesis have been employed by other graduate students to design the first noise and input impedance matched W- and D-band low-noise amplifiers in nanoscale CMOS and SiGe BiCMOS technologies. The results of the D-band S-parameter characterization techniques and of the new Y-parameter based noise model have been used by STMicroelectronics to optimize the SiGe HBT structure for applications in the D-band. In the first half of the thesis, theoretical analysis indicates that, for current silicon devices, distributive effects in test structure parasitics will become significant only beyond 300 GHz. This conclusion is supported by experiments which compare the lumped-element based open-short and the transmission line based split-thru de-embedding techniques to the multiline thru-reflect-line (TRL) network analyzer calibration algorithm. Electromagnetic simulations and measurements up to 170 GHz demonstrate that, for microstrip transmission lines with metal ground plane placed above the silicon substrate, the line capacitance per unit length remains a weak function of frequency. Based on this observation, the multiline TRL algorithm has been modified to include a dummy short de-embedding structure. This allowed for the first time to perform single step calibration and de-embedding of silicon devices using on-silicon calibration standards. The usefulness of the proposed method was demonstrated on the extraction of the difficult-to-measure SiGe HBT and nanoscale MOSFET model parameters, including transcondutance delay, tau, gate resistance, source resistance, drain-source capacitance, and channel resistance, Ri. Building on the small-signal characterization technique developed in the first half, a new Y-parameter based noise model for SiGe HBTs, that includes the correlation between the base and collector shot noise currents, is proposed in the second half of the thesis along with a method to extract the noise transit time parameter. With this model, the high frequency noise parameters of a SiGe HBT can be calculated from the measured Y-parameters, without requiring any noise figure measurements. Finally, to validate the proposed noise model, the first on-wafer integrated noise parameter measurement systems were designed and measured in the W- and D-bands. The systems enable millimetre-wave noise parameter measurements with the multi-impedance method by integrating the impedance tuner and an entire millimetre-wave noise receiver on the same die as the device-under-test. Good agreement was obtained between the noise parameters calculated from the Y-parameter measurements and those obtained from direct noise figure measurements with the integrated systems. The results indicate that the minimum noise figure of state-of-the-art advanced SiGe HBTs remains below 5 dB throughout the D-band, making them suitable for a variety of commercial products in this frequency range.

This thesis presents the theoretical and experimental framework for the development of accurate on-wafer S-parameter and noise parameter measurements of silicon devices in the upper millimetre-wave frequency range between 70 GHz and 300 GHz. Novel integrated noise parameter test setups were developed for nanoscale MOSFETs and SiGe HBTs and validated up to 170 GHz. In the absence of accurate foundry models in this frequency range, the experimental findings of this thesis have been employed by other graduate students to design the first noise and input impedance matched W- and D-band low-noise amplifiers in nanoscale CMOS and SiGe BiCMOS technologies. The results of the D-band S-parameter characterization techniques and of the new Y-parameter based noise model have been used by STMicroelectronics to optimize the SiGe HBT structure for applications in the D-band. In the first half of the thesis, theoretical analysis indicates that, for current silicon devices, distributive effects in test structure parasitics will become significant only beyond 300 GHz. This conclusion is supported by experiments which compare the lumped-element based open-short and the transmission line based split-thru de-embedding techniques to the multiline thru-reflect-line (TRL) network analyzer calibration algorithm. Electromagnetic simulations and measurements up to 170 GHz demonstrate that, for microstrip transmission lines with metal ground plane placed above the silicon substrate, the line capacitance per unit length remains a weak function of frequency. Based on this observation, the multiline TRL algorithm has been modified to include a dummy short de-embedding structure. This allowed for the first time to perform single step calibration and de-embedding of silicon devices using on-silicon calibration standards. The usefulness of the proposed method was demonstrated on the extraction of the difficult-to-measure SiGe HBT and nanoscale MOSFET model parameters, including transcondutance delay, tau, gate resistance, source resistance, drain-source capacitance, and channel resistance, Ri. Building on the small-signal characterization technique developed in the first half, a new Y-parameter based noise model for SiGe HBTs, that includes the correlation between the base and collector shot noise currents, is proposed in the second half of the thesis along with a method to extract the noise transit time parameter. With this model, the high frequency noise parameters of a SiGe HBT can be calculated from the measured Y-parameters, without requiring any noise figure measurements. Finally, to validate the proposed noise model, the first on-wafer integrated noise parameter measurement systems were designed and measured in the W- and D-bands. The systems enable millimetre-wave noise parameter measurements with the multi-impedance method by integrating the impedance tuner and an entire millimetre-wave noise receiver on the same die as the device-under-test. Good agreement was obtained between the noise parameters calculated from the Y-parameter measurements and those obtained from direct noise figure measurements with the integrated systems. The results indicate that the minimum noise figure of state-of-the-art advanced SiGe HBTs remains below 5 dB throughout the D-band, making them suitable for a variety of commercial products in this frequency range.