The microstructure of Y5V-1206 capacitor has been studied using X-ray diffractometry (XRD), scanning electron microscope (SEM), and transmission electron microscope (TEM). Twinning occurs when a crystal undergoes a shear stress which produces a crystal structure which is a mirror image of itself. In BaTiO3, twinning occurs in (111) plane and the orientation relationships of it between two grains have been analyzed. We can define it for transformation matrices. We supply high-voltage, low-current pulses to capacitor for breakdown of it. We confer on reason for breakdown. We suspect the discrepancy is due to the change in the field distribution above and below Curie Temperature in core-shell structure. It differentiates dielectric constant (

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被動元件產業在面臨2000千禧年資訊產業與相關消費產品蓬勃發展下，因客戶之需求突增，造成全球大缺貨情況，尤以被動元件中MLCC(積層陶瓷電容)缺貨為甚，也因於此全球之被動元件(MLCC) 製造商展開積極擴產，而至2001年由於客戶重複下單與假性需求逐漸明朗化造成被動元件(MLCC)供過於求之現象，也造成後續之台灣被動元件(MLCC)製造商整併與全球被動元件(MLCC)商之版圖移動，時至今日，台灣從約10家被動元件(MLCC)供應商整併至今日之4家主要供應商，而韓系Semco 的崛起，與日商之競爭也帶動整體被動元件(MLCC)之終端價格逐步下滑。 本研究個案「被動元件(MLCC)在歐洲區市場策略行銷分析」主要是針對在現今終端消費3C產品競爭下，被動元件(MLCC)被迫走向削價競爭，尤其亞洲市場已是紅海市場，以A公司之生產規模無法與其他台灣及國際被動元件(MLCC)製造商比擬下，如何藉由其本身在原有特殊產品供應下搭配相對應之行銷策略，在歐洲區環伺強敵下，持續創造獲利。 所以擬以4C行銷策略架構為研究基礎，針對個案「被動元件(MLCC)在歐洲區市場策略行銷分析」所做的分析，從終端客戶與經銷商的上下游買賣交換過程中，如何透過外顯單位效益成本、資訊搜尋成本、道德危機成本，以及專屬陷入成本中找出影響交易的成本。 用4C的架構來分析客戶與經銷通路商之間的成本關係，在買賣交換過程中以「A公司」在投入歐洲區5年之銷售為例，希望建立此類中型被動元件(MLCC)製造商，如何在行銷策略上進行提升，利用更有系統的方式進行來分析，找出4C架構中關鍵成本，並發揮最大的效益，為A公司未來3~5年之行銷策略建議。

Multilayer ceramic capacitors (MLCCs) are typically manufactured as follows: First, stirring and mixing dielectric ceramic powders with a binder and a dispersion agent in a ball mill for several hours to prepare slurry having a desired viscosity. Next, a green sheet is prepared by a doctor blade method, wherein, the slurry is discharged onto a carrier film through a small orifice and the carrier film is pulled under a doctor blade or a slot die, which is set at a particular height to obtain a desired sheet thickness. The sheet is then dried to produce the green sheet. Then, a conductive paste is applied on a number of green sheets to form internal electrodes by screen-printing. The desired number of ceramic green sheets with internal electrodes are stacked and compressed to form a laminated body. The laminated body is then diced into a number of capacitor elements having a predetermined size. Thereafter the capacitor elements are through binder burnout and sintered then finally external electrodes are formed on opposite end portions of each of the capacitor elements to produce multiplayer ceramic capacitors. Once terminated, MLCC is typically electro-plated with a layer of nickel followed by a layer of tin in order to be surface-mountable. Surface mounting is soldering of components onto PCBs. The nickel layer is typically referred to as the barrier layer. Although nickel is solderable, it does not readily dissolve in molten solder as silver does. The end terminals when the capacitors are soldered to PCBs. Tin coatings serve to protect the nickel from oxidation and to make components readily solderable. Precious metal electrode (PME) system and solvent base are introduced in this report. Capacitors were fabricated from 22£gm thick tapes consisting of ceramic powders (X7R AD292U, Degussa Corporation and NP0 VLF-220, MRA Laboratories, Inc.) that involves a sequence of a large number of processing steps, with production losses associated with each step. Optimized and controlled processing parameters can get reliable yield.

As is known to all, Yageo plays a decisive role in passive component industry in the world. In 1991, Yageo¡¦s capital was only estimated NT$ 400 million. A series of acquisitions of not more than 10 years, Yageo¡¦s capital has reached NT$ 14 billion. It grows more than 30 times. Thereinto, the most famous and controversial issue was Yageo¡¦s ??650 million (Around NT$ 18.8 billion) acquisition of the passive component division of Philips in 2000. At that time, Walsin Technology quoted 8 billion. Why were the value evaluations of acquiring the passive component division of Philips on the 2 leading companies of passive components diametrically opposed? This study aims at exploring the effectiveness of this acquisition case at high price. In the early stages of Taiwan's passive component industry, Taiwan fell behind Japan, Europe and America in technology. In order to catch up with advanced foreign technology expeditiously, expand the market share, and become a global leading company from local Taiwan, acquisition and strategy alliance are very common method strategically. Nevertheless, through many literatures, we find that actually successful examples of acquisition are not many. Specially, Yageo¡¦s acquisition of the passive component division of Philips is that big beats small. Furthermore, transnational acquisition involves with different business philosophy, management system and corporate culture. Success of acquisition becomes more difficult. In terms of corporate managers, the most important responsibilities are to lead the company's growth, enhance shareholder value, bring prosperity to the community and provide more opportunities for employment and entrepreneurship. This case was studied from pre-acquisition in 1997 to post-acquisition in 2004 on each indicator for analysis and comparison to explore the gains and losses of whole acquisition. When enterprises are in the process of development, acquisition is absolutely one of the strategy options. However, how does acquisition strategy create the maximum value? The wisdom and decision of enterprisers will be strictly tested by market and investor. We hope it can provide usefulness for enterprisers in Taiwan to execute transnational acquisition by exploring this acquisition case.

Increased demand for smaller electronics is driving the electronic packaging industry to develop smaller, more efficient component level packages. Surface mounted components, such as flip chips, ball grid arrays (BGAs), and chip-scale packages (CSPs), are being developed for use in high-volume production. All of these technologies use solder bumps to attach the active silicon to the substrate, and traditional nondestructive methods such as machine vision, acoustic microscopy or x-ray inspection cannot easily find solder bump defects. Therefore, a system, consisting of an Nd:YAG laser that delivers pulses of infrared energy to the surface of the chip, a laser interferometer to record surface vibrations, and a high-speed data acquisition system to record the signals, was developed. The pulsed laser generates ultrasound on the chips surface, exciting the whole chip into a vibration motion, and the interferometer measures the vibration displacement of the chips surface at several points. Changes in the quality of the device or its attachment to the board produce changes in the free vibration response. Characterization of the differences between good devices and devices with defects, both in time domain and frequency domain, is performed using signal analysis. The system has inspected flip chips and chip scale packages for missing and misaligned solder balls, but to characterize the resolution of the system for open solder joints, a study of the vibration modes excited by the laser source in a flip chip was performed on specimens with intentionally created defects. Experimental measurements of excited modes were compared with a modal analysis model created in ANSYS, and defects were detected as small changes in the mode shape on the surface of the chips. Current inspection methods have also been inadequate for inspecting multi-layer ceramic capacitors (MLCCs). Flex cracks, caused by manufacturing processes, often cause the capacitors to fail in-service. Samples that have been cracked intentionally were compared with reference samples to determine the feasibility of using this technique to monitor the condition of MLCCs on an assembly line. Currently, there is no on-line inspection method for controlling this problem, but this technique was able to differentiate between good and damaged capacitors.

It is particularly intriguing in the role of the solid-state dopants, which are not only responsible for the semiconductivity, but also the dielectric properties of BaTiO3 ceramics, e.g. CaO, MgO, Y2O3, CoO and MnO2 for EIA-X7R characteristics. We have chosen to investigate three important processing parameters, oxygen partial pressure (pO2) for sintering, and two alkali-earth-metal oxides, i.e. CaO and MgO for solid-state additives in order to study how microstructure and dielectric properties are determined by them. They are used in MLCC industry for the effect in attaining X7R characteristics and protecting against or improving for dc degradation. Apart from establishing the temperature-dependent dielectric properties, i.e. temperature-coefficient of capacitance (TCC), for both qualitative and quantitative analysis, crystalline phases in sintered ceramics of tetragonal mixed with cubic, orthorhombic and rhombohedral phases are studied using XRD and Raman spectroscopy. For microscopic studies, SEM and TEM techniques, e.g. CBED and LACBED, combined with EDS are used to study phases both in core-shell. We will examine and confirm the fidelity of whether core-shell grains are induced by chemical inhomogeneity, and more importantly, if the diffuse phase transition is caused by such microstructure with direct observations, as previous studies in perovskite-related ceramics, and crystalline phase determination for these grains. It is also an objective that we investigate why and how, by what mechanism, the chemically similar alkali-earth metal oxides should impart completely different (and indeed opposite) effect in protecting against dc degradation. Keywords: MLCC, dc degradation, DPT, Raman spectroscopy, electron microscopy.

Les condensateurs multicouches en céramique (Multilayer Ceramic Capacitors, MLCCs) sont des composants passifs clés de l'électronique moderne. Les MLCCs sont constitués d'une alternance d'électrodes métalliques et de couches diélectriques de céramique. Les puces ultraminces sont composées de mélanges de couches micrométriques métalliques et céramiques et d'additifs de céramique de taille nano. Un certain nombre de défauts tels que des fissures, des délaminations des couches et des discontinuités au sein de l'électrode, peuvent survenir dans la fabrication de ces MLCCs ultraminces. Un dispositif expérimental à rayons X (TXM, Transmission X-ray Microscope) avec une résolution spatiale de 30 nm au synchrotron APS (Advanced Photon Source, USA) a été utilisé pour caractériser un volume cylindrique représentatif de Ø 20 µm × 20 µm extrait d'une puce 0603 (1,6 mm × 0,8 mm) au nickel (Ni) + titanate de baryum (BaTiO3, ou BT) avant et après frittage sous argon hydrogéné (2%). La tomographie 3D de la microstructure montre que les discontinuités de l'électrode finale sont liées à des hétérogénéités initiales dans les couches d'électrodes. La radiographie in-situ aux rayons X pendant le frittage (vitesse de chauffage de 10 °C/mn, température de maintien à 1200 °C pendant 1 heure, puis refroidissement à 15 oC/min) d’un volume représentatif d'électrode au palladium (+ baryum-néodyme-titanate) confirme bien que les discontinuités dans l'électrode proviennent de l'hétérogénéité initiale de la poudre, qui est lié à la nature du compactage d'un matériau particulaire. La discontinuité se produit à l'étape précoce du cycle de frittage. A ce stade, l'électrode métallique commence à fritter tandis que le matériau diélectrique peut être considéré comme un substrat inerte qui contraint le frittage de l’électrode.Des études corrélatives utilisant un FIB-SEM (Focused Ion Beam Scanning Electron-microscopie) en tomographie à haute résolution (5 × 5 × 5 nm3) ont été effectuées sur des échantillons MLCC à vert et frittés. Elles confirment que la résolution de la nanotomographie X est suffisante pour étudier l’évolution des hétérogénéités. Cependant la tomographie par FIB permet à la nanotomographie X d’être réinterprétée avec plus de précision. D'autre part, le FIB fournit les paramètres des particules pour les simulations DEM.La méthode des éléments discrets (DEM) a été utilisée pour simuler la microstructure du système multicouche lors du frittage. Tout d'abord, le frittage de la matrice de nickel avec inclusions BT a été simulé en utilisant le code dp3D. Nous avons pu montrer que la vitesse de densification de la matrice diminue avec l'augmentation la fraction volumique d'inclusions et avec la diminution de la taille des inclusions. Pour une fraction volumique donnée, et une taille d’inclusions donnée, une meilleure dispersion des inclusions conduit à un retard plus marqué de la densification du frittage de la matrice de nickel.Le co-frittage de multicouches de BT/Ni/BT a été simulé en tenant compte des informations collectées à partir de la tomographie FIB-SEM à résolution élevée (taille des particules, distribution de taille, hétérogénéités, et pores). On constate que les discontinuités d'électrodes proviennent des hétérogénéités initiales dans le comprimé à vert et se forment au début de frittage sous contrainte. Ces résultats de simulation sont en bonne correspondance avec les observations expérimentales. Une étude paramétrique indique que les discontinuités d'électrodes peuvent être minimisées par l'homogénéisation de la compacité, par l’augmentation de l'épaisseur des électrodes et par l’utilisation d’un chauffage rapide.A partir des résultats expérimentaux et des simulations DEM, une conclusion générale peut être avancée: la discontinuité finale provient de l'hétérogénéité initiale dans les couches d'électrodes et survient à un stade précoce de frittage lorsque les couches diélectriques contraignent les couches d'électrodes / Multi-Layer Ceramic Capacitors (MLCCs) are key passive components in modern electronics. MLCCs consist of alternating metal electrode and ceramic dielectrics layers. In ultrathin MLCC chips, the micrometric layers are composed of submicrometric metal and ceramic powders and nano sized ceramic additives. A number of defects such as cracks, delamination of layers and electrode discontinuity and homogeneity, may arise in the processing of these ultrathin MLCCs. Synchrotron (Advanced Photon Source, Argonne National Laboratory, IL, USA) X-ray based Transmission X-ray Microscope (TXM) with spatial resolution of 30 nm was used to characterize a representative cylindrical volume of Ø 20 µm × 20 µm extracted from a 0603 (1.6 mm×0.8 mm) case size Nickel (Ni)-electrode Barium Titanate (BaTiO3, or BT)-based MLCC before and after sintering under 2H2%+Ar atmosphere. 3D tomographic microstructure imaging shows that the final electrode discontinuity is linked to the initial heterogeneity in the electrode layers. In situ X-ray radiography of sintering (heating ramp of 10 oC, holding at 1200 oC for 1 hour, cooling ramp -15 oC) of a Palladium (Pd) electrode BNT (Barium-neodymium-titanate) based MLCC representative volume was also carried out. It confirmed that discontinuities in the electrode originate from the initial heterogeneities, which are linked to the very particulate nature of the powder material. The discontinuity occurs at the early stage of the sintering cycle. At this stage, the electrode starts to sinter while the dielectric material may be considered as a constraining substrate. Correlative studies using Focused Ion Beam - Scanning Electron Microscope (FIB - SEM) tomography were conducted on green and sintered MLCC samples at high resolution (5 × 5 × 5 nm3). FIB images confirmed that the resolution of the X-ray nCT is sufficient to deal with these heterogeneity evolutions. Still, FIB tomography allows the X-ray nCT to be re-interpreted more accurately. Also, it provides detailed particulate parameters for the DEM simulations.The DEM was used to simulate the microstructure of a multilayer system during sintering. First, the sintering of Nickel matrix with BT inclusions was simulated using the dp3D codes. It is found that the densification rate of the matrix decreases with increasing volume fraction of inclusions and with decreasing size of inclusions. For a given volume fraction and size of inclusions, a better dispersion of the inclusions results in a stronger retardation of the densification kinetics of the nickel matrix.Co-sintering of BT/Ni/BT multilayers was simulated with DEM by taking into account the particulate nature collected from the high resolution FIB nanotomography (FIB-nT) data, such as particle size, size distribution, heterogeneities, pores, and geometry. It is found that the electrode discontinuities originate from the initial heterogeneities in the green compact and form at the early stage of sintering under constraint, in good correspondence to the experimental observations. Parametric studies suggest that electrode discontinuities can be minimized by homogenizing the packing density and thickness of the electrodes and using a fast heating rate.Based on both experimental and DEM simulation results, a general conclusion is reached: the final discontinuity originates from the initial heterogeneity in the electrode layers and occurs at the early stage of sintering when the dielectric layers constrain the electrode layers.

O CLT (Cross Laminated Timber) ou MLCC (Madeira Laminada Colada Cruzada) é um painel compósito estrutural formado por lamelas de madeira unidas com adesivos próprios para uso estrutural, com as camadas montadas de maneira perpendicular à camada anterior. É utilizado como elemento estrutural principal em edificações térreas e multipavimentos por ter características estruturais semelhantes ao concreto armado. Os objetivos gerais deste trabalho foram desenvolver uma metodologia de ensaios para a caracterização estrutural de painéis de MLCC visando a contribuição para a normatização do produto no Brasil e o estudo da rigidez de um painel modelo. Foi fabricado um painel com dimensões estruturais utilizando madeira de Pinus elliotti e adesivo estrutural à base de melamina-ureia formaldeído. Os ensaios mecânicos realizados foram adequados para caracterização estrutural de painéis de MLCC e podem compor uma futura normatização. Os valores de rigidez para o painel avaliado apresentaram módulo de elasticidade abaixo dos especificados pela norma americana ANSI/APA PGR 320 e pela especificação técnica europeia ETA06/0138, porém os módulos de rigidez do rolling shear e de compressão obtiveram valores similares aos recomendados. / The CLT (Cross Laminated Timber) is a structural composite panel formed by wooden slats together with own stickers for structural use, with the layers mounted perpendicular to the previous layer. It is used as the main structural element in single-story buildings with one or more floors for having structural features similar to reinforced concrete. The aims of this study were to develop a test methodology for structural characterization of MLCC panels aimed at contributing to the standardization of the product in Brazil and the study of rigidity of a panel model. A panel with structural dimensions using wood of Pinus elliotti and structural adhesive melamine urea formaldehyde base was manufactured. The mechanical tests were suitable for structural characterization of MLCC panels and can compose a future standardization. The stiffness values reported for the modulus of elasticity panel presented below specified by the US standard ANSI/APA PGR 320 and the European Technical Specification ETA06/0138, but the stiffness of the rolling shear and compression modules obtained similar to recommended values.

O CLT (Cross Laminated Timber) ou MLCC (Madeira Laminada Colada Cruzada) é um painel compósito estrutural formado por lamelas de madeira unidas com adesivos próprios para uso estrutural, com as camadas montadas de maneira perpendicular à camada anterior. É utilizado como elemento estrutural principal em edificações térreas e multipavimentos por ter características estruturais semelhantes ao concreto armado. Os objetivos gerais deste trabalho foram desenvolver uma metodologia de ensaios para a caracterização estrutural de painéis de MLCC visando a contribuição para a normatização do produto no Brasil e o estudo da rigidez de um painel modelo. Foi fabricado um painel com dimensões estruturais utilizando madeira de Pinus elliotti e adesivo estrutural à base de melamina-ureia formaldeído. Os ensaios mecânicos realizados foram adequados para caracterização estrutural de painéis de MLCC e podem compor uma futura normatização. Os valores de rigidez para o painel avaliado apresentaram módulo de elasticidade abaixo dos especificados pela norma americana ANSI/APA PGR 320 e pela especificação técnica europeia ETA06/0138, porém os módulos de rigidez do rolling shear e de compressão obtiveram valores similares aos recomendados. / The CLT (Cross Laminated Timber) is a structural composite panel formed by wooden slats together with own stickers for structural use, with the layers mounted perpendicular to the previous layer. It is used as the main structural element in single-story buildings with one or more floors for having structural features similar to reinforced concrete. The aims of this study were to develop a test methodology for structural characterization of MLCC panels aimed at contributing to the standardization of the product in Brazil and the study of rigidity of a panel model. A panel with structural dimensions using wood of Pinus elliotti and structural adhesive melamine urea formaldehyde base was manufactured. The mechanical tests were suitable for structural characterization of MLCC panels and can compose a future standardization. The stiffness values reported for the modulus of elasticity panel presented below specified by the US standard ANSI/APA PGR 320 and the European Technical Specification ETA06/0138, but the stiffness of the rolling shear and compression modules obtained similar to recommended values.