- About
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The Global ETD Search service is a free service for researchers
to find electronic theses and dissertations. This service is
provided by the
Networked Digital Library of Theses and Dissertations.
Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.
Search results
Showing 31 to 40 of 232 (0.039 seconds)Spelling suggestions: "subject:"microelectronic"" "subject:"microelectronics""
| 31 |
Design and fabrication of a flip-chip-on-chip multi-chip module with 3D packaging structure and through-silicon-via for underfill dispensing /Tsui, Yat Kit. January 2004 (has links)
Thesis (M. Phil.)--Hong Kong University of Science and Technology, 2004. / Includes bibliographical references (leaves 116-127). Also available in electronic version. Access restricted to campus users.
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| 32 |
Design for reliability in microoptelectromechanical systems (MOEMS)Fasoro, Abiodun Adekunle. January 2008 (has links)
Thesis (Ph.D.) -- University of Texas at Arlington, 2008.
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| 33 |
Fundamental study of underfill void formation in flip chip assemblyLee, Sangil. January 2009 (has links)
Thesis (Ph.D)--Mechanical Engineering, Georgia Institute of Technology, 2010. / Committee Chair: Baldwin, Daniel; Committee Member: Colton, Jonathan; Committee Member: Ghiaasiaan, Mostafa; Committee Member: Moon, Jack; Committee Member: Tummala, Rao. Part of the SMARTech Electronic Thesis and Dissertation Collection.
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| 34 |
Underfill adhesion characteristics, residual stresses and analysis of thermal stresses in flip chip packages /Sham, Man-Lung. January 2003 (has links)
Thesis (Ph. D.)--Hong Kong University of Science and Technology, 2003. / Includes bibliographical references. Also available in electronic version. Access restricted to campus users.
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| 35 |
RF/microwave integrated passives for system on package module developmentDavis, Mekita F. 08 1900 (has links)
No description available.
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| 36 |
Design and implementation of high-Q passive devices for wireless applications using System-On-Package (SOP) based organic technologiesDalmia, Sidharth 12 1900 (has links)
No description available.
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| 37 |
Thermomechanical stress analysis of flip chip packagesLe Gall, Carole A. 08 1900 (has links)
No description available.
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| 38 |
The effect of moisture on the interfacial fracture toughness of packaging interfacesFerguson, Timothy Patrick 12 1900 (has links)
No description available.
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| 39 |
An integrated process modeling methodology and module for sequential multilayered high-density substrate fabrication for microelectronic packagesDunne, Rajiv Carl 12 1900 (has links)
No description available.
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| 40 |
Helix-type compliant off-chip interconnect for microelectronic packagingZhu, Qi 08 1900 (has links)
No description available.
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