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  • About
  • The Global ETD Search service is a free service for researchers to find electronic theses and dissertations. This service is provided by the Networked Digital Library of Theses and Dissertations.
    Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.
51

Computational and experimental investigations of laser drilling and welding for microelectronic packaging

Han, Wei. January 2004 (has links)
Thesis (Ph. D.)--Worcester Polytechnic Institute. / Keywords: Optoelectronic holography; Microwelding; Microelectronic packaging; Microdrilling; Laser micromachining; Computational modeling. Includes bibliographical references (p. 204-212).
52

Study and characterization of plastic encapsulated packages for MEMS

Deshpande, Anjali W. January 2005 (has links)
Thesis (M.S.)--Worcester Polytechnic Institute. / Keywords: finite difference methods; OEH methodology; packaging; plastic encapsulation; Fick's second law of diffusion; MEMS. Includes bibliographical references (p. 144-161).
53

Finite element analysis of three-dimensional corner stress singularities and its application in microelectronics packaging /

Xu, Anqing, January 2002 (has links)
Thesis (Ph. D.)--Lehigh University, 2002. / Includes bibliographica references and vita.
54

Design and fabrication of free-standing structures as off-chip interconnects for microsystems packaging

Kacker, Karan. January 2008 (has links)
Thesis (Ph.D)--Mechanical Engineering, Georgia Institute of Technology, 2009. / Committee Chair: Dr. Suresh K. Sitaraman; Committee Member: Dr. F. Levent Degertekin; Committee Member: Dr. Ioannis Papapolymerou; Committee Member: Dr. Madhavan Swaminathan; Committee Member: Dr. Nazanin Bassiri-Gharb. Part of the SMARTech Electronic Thesis and Dissertation Collection.
55

Thermo-mechanical reliability of ultra-thin low-loss system-on-package substrates

Krishnan, Ganesh. January 2008 (has links)
Thesis (M. S.)--Materials Science and Engineering, Georgia Institute of Technology, 2009. / Committee Chair: Tummala, Rao; Committee Member: Pucha, Raghuram V.; Committee Member: Wong, C.P. Part of the SMARTech Electronic Thesis and Dissertation Collection.
56

Quality inspection and reliability study of solder bumps in packaged electronic devices [electronic resource] : using laser ultrasound and finite element methods

Yang, Jin. January 2008 (has links)
Thesis (Ph.D)--Mechanical Engineering, Georgia Institute of Technology, 2009. / Committee Chair: Ume, I. Charles; Committee Member: Danyluk, Steven; Committee Member: Goyal, Deepak; Committee Member: Lu, Jye-Chyi(JC); Committee Member: Michaels, Thomas; Committee Member: Sitaraman, Suresh. Part of the SMARTech Electronic Thesis and Dissertation Collection.
57

Advances in electronic packaging technologies by ultra-small microvias, super-fine interconnections and low loss polymer dielectrics

Sundaram, Venkatesh. January 2009 (has links)
Thesis (M. S.)--Materials Science and Engineering, Georgia Institute of Technology, 2009. / Committee Chair: Tummala, Rao; Committee Member: Iyer, Mahadevan; Committee Member: Saxena, Ashok; Committee Member: Swaminathan, Madhavan; Committee Member: Wong, Chingping.
58

System based material design for wafer level underfills :

Prabhakumar, Ananth. January 2004 (has links)
Thesis (Ph. D.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Systems Science Dept., 2004 / Only abstract available. "At the request of the author, this graduate work is not available for purchase." Includes bibliographical references.
59

Μελέτη θορύβου διατάξεων μικροηλεκτρονικών αισθητήρων

Κόκκοτας, Γιώργος 11 January 2011 (has links)
Το αντικείμενο της παρούσας διπλωματικής εργασίας αφορά την μελέτη φαινομένων θορύβου σε ηλεκτρονικές διατάξεις ανίχνευσης οι οποίες αποτελούν προγενέστερο στάδιο της αποστολής του ψηφιακού σήματος σε βιοαισθητήρες. Στόχος είναι η μοντελοποίηση και βελτιστοποίηση κυκλωματικών τοπολογιών ως προς την απόκριση συνεχούς και την θορυβική τους απόκριση. / The purpose of this thesis concerns the study of noise phenomena into electronics detection systems which are an earlier step of the forwarding of the digital signal in biosensors. Our aim is the modeling and the optimization of those circuit topologies from the side of transient response-analysis and noise response.
60

MOS Capacitor Deep Trench Isolation (CDTI) for CMOS Image Sensors / Tranchée d'isolement profonde de type capacité MOS verticale pour les capteurs d'images CMOS

Ahmed, Nayera 08 April 2015 (has links)
. / The development of high-resolution image sensors with smaller pixel sizes is facing critical issues, such as optical and electrical crosstalk, dark current and dynamic range. As part of this thesis, we addressed this issue by proposing the integration of MOS capacitor deep trench isolation (CDTI). Our studies focus on the validation of the proposal with the aim of improving performances compared to the state of the art. First, we modeled interface states Si/SiO2 and the charge in the oxide. By TCAD simulations, using our model, we were able to evaluate the main characteristics of a pixel. We have validated this approach by comparison between simulations and measurements on a 1.4μm DTI pixel. Then, we developed manufacturing processes for integrating CDTI and defined the associated key parameters. With TCAD simulations of process type, we could achieve the desired performances while keeping a short development cycle and cost. Finally, we have designed, manufactured and tested a 1.4μm CDTI pixel ; we got a very low dark current: ~ 1 aA/pixel at 60°C, which is 6 times less than the DTI pixel, and doubled saturation charge up to 12000e-. Other performances are comparable between the two types of pixels. We have demonstrated the validity of the proposed CDTI solution CDTI

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