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  • About
  • The Global ETD Search service is a free service for researchers to find electronic theses and dissertations. This service is provided by the Networked Digital Library of Theses and Dissertations.
    Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.
11

Syntactic priming and children's production and representation of the passive

Messenger, Katherine January 2009 (has links)
This thesis investigates children’s mental representation of syntactic structure and how their acquisition and production of syntax is affected by lexical and semantic factors, focusing on three- and four-year-old children. It focuses on a construction that has been a frequent subject of language acquisition research: the passive. It is often claimed that English-speaking children acquire the passive relatively late in language development (e.g. Horgan, 1978): previous studies have typically found unreliable comprehension and infrequent production of passives by children younger than five (e.g. Fraser et al., 1963). However, there is some evidence from studies providing an appropriate pragmatic context for passives (e.g. Crain et al., 1987) and studies which increase children’s exposure to passives (e.g. Whitehurst et al., 1974) to suggest that children can produce this structure at a younger age. Converging evidence comes from studies of syntactic priming, or the tendency to repeat syntactic structure (e.g. Bencini & Valian, 2008). Syntactic priming effects are potentially informative about the nature of syntactic representation, as they are assumed to reflect the repeated use of the same syntactic representation across successive utterances. With respect to language acquisition, syntactic priming effects can be informative about the extent to which children have acquired an abstract representation of a structure. Specifically, if children have a syntactic representation of the passive, then it should be possible to prime their production of passives, such that they should be more likely to produce passives after hearing passives than after hearing actives. Furthermore, by examining the conditions under which such priming occurs, it is possible to draw inferences about the nature of their passive representation. This thesis presents seven experiments, six using a syntactic priming paradigm, to examine children’s knowledge of passives. Experiment 1 establishes a syntactic priming effect for actives and passives in three- and four-year-old children, and shows that priming occurs for both structures within an experimental session, using a withinparticipants design. Experiments 2, 3 and 4 examine whether young children’s acquisition of the passive is semantically constrained. Experiments 2 and 3 show that children can be primed to produce passive responses by actional and non-actional passive primes. Experiment 4, a picture-sentence matching task, replicates the results of other studies, however, showing that children find subject-experiencer non-actional verb passives more difficult to understand than actional verb passives; this mis-match between the results from the different tasks suggests that some effects of verb-type may be task-related. Experiments 5 and 6 examine whether the observed priming effect could be a lexically-driven effect that is dependent on the repetition of function words (the preposition by or the passive auxiliary). They show that this explanation can be ruled out: children are more likely to produce passives following both passive primes that do not express the agent using a by-phrase and passive primes involving a different auxiliary verb. Experiment 7 examines the later development of passive structures by testing passive production in six- and nine-year-old children. It finds evidence that at six, they still have difficulties with the construction, however by nine, children have an adult-like representation of the passive. I conclude that by four, children have begun to develop a syntactic representation for the passive which is already common to a range of different possible forms(short, full, get and be), and which is not restricted to particular semantic classes of verb. However, these results also suggest that children do not fully master the passive construction before six: young children make morphological errors and errors mapping thematic roles to syntactic positions, even following passive primes. Hence children may acquire the purely syntactic aspects of the passive, leading to a syntactic priming effect, before they acquire other aspects of this structure, hence the children’s occasional errors producing passives.
12

Translating from Practitioners to Patients : Adaption for a new type of readership

Lundberg, Turid January 2013 (has links)
The aim of this paper is to analyse the ways in which a Swedish translation of an English text intended as a manual for health practitioners needs to be adapted in order to function as an informative text aimed at patients, their families and other laymen interested in the subject. Focus lies on adaption of terminology, style, and target reader perspective. For this paper, selected parts of an English source text were translated into Swedish, and different adaptions prompted by the change in genre, intended target reader and purpose of the text were noticed and subsequently analysed. In the analysis, it became clear that translation of terminology can be treated through addition, omission or generalization where subject specific terms are not relevant for the intended readers. Under the subject of style, formality level defined through the usage of nominalizations and passives was analysed, and here, modulation and transposition proved useful for adapting the formality level to better fit the purpose of the text. Under the category of target reader perspective, omission, generalization and modulation of different kinds were translation strategies used to turn the focus from the intended ST reader to the intended TT reader. Defining or re-defining the subject of different actions was also necessary to shift the perspective from one intended group of readers to another. Finally, the analysis showed that different kinds of adaption may be purposeful in different situations.
13

Fabrication and Reliability Assessment of Embedded Passives in Organic Substrate

Lee, Kang 07 October 2005 (has links)
In a typical printed circuit board assembly, over 70 percent of the electronic components are passives such as resistors, inductors, and capacitors, and these passives could take up to 50 percent of the entire printed circuit board area. By embedding the passive components within the substrate instead of being mounted on the surface, the embedded passives could reduce the system real estate, eliminate the need for surface-mounted discrete components, eliminate lead based interconnects, enhance electrical performance and reliability, and potentially reduce the overall cost. Even with these advantages, embedded passive technology, especially for organic substrates, is at an early stage of development, and thus a comprehensive experimental and theoretical modeling study is needed to understand the fabrication and reliability of embedded passives before they can be widely used. This thesis aims to fabricate embedded passives in a multilayered organic substrate, perform extensive electrical and mechanical reliability tests, and develop physics-based models to predict the thermo-mechanical reliability of embedded capacitors. Embedded capacitors and resistors with different geometric shapes, planar dimensions, and thus different electrical characteristics have been fabricated on two different test vehicles. Capacitors are made with polymer/ceramic nanocomposite materials and have a capacitance in the range of 50 pF to 1.5 nF. Resistors are carbon ink based Polymer Thick Film (PTF) and NiCrAlSi and have a resistance in the range of 25 to 400 k. High frequency measurements have been done using Vector Network Analyzer (VNA) with 2 port signal-ground (S-G) probes. Accelerated thermal cycling (-55 to 125oC) and constant temperature and humidity tests (85oC/85RH) based on JEDEC and MIL standards have been performed. Furthermore, physics-based numerical models have been developed and validated using the experimental data. By focusing on the design and fabrication as well as the experimental and theoretical reliability assessments, this thesis aims to contribute to the overall development of embedded passive technology for Digital and Radio Frequency (RF) applications.
14

Estimation de l'humidité du sol à partir de données radiométriques en bande-L: préparation de la mission SMOS

Escorihuela, Maria Jose 21 December 2005 (has links) (PDF)
Les travaux de cette thèse s'inscrivent dans le cadre de la préparation de la mission SMOS (Soil Moisture and Ocean Salinity). Sur les terres émergées, le satellite SMOS fournira une cartographie globale de l'humidité du sol à partir de données radiométriques en bande-L (1.4 GHz). Le principe physique repose sur la sensibilité de la bande-L au contenu en eau de la surface. Le couvert végétal contribue à l'émission en fonction de son contenu en eau, et ses effets doivent être corrigés pour estimer l'humidité du sol. Le satellite SMOS obtiendra des mesures à deux polarisations (horizontale et verticale) et à multiples angles d'incidence. Ce système surdéfini permettera l'inversion de plusieurs paramètres, notamment l'humidité du sol et l'opacité de la végétation. L'objectif de cette thèse est de tester et d'améliorer si possible les modèles micro-ondes pour les scènes naturelles, en tenant compte les particularités de la configuration SMOS, notamment la diversité d'angles d'incidence. La première partie est consacrée à l'émission d'un sol nu. Dans un premier temps, deux approches (télédétection et capteurs in situ pour estimer l'humidité du sol ont été comparées. Dans un deuxième temps, la signature angulaire et polarimétrique de l'émission d'un sol nu rugueux est étudiée, un modèle semi-empirique est développé pour prendre en compte des effets de la rugosité aux différents angles et polarisations. La seconde partie est consacrée à l'émission d'un couvert végétal. L'influence de la rosée et les variations journalières de teneur en eau de la végétation sur l'émission ont été analysées.
15

Modeling, design, fabrication and demonstration of 3D IPAC glass power modules

Gandhi, Saumya 21 September 2015 (has links)
The advent of smart and wearable systems along with their Internet of Things (IoT) applications are driving unparalleled product miniaturization and multifunctional integration with computing, wireless communications, wireless healthcare, security, banking, entertainment, and navigation and others. This evolution is primarily enabled by the integration of multiple technologies such as RF, analog, digital, MEMS, sensors and optics in the same system. Integration of these heterogeneous technologies creates a new need for multiple power supply rails to provide device-specific voltage and current levels. Hence, multiple power converters, each requiring several passive components, are used to create stable power-supplies. However, state-of-art power supplies employ SMD passives that are relatively large, forcing these modules to be placed on the board far from the active IC. This leads to significantly sub-par frequency performance and poses a challenge for ultra-miniaturized and reliable power supplies. Hence, novel packaging technologies that can improve miniaturization, electrical performance and reliability at a relatively low-cost are required to address these challenges. Georgia Tech-PRC proposes 3D integration of passives and actives (3D IPAC) as doubleside thin components on ultra-thin glass substrates with through-package-vias (TPVs) to meet these requirements. This thesis focuses on a comprehensive methodology to demonstrate a 3D IPAC power module, starting with modeling, design, fabrication and characterization to validate 3D integrated ultra-thin inductors and capacitors in ultra-thin substrates. Another key focus of this thesis is to advance building block technologies such as thinfilm inductors and capacitors to achieve the target properties for 3D IPAC integration. As a first building block technology, advanced capacitor technologies were explored with high-k thinfilm barium strontium titanate dielectrics and lanthanum nickel oxide electrodes as an alternative to Cu, Ni and Pt electrodes for improved performance and cost. The BST capacitors with LNO electrodes resulted in a capacitance density of 20-30 nF/cm2 with leakage as low as nA/nF up to 3 V. A glass-compatible process was developed with crystallization temperatures less than 650 C. These capacitors with thinfilm electrodes and dielectrics can be integrated into ultra-thin interposers and packages. This can help improve the capacitor performance up to the GHz range. As a next build block, Si-nanowires were studied as high surface area electrodes for high-density capacitors. Analytical modeling was performed to understand the length of the nanowires based on the catalyst size. This modeling study was then extended to understand the cut-off frequency of the capacitors based on the RC time constant. The wires were fabricated using both chemical vapor deposition (CVD) and wet-etch processes. However, it was noticed that the wet-etch process provided more control on the geometry, density and orientation of the nanowires. Si-oxide was thermally grown on the surface of the wires. A capacitance density of 200 nF/mm2 was achieved. It was noticed that the cut-off frequency of such capacitors was limited to the lower kHz range. However, the operating frequency can be improved by simply using a highly conductive Si-substrate. The second part of the thesis focuses on inductor and capacitor integration on ultra-thin glass substrates for high-frequency power modules using the 3D IPAC approach. Analytical models were used to calculate the required passive component values based on the target frequency, ripple currents and voltages of the power module. Next, a SPICE model was used to optimize the value of the required passives based on the output parasitics. The L and C structures were then modeled using 2.5D method of moments (MOM) approach. The modeling results showed 7-8 X improvement in Q-factor when the structures were fabricated using the 3D IPAC approach relative to those fabricated on the same side of the substrate. A fabrication process flow was designed based on through-via and doubleside metallization with semi-additive patterning (SAP). The components were fabricated as thinfilms on either sides of the substrate and interconnected with through-vias. The LC network was characterized using a two-port vector network analyzer. The results showed low-pass filter response, which matched the design targets of cut-off frequencies upto 100 MHz. This study, therefore, demonstrates advanced thinfilm component technologies for ultra-high frequency power-supply. It also presents, for the first time, a 3D integrated passives and actives (3D IPAC) approach with integrated L and C for power modules.
16

Passive be damned: The construction that wouldn't be beaten

Allan, Stu January 2009 (has links)
This thesis brings together two different lines of research, the nature of passive voice, the nature of readability. Commonly, languages have a range of tools for detransitivisation, topicalisation, and impersonalisation, of which passivisation is one (Givón, 1981). Passives have important roles in our language, and prescribing against their use lacks a full understanding of these roles. Much of the concern around passives from writers, editors, and teachers is no more than folklore that has not clearly analysed various writing and reading problems. Many awkward sentences are not awkward because they use passives but because they are wordy, clumsy, or pretentious. Most criticisms have little basis in linguistic theory, and rarely is there more than passing mention of the important role that passives play in communication. Some uses of passives are inappropriate, being vague, ambiguous, or even deceitful. These inappropriate uses of passive voice give the construction a bad name. They have become ammunition for prescriptive grammarians to fire at all uses of passives, often with weak analysis and minimal reference to linguistic theory. ‘Avoid passives’ has become a mantra. I tentatively suggest that there is unlikely to be a cost to processing passives. Given the speed at which the brain processes clauses, any differences in readability (if they exist) must be miniscule. Consequently, I suggest that any differences are unimportant relative to the benefits that appropriately used passives bring to readability. Furthermore, appropriately used passives may actually improve readability, especially when there is greater interest in the passive subject than the active subject, and when the passive serves to connect clauses or sentences.
17

Entwurf miniaturisierter Antennengruppen

Weber, Jörn January 2008 (has links)
Zugl.: Ilmenau, Techn. Univ., Diss., 2008
18

Generalized Frequency Plane Model of Integrated Electromagnetic Power Passives

Zhao, Lingyin 08 December 2004 (has links)
The challenge to put power electronics on the same cost reduction spiral as integrated signal electronics has yet to be met. In the ongoing work for achieving complete power electronic converter integration, it has proven to be essential to develop a technology for integration of electromagnetic power passives. This integration will enable the incorporation of resonant circuits, transformers, EMI filters and the like into the integrated power electronics modules. These integrated electromagnetic power passives have been realized in terms of distributed structures, utilizing magnetic layers, conductive layers and dielectric layers. Because of the compact structures and the special implementation techniques of these integrated modules, the high frequency parasitic resonance are normally significant and may have negative impact on the performance and EMI characteristics. However, the existing modeling technique can only predict the fundamental resonant frequency and showed neither the causes of the high frequency resonance nor how to calculate those accurately. In this dissertation, comprehensive research work towards higher order electromagnetic modeling of integrated passive components is presented. Firstly, an L-C cell is identified as the basic building block of integrated passives such as an integrated series resonator. As an essential mistake in the structure evolution process of the original resonant transmission line primitive, the well-known conventional transmission line equivalent circuit as well as the equations are not applicable for the unbalanced current in an integrated passive module. For this particular application, a generalized transmission structure theory that applies to both balanced and unbalanced current has to be developed. The impedances of a generalized transmission structure with various loads and interconnections have been studied. An open-circuited load and a short-circuited load lead to series resonance and parallel resonance, respectively. The equations are substantiated with experimental results. Some preliminary study indicates the advantages of this unbalanced current passives integration technique. Since the existing integrated passive components are no other than some combination of this generalized transmission line primitive, the theoretical analysis may be applied to the further modeling of all integrated passive components. As the extension of the generalized two-conductor transmission structure model developed for the two-conductor approach, the generalized multi-conductor transmission structure theory has been proposed. As multiple L-C cells are putting in parallel, magnetic and capacitive coupling between cells cannot be neglected. To determine the capacitance between two adjacent conductors on top of the same dielectric substrate, Schwarz-Christoffel transformation and its inverse transformation have been applied with the calculation results verified by measurement. Based on the original voltage and current equations written in matrix form, modal analysis has been conducted to solve the equations. All these provide the basis for any further modeling of an integrated passive structure. Based on the basic L-C cell structure, this dissertation proposes an alternative multi-cell approach to the integration of reactive components and establishes the principles for its design and operation. It achieves the 3-D integration and has a PCB-mount chip-like structure which may have the potential to be more manufacturable, modularizable and mechanically robust. Different functional equivalents can be obtained by different PCB interconnections. The experimental results confirm the functionality as integrated reactive components for applications such as high frequency resonators. To apply the multi-conductor generalized transmission structure model to practical integrated passives structures, three typical cases have been studied: spiral-winding structure integrated series resonator, multi-cell structure integrated series resonator and integrated RF EMI filter. All these structures can be treated as one or more multi-conductor transmission structures connected in certain patterns. Different connection patterns only determine the voltage and current boundary conditions with which the equations can be solved. After obtaining the voltages and currents at each point, the impedance or transfer gain of a structure can be obtained. The MATLAB calculation results correlate well with the measurement results. The calculation sensitivities with respect to variation of various parameters are also discussed and causes of resonance at different frequency range are identified. The proposed generalized transmission structure model based on matrix modal analysis is rather complex and takes a lot of computer time especially when the number of turns is large. Furthermore, the operating frequency of an integrated resonant module is normally around its 1st resonant frequency and up to the 2nd resonant frequency. Therefore, a more simplistic higher order lumped element model which covers the operating range up to the 2nd resonant frequency may be good enough for the general design purpose. A higher order equivalent circuit model for integrated series resonant modules as an example of integrated power passives is presented in this dissertation. Inter-winding capacitance is also considered compared to the conventional 1st order approximation model. This model has been verified by small-signal test results and can be easily implemented into the design algorithm as part of the high frequency design considerations. The wide band modeling and proposed new structure mentioned above provide a comprehensive basis for better design of integrated passive components. As a general frequency plane modeling approach, the work presented in this dissertation may be extended to other passive structures, such as multi-layer capacitors, planar magnetics, etc.. / Ph. D.
19

Conception d'antennes de tags RFID UHF, application a la réalisation par jet de matière.

Ghiotto, Anthony 26 November 2008 (has links) (PDF)
L'identification par radiofréquence constitue une technologie émergente et très prometteuse pour l'identification des biens et des personnes : automatisation des opérations manuelles, rapidité, informations précises...<br />Il existe plusieurs technologies RFID. Dans cette thèse, nous nous intéressons à la technologie UHF passive et plus particulièrement à la conception, caractérisation et fabrication des antennes de tags RFID. En 2007, il s'est vendu plus de 1,7 milliard de tags RFID. En vue de réduire le coût de ces derniers, nous abordons leur fabrication par une technique très prometteuse qui pourrait révolutionner l'électronique, le jet d'encre. Ces travaux s'appuient sur des simulations électromagnétiques et des mesures, et considèrent différents types d'antennes RFID.
20

Modeling & Development of Wirelessly Coupled Loops for Chip-to-Antenna Communications

Johnstone, Jonathan 10 September 2013 (has links)
This thesis examines the use of two coupled loops as an alternative method of connection for high frequency signals between passive elements on microwave laminates and integrated circuits; replacing traditional interconnect methods such as wire bonds and solder bumps which require costly back end of line processing. The loops harness both electric and magnetic fields in order to create the interconnection, and can be placed around the perimeter of the IC; here they do not interfere with placement of the existing electronics on the chip, or occupy space which may be required for large components such as spiral inductors. A parametric model for these coupled loops was developed in this thesis. This model allows for rapid initial dimension choice when provided a variety of different parameters such as the IC process geometry, and loop stack geometry. Once initial dimensions are obtained from the model, full-wave simulation can be used to finalize the design and examine effects of process design rules such as metal density requirements. Following model development a prototype system, consisting of a two metallic loops (one located on a low-loss microwave laminate, the other on a 0.13 u m CMOS IC), was fabricated. These loops were then stacked in order to couple the signal from a planar antenna array (printed on the laminate) onto the IC. This antenna-to-chip system was simulated and measured to have center frequencies of 25 GHz and 23 GHz respectively, with a peak gain greater than 5 dBi at the beams broadside (8 dBi in simulation). These results agree quite well, with discrepancies arising primarily from the presence of adhesive between the loops. This adhesive wicked underneath the IC during assembly, which was not accounted for during simulation, but can easily be done so. The radiation pattern from the antenna was measured to have a HPBW of 16 degrees in the elevation plane and 100 degrees in the azimuth plane. These correspond nicely with simulated results and produce a suitable system for automotive radar application; where harsh environments present difficulties to current interconnects such as wire bonds. / Thesis (Master, Electrical & Computer Engineering) -- Queen's University, 2013-09-09 21:55:06.971

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