No description available.

Esta pesquisa engloba o estudo e desenvolvimento de novas heteroestruturas semicondutoras, tomando como base as estruturas SOI (Silicon-On-Insulator - silício sobre isolante) obtidas pela técnica Smart Cut, estudadas nestes últimos anos no Departamento de Engenharia de Sistemas Eletrônicos da Escola Politécnica da Universidade de São Paulo (EPUSP). Esta técnica combina a solda direta para a união de lâminas e a implantação iônica (I/I) de íons leves para a separação de camadas especificadas. São essenciais na preparação destas estruturas SOI, processos de I/I, limpeza e ativação das superfícies das lâminas e recozimentos em fornos a temperaturas moderadas. Estudamos também, diferentes métodos para a obtenção de novas heteroestruturas, basicamente combinando as técnicas de fabricação da estrutura SOI e os métodos de formação do carbeto de silício (SiC), que chamaremos de heteroestruturas SiCOI (Silicon Carbide-On-Insulator). O método usado para a formação do SiC depende, em cada caso, das características desejadas para o filme que, ao mesmo tempo, estão relacionadas com a aplicação à qual estará destinado. Analisamos três métodos de obtenção do material SiC com características específicas diferentes. A metodologia proposta aborda as seguintes tarefas: Tarefa 1: Obtenção de estruturas SOI pelo método convencional utilizado em trabalhos anteriores e melhoramento das características superficiais da estrutura resultante. Tarefa 2: partindo de uma lâmina de Si previamente coberta por uma camada isolante, fabricar a heteroestrutura SiC/isolante/Si, onde a camada de SiC é crescida pelo método de deposição química de vapor assistida por plasma (PECVD). O filme obtido por deposição PECVD é amorfo e portanto são necessárias etapas de cristalização posteriores ao crescimento. Tarefa 3: partindo de uma estrutura SOI, fabricar a heteroestrutura SiC/SiO2/Si, onde a camada de SiC é obtida por implantação de íons de carbono (C+) na camada ativa de Si da estrutura SOI para sua transformação em SiC. Tarefa 4: partindo de uma estrutura SOI, fabricar a heteroestrutura SiC/SiO2/Si, onde a camada de SiC é obtida por conversão direta da camada ativa de Si da estrutura SOI em SiC como resultado da carbonização do Si usando exposição a ambiente de hidrocarbonetos. Como resultado deste trabalho foram obtidas estruturas SOI Smart Cut com valor médio de rugosidade superficial dentro dos valores esperados segundo a bibliografia consultada. Durante o desenvolvimento de heteroestruturas SiC/isolante/Si obtidas utilizando a técnica de PECVD obtivemos filmes com boas características estruturais. Os recozimentos feitos em ambiente de N2 aparentemente trazem resultados satisfatórios, conduzindo à completa cristalização dos filmes. Nas análises feitas para a fabricação de heteroestruturas SiC/isolante/Si utilizando I/I de carbono confirma-se a formação de c-SiC depois de realizado o recozimento térmico. / In this work we study new semiconductors heterostructures, based on SOI (Silicon-On- Insulator) structures obtained by \"Smart-Cut\" process, that were studied in the last years at Departamento de Engenharia de Sistemas Eletrônicos da Escola Politécnica da Universidade de São Paulo (EPUSP). This technique combines high-dose hydrogen ion implantation (I/I) and direct wafer bonding. To produce SOI structures some processes are essential: I/I process, cleaning and activation of the surfaces, and conventional thermal treatments at moderated temperatures. We also investigate different methods to obtain new heterostructures, basically combining SOI technologies and silicon carbide (SiC) growth processes, which will be called as SiCOI (Silicon Carbide-On-Insulator) heterostructures. The utilized methods to obtain the SiC are related, in each case, with the desired film\'s characteristics, which at the same time are associated with the final application. We analyze three methods to obtain SiC material with specific different characteristics. The proposed methodology approaches the following tasks: Task 1: Fabrication of SOI structures by the conventional technology previously used by us, and the improvement of superficial characteristic of the final structure. Task 2: Fabrication of SiC/insulator/Si heterostructures from Si substrate previously covered with an insulator capping layer, where the SiC layer is deposited by plasma enhanced chemical vapor deposition (PECVD). The PECVD film is amorphous and therefore, a thermal annealing step is necessary for crystallization. Task 3: Fabrication of SiC/SiO2/Si heterostructures from SOI structure, where the SiC layer is synthesized through a high dose carbon implantation into the thin silicon overlayer of a SOI wafer. Task 4: Fabrication of SiC/SiO2/Si heterostructures from SOI structure, where the SiC layer is achieved by direct carbonization conversion of the silicon overlayer of a SOI wafer In this work we have obtained Smart Cut SOI structures with surface roughness similar to the previous reported. We also obtained SiC/insulator/Si heterostructures with good structural characteristics using PECVD technique. The investigated N2 thermal annealing appears to be suitable for the crystallization of all the amorphous films deposited by PECVD. We have shown the possibility of using carbon ion implantation and subsequent thermal annealing to form c-SiC for SiC/insulator/Si heterostructures.

Esta pesquisa engloba o estudo e desenvolvimento de novas heteroestruturas semicondutoras, tomando como base as estruturas SOI (Silicon-On-Insulator - silício sobre isolante) obtidas pela técnica Smart Cut, estudadas nestes últimos anos no Departamento de Engenharia de Sistemas Eletrônicos da Escola Politécnica da Universidade de São Paulo (EPUSP). Esta técnica combina a solda direta para a união de lâminas e a implantação iônica (I/I) de íons leves para a separação de camadas especificadas. São essenciais na preparação destas estruturas SOI, processos de I/I, limpeza e ativação das superfícies das lâminas e recozimentos em fornos a temperaturas moderadas. Estudamos também, diferentes métodos para a obtenção de novas heteroestruturas, basicamente combinando as técnicas de fabricação da estrutura SOI e os métodos de formação do carbeto de silício (SiC), que chamaremos de heteroestruturas SiCOI (Silicon Carbide-On-Insulator). O método usado para a formação do SiC depende, em cada caso, das características desejadas para o filme que, ao mesmo tempo, estão relacionadas com a aplicação à qual estará destinado. Analisamos três métodos de obtenção do material SiC com características específicas diferentes. A metodologia proposta aborda as seguintes tarefas: Tarefa 1: Obtenção de estruturas SOI pelo método convencional utilizado em trabalhos anteriores e melhoramento das características superficiais da estrutura resultante. Tarefa 2: partindo de uma lâmina de Si previamente coberta por uma camada isolante, fabricar a heteroestrutura SiC/isolante/Si, onde a camada de SiC é crescida pelo método de deposição química de vapor assistida por plasma (PECVD). O filme obtido por deposição PECVD é amorfo e portanto são necessárias etapas de cristalização posteriores ao crescimento. Tarefa 3: partindo de uma estrutura SOI, fabricar a heteroestrutura SiC/SiO2/Si, onde a camada de SiC é obtida por implantação de íons de carbono (C+) na camada ativa de Si da estrutura SOI para sua transformação em SiC. Tarefa 4: partindo de uma estrutura SOI, fabricar a heteroestrutura SiC/SiO2/Si, onde a camada de SiC é obtida por conversão direta da camada ativa de Si da estrutura SOI em SiC como resultado da carbonização do Si usando exposição a ambiente de hidrocarbonetos. Como resultado deste trabalho foram obtidas estruturas SOI Smart Cut com valor médio de rugosidade superficial dentro dos valores esperados segundo a bibliografia consultada. Durante o desenvolvimento de heteroestruturas SiC/isolante/Si obtidas utilizando a técnica de PECVD obtivemos filmes com boas características estruturais. Os recozimentos feitos em ambiente de N2 aparentemente trazem resultados satisfatórios, conduzindo à completa cristalização dos filmes. Nas análises feitas para a fabricação de heteroestruturas SiC/isolante/Si utilizando I/I de carbono confirma-se a formação de c-SiC depois de realizado o recozimento térmico. / In this work we study new semiconductors heterostructures, based on SOI (Silicon-On- Insulator) structures obtained by \"Smart-Cut\" process, that were studied in the last years at Departamento de Engenharia de Sistemas Eletrônicos da Escola Politécnica da Universidade de São Paulo (EPUSP). This technique combines high-dose hydrogen ion implantation (I/I) and direct wafer bonding. To produce SOI structures some processes are essential: I/I process, cleaning and activation of the surfaces, and conventional thermal treatments at moderated temperatures. We also investigate different methods to obtain new heterostructures, basically combining SOI technologies and silicon carbide (SiC) growth processes, which will be called as SiCOI (Silicon Carbide-On-Insulator) heterostructures. The utilized methods to obtain the SiC are related, in each case, with the desired film\'s characteristics, which at the same time are associated with the final application. We analyze three methods to obtain SiC material with specific different characteristics. The proposed methodology approaches the following tasks: Task 1: Fabrication of SOI structures by the conventional technology previously used by us, and the improvement of superficial characteristic of the final structure. Task 2: Fabrication of SiC/insulator/Si heterostructures from Si substrate previously covered with an insulator capping layer, where the SiC layer is deposited by plasma enhanced chemical vapor deposition (PECVD). The PECVD film is amorphous and therefore, a thermal annealing step is necessary for crystallization. Task 3: Fabrication of SiC/SiO2/Si heterostructures from SOI structure, where the SiC layer is synthesized through a high dose carbon implantation into the thin silicon overlayer of a SOI wafer. Task 4: Fabrication of SiC/SiO2/Si heterostructures from SOI structure, where the SiC layer is achieved by direct carbonization conversion of the silicon overlayer of a SOI wafer In this work we have obtained Smart Cut SOI structures with surface roughness similar to the previous reported. We also obtained SiC/insulator/Si heterostructures with good structural characteristics using PECVD technique. The investigated N2 thermal annealing appears to be suitable for the crystallization of all the amorphous films deposited by PECVD. We have shown the possibility of using carbon ion implantation and subsequent thermal annealing to form c-SiC for SiC/insulator/Si heterostructures.

No description available.

Tato studie je zaměřena na základní výzkum přípravy a-SiC:H a a-SiCO:H slitin plazmových polymerů pomocí metody plazmochemické depozice z plynné fáze (PE-CVD). Tyto slitiny byly připravovány depozicí z monomeru tetravinylsilanu (TVS) a jeho směsí s kyslíkem a argonem při různých efektivních výkonech pulzního plazmatu. Připravené tenké vrstvy byly za účelem získání závislostí optických, mechanických a chemických vlastností na depozičních podmínkách zkoumány pomocí metod spektros-kopické elipsometrie (ELL), nanoindentace (NI), fotoelektronové spektrometrie (XPS) a Fourierovy transformované infračervené spektrometrie

The main goal of this work is to introduce with the basic technologies of manufacturing MEMS (Micro-electro-mechanical-systems). Further there is mentioned properties and manufacturing of CNT (Carbon nanotubes), used in manufacturing of capacitance pressure sensor.

The main goal of this work is to introduce new carbon structures - carbon nanotubes. The main objective of this work is to take advantage of the unique characteristic of carbon nanotubes to emit electrons at very low supply voltage.

Dans cette thèse, nous avons fabriqué des cellules solaires à jonction radiale en nanofils de silicium avec du silicium microcristallin hydrogéné (µc-Si:H) comme absorbeur, par dépôt chimique en phase vapeur assisté par plasma à basse température (PECVD). Pour contrôler la densité de nanofils sur les substrats, nous avons utilisé des nanoparticules (NP) de dioxyde d'étain (SnO₂) d'un diamètre moyen de 55 nm, disponibles dans le commerce, comme précurseur du catalyseur Sn pour la croissance des nanofils de silicium. La distribution des nanoparticules de SnO₂ sur le substrat a été contrôlée par centrifugation et dilution du colloïde de SnO₂, en combinaison avec la fonctionnalisation du substrat. Par la suite, le SnO₂ est réduit en Sn métallique après le traitement par plasma de H₂, suivi de la croissance, par la technique vapeur-liquide-solide (VLS) assistée par plasma, de nanofils de Si sur lesquels sont déposées les couches P, I et N constituant les cellules solaires à jonction radiale. Nous avons atteint un taux de croissance élevé des nanofils de Si, jusqu'à 70%, avec une très large gamme de densité, de 10⁶ à 10⁹ /cm². Comme approche supplémentaire de contrôle de la densité des nanofils, nous avons utilisé du Sn évaporé comme précurseur du catalyseur Sn. Nous avons étudié l'effet de l'épaisseur de Sn évaporé, l'effet de la durée du traitement au plasma de H₂ et l'effet du débit de gaz H₂ dans le dans le mélange de précurseurs, sur la densité des nanofils. L'ellipsométrie spectroscopique in-situ (SE) a été utilisée pour contrôler la croissance des nanofils et le dépôt des couches de µc-Si:H sur les SiNWs. En combinant les résultats de in-situ SE et de microscopie électronique à balayage, une relation entre l'intensité du signal de SE pendant la croissance et la longueur et la densité des nanofils a été démontrée, ce qui permet d'estimer ces paramètres en cours de croissance. Nous avons réalisé une étude systématique des matériaux (couches intrinsèques et dopées de type n ou p de µc-Si:H, couches dopées d'oxyde de silicium microcristallin hydrogéné, µcSiOx:H) et des cellules solaires obtenues dans deux réacteurs à plasma appelés "PLASFIL" et "ARCAM". Les épaisseurs de revêtement sur substrat lisse et sur les nanofils ont été déterminées et nous avons obtenu une relation linéaire entre les deux, ce qui permet de concevoir un revêtement conforme sur les nanofils pour chaque couche avec une épaisseur optimale. Les paramètres des nanofils et des matériaux, affectant la performance des cellules solaires à jonction radiale, ont été systématiquement étudiés, les principaux étant la longueur et la densité des nanofils, l'épaisseur de la couche intrinsèque de µc-Si:H, l'utilisation de µc-SiOx:H et le réflecteur arrière en Ag. Enfin, avec les cellules solaires à jonction radiale en nanofils de silicium optimisées utilisant le µc-Si:H comme absorbeur, nous avons atteint un rendement de conversion de l'énergie de 4,13 % avec Voc = 0,41 V, Jsc = 14,4 mA/cm² et FF = 69,7%. Cette performance est supérieure de plus de 40 % à l'efficacité record de 2,9 % publiée précédemment. / In this thesis, we have fabricated silicon nanowire (SiNW) radial junction solar cells with hydrogenated microcrystalline silicon (μc-Si:H) as the absorber via low-temperature plasma-enhanced chemical vapor deposition (PECVD). To control the density of NW on the substrates, we have used commercially available tin dioxide (SnO₂) nanoparticles (NPs) with an average diameter of 55 nm as the precursor of Sn catalyst for the growth of SiNWs. The distribution of SnO₂ NPs on the substrate has been controlled by centrifugation and the dilution of the SnO₂ colloid, combined with the functionalization of the substrate. Subsequently, SnO₂ is reduced to metallic Sn after the H₂ plasma treatment, followed by the plasma-assisted vapor-liquid-solid (VLS) growth of SiNWs upon which the P, I and N layers constituting the radial junction solar cells are deposited. We have achieved a high yield growth of SiNWs up to 70% with a very wide range of NW density, from 10⁶ to 10⁹ /cm². As an additional approach of controlling the density of SiNWs we have used evaporated Sn as the precursor of Sn catalyst. We have studied the effect of the thickness of evaporated Sn, the effect of duration of H₂ plasma treatment and the effect of H₂ gas flow rate in the plasma, on the density of SiNWs.In-situ spectroscopic ellipsometry (SE) was used for monitoring the growth of SiNWs and the deposition of the layers of μc-Si:H on SiNWs. Combining in-situ SE and SEM results, a relationship between the intensity of SE signal and the length and the density of SiNWs during the growth was demonstrated, which allows to estimate the density and the length of SiNWs during the growth. We have carried out a systematic study of materials (intrinsic, p-type,n-type µc-Si:H and µcSiOx:H doped layers) and solar cells obtained in two plasma reactors named “PLASFIL” and “ARCAM”. The thicknesses of coating on the flat substrate and on the SiNWs have been determined with a linear relation which helps to design a conformal coating on SiNWs for each layer with an optimal thickness. The parameters of the SiNWs and the materials, affecting the performance of radial junction solar cells, have been systematically studied, the main ones being the length and the density of SiNWs, the thickness of intrinsic layer of μc-Si:H on SiNWs, the use of the hydrogenated microcrystalline silicon oxide (μc-SiOx:H) and the back reflector Ag. Finally, with the optimized silicon nanowire radial junction solar cells using the μc-Si:H as the absorber we have achieved an energy conversion efficiency of 4.13 % with Voc = 0.41 V, Jsc = 14.4 mA/cm² and FF = 69.7%. This performance is more than 40 % better than the previous published record efficiency of 2.9 %.

Ce manuscrit présente l'étude de la fabrication de couches minces de silicium basée sur des différents types de dépôt chimique en phase vapeur assisté par plasma (PECVD) pour des applications dans le photovoltaïque. Tout d'abord, nous avons combiné une chimie du plasma halogéné en utilisant un mélange de SiF4/H2 et la technique plasmas distributés matriciellement à résonance cyclotronique électronique (MDECR) PECVD pour le dépôt de μc-Si:H à grande vitesse. Nous trouvons que les conditions d'énergie ionique modérée sont bénéfiques pour obtenir une diminution significative de la densité des nano-vides, et ainis nous pouvons obtenir un matériaux de meilleure qualité avec une meilleure stabilité. Une méthode de dépôt en deux étapes a été introduite comme moyen alternatif d'éliminer la formation d'une couche d'incubation amorphe pendant la croissance du film. Ensuite, nous avons exploré la technique d'excitation Tailored Voltage Waveform (TVW) pour les processus plasma radiofréquence capacitivement couplé (RF-CCP). Grâce à l'utilisation de TVW, il est possible d'étudier indépendamment l'influence de l'énergie ionique sur le dépôt de matériaux à une pression de processus relativement élevée. Basé sur ce point, nous avons étudié le dépôt de μc-Si:H et a-Si:H à partir des plasma de SiF4/H2/Ar et de SiH4/H2, respectivement. A partir d'une analyse des propriétés structurelles et électroniques, nous constatons que la variation de l'énergie ionique peut directement traduite dans la qualité du matériaux. Les résultats se sont appliqués aux dispositifs photovoltaïques et ont établi des liens complets entre les paramètres de plasma contrôlables par TVW et les propriétés de matériaux déposé, et finalement, les performances du dispositif photovoltaïque correspondant. Enfin, nous avons trouvé que dans le cas du dépôt de couches minces de silicium à partir du plasma de SiF4/H2/Ar à l'aide de sawtooth TVW, on peut réaliser un processus de dépôt sur une électrode, sans aucun dépôt ou gravure. contre-électrode. Ceci est dû à deux effets: la nature multi-précurseur du processus de surface résultant et la réponse de plasma spatiale asymétrique par l'effet d'asymétrie de pente de la sawtooth TVW. La découverte de tels procédés “electrode-selective” encourage la perspective que l'on puisse choisir un ensemble de conditions de traitement pour obtenir une grande variété de dépôts désirés sur une électrode, tout en laissant l'autre vierge. / This thesis describes the study of silicon thin film materials deposition and the resulting photovoltaic devices fabrication using different types of plasma-enhanced chemical vapour deposition (PECVD) techniques.In the first part, we combine a SiF4/H2 plasma chemistry with the matrix-distributed electron cyclotron resonance (MDECR) PECVD to obtain high growth rate microcrystalline silicon (µc-Si:H). Due to the special design of MDECR system, careful investigation of the impact energy of impinging ions to material deposition can be accessible. We find that moderate ion energy conditions is beneficial to achieve a significant drop in the density of nano-voids, thus a higher quality material with better stability can be obtained. A two-step deposition method is introduced as an alternative way to eliminate the existence of amorphous incubation layer during film growth.The second part of work is dedicate to the exploration of the Tailored Voltage Waveforms (TVWs) excitation technique for capacitively coupled plasmas (CCP) processes. As an advantage over the conventional sinusoidal excitations, TVWs technique provide an elegant solution for the ion flux-energy decoupling in CCP discharges through the electrical asymmetry effect, which makes the independent study of the impact of ion energy for material deposition at relatively high process pressure possible. Based on this insight, we have studied the deposition of µc-Si:H and amorphous silicon (a-Si:H) from the SiF4/H2/Ar and SiH4/H2 plasma chemistry, respectively. From the structural and electronic properties analysis, we find that the variation of ion energy can be directly translated into the material quality. We have further applied these results to photovoltaic applications and established bottom-up links from the controllable plasma parameters via TVWs to the deposited material properties, and eventually to the resulting device quality.In the last part, as a further application of TVWs, an “electrode-selective” effect has been discovered in the CCP processes. In the case of silicon thin film deposition from the SiF4/H2/Ar plasma chemistry, one can achieve a deposition process on one electrode, while at the same time either no deposition or an etching process on the counter electrode. This is due to two effects: the multi-precursor nature of the resulting surface process and the asymmetric plasma response through the utilization of TVWs. Moreover, such deposition/etching balance can be directly controlled through H2 flow rate. From a temporal asymmetry point of view, we have further studied the impact of process pressure and reactor geometry to the asymmetric plasma response for both the single-gas and multi-gas plasmas using the sawtooth waveforms. The product of pressure and inter-electrode distance P·di is deduced to be a crucial parameter in determine the plasma heating mode, so that a more flexible control over the discharge asymmetry as well as the relating “electrode-selective” surface process can be expected.

<p>Silicon nanostructures formed in silicon-rich silicon nitride (SRSN) and cerium and terbium doped silicon oxide thin films grown using different types of plasma-enhanced chemical vapour deposition have been studied through photoluminescence (PL) and synchrotron-based X-ray absorption spectroscopies to determine the effects of deposition and processing parameters on the luminescent and structural properties of these materials. The SRSN films exhibited bright PL attributed to quantum confinement effects in the silicon nanoclusters (Si-ncs) as well as radiative defects in the silicon nitride host matrix. The peak emission energy could be tuned from the near-infrared across the entire visible spectrum by controlling the film composition and the post-deposition annealing temperature and time to change the size of the Si-ncs. Preliminary experiments on cerium doped SRSN samples indicated that although the cerium ions coordinate in the optically active trivalent oxidation state, they were not effectively sensitized by Si-ncs in the films tested, most likely due to the nanoclusters having bandgap energies that were unsuitable for this purpose. In cerium and terbium co-doped silicon oxide films, cerium disilicate (Ce₂Si₂O₇) nanocrystallites were formed by annealing at temperatures of 900°C and higher. The A-Ce₂Si₂O₇, G-Ce₂Si₂O₇, and Ce₆[Si₄O₁₃][SiO₄]₂ phases of cerium disilicate were observed to form under different deposition and annealing conditions. All three phases exhibited extremely bright violet-blue PL and were found to efficiently sensitize green emission from co-dopant Tb³⁺ ions in the films. The Tb³⁺ luminescence predominantly corresponded to the ⁵D₄→⁷F_3–6 emission lines, although weak ⁵D₃→⁷F_2–6 emission lines were also observed in films containing relatively high concentrations of terbium indicating that the sensitization of Tb³⁺ ions occurred through the ⁵D₃, ⁵L₁₀, or ⁵D₂ energy levels.</p> / Doctor of Philosophy (PhD)