Thesis (Ph. D.)--Chemistry and Biochemistry, Georgia Institute of Technology, 2007. / Phillip Gibbs, Committee Member ; Rick Trebino, Committee Member ; Christoph Fahrni, Committee Member ; Donald Doyle, Committee Member ; Andreas Bommarius, Committee Chair.

La majorité des produits verriers du marché sont issus d’une opération de mise en forme à hautes températures, suivie d’une phase de refroidissement contrôlé afin d’éliminer (verre recuit) ou générer (verre trempé) des contraintes résiduelles. Le comportement mécanique du verre étant fortement thermo-dépendant, le contrôle des températures est un élément déterminant pour le succès du procédé de fabrication. Lors de la simulation numérique, pour ce milieu semi-transparent, les échanges thermiques par conduction et par rayonnement sont à considérer. La résolution de l’ETR (Equation de Transfert Radiatif) est menée dans cette thèse par le biais de la « Méthode P1 » et le « Back Ray Tracing » (BRT). Les deux codes développés ont été validés par l’étude comparative avec les données en températures et en contraintes résiduelles issues de la littérature sur le refroidissement dans l’épaisseur du verre soumis à des conditions variées en convection naturelle et forcée. Une expérimentation qui consiste à refroidir un disque de verre sur un support métallique a été développée dans le but de comparer les températures et contraintes générées par l’expérimentation et par la modélisation issue du couplage thermomécanique avec les deux codes P1 et BRT. De manière plus originale, la méthode BRT a été étendue à des géométries de révolution. Une première approche a consisté à étudier le fluage d’une goutte de verre et à analyser l’influence du choix du modèle de résolution de l’ETR sur les températures et les géométries au cours de la mise en forme. / Most of glass products on the market come from a high-temperature forming operation, followed by a controlled cooling phase to remove (annealed glass) or generate (tempered glass) residual stresses. Since the mechanical behaviour of the glass is highly thermo-dependent, temperature control is a determining factor for the success of the manufacturing process. During numerical simulations, for this semi-transparent medium, heat exchanges by conduction and radiation have to be considered. In this work, the resolution of the ETR (radiative transfer Equation) is carried out using the "P1 method" and the "Back Ray tracing" (BRT). The two developed codes were validated by the comparative study with the temperature and residual stresses data from the literature on cooling in the thickness of the glass subject to various conditions in natural and forced convection. An experimentation which consists in cooling a glass disk on a metal support was developed in order to compare the temperatures and stresses generated by the testing and by the modelling resulting from the thermomechanical coupling with the two codes P1 and BRT. In a more original way, the BRT method was extended to revolving geometries. A first approach was to study the creep of a glass gob and to analyze the influence of the choice of the ETR's resolution model on the temperatures and geometries during the forming.

The manufacturing process of a photovoltaic Si wafer comprises of first a high temperature heating process to produce a Si ingot from polycrystalline Silicon, which is then cut into bricks and subsequently sawn into wafers using a wire saw. These processes create residual stresses both from the thermal gradient induced by solidification and from either the rolling-indenting or scratching-indenting processes caused by the type of wire saw used. The objective of this research is to study silicon wafer residual stress as a result of the typical industry manufacturing processes and by doing so, better understand the mechanical properties that lead to increased fracture. This thesis aims to quantify the amount of residual stress generated by the solidification/thermal gradient produced during the casting of Si ingots separately from the residual stress generated by the wire sawing process. Samples from industry are used to compare the effects of the manufacturing processes on residual stress in multi-crystalline silicon (mc-Si) wafers including the effects of fixed abrasive diamond wire sawing (DWS) vs. loose abrasive (LAWS) slurry wire sawing used in the wafering process. Near-infrared birefringence polariscopy and polarized micro-Raman spectroscopy are used to study wafer residual stresses within grains and at grain boundaries in mc-Si as a function of etch-depth. While near-infrared birefringence polariscopy allows for the measurement of full-field maximum shear stress, micro-Raman spectroscopy provides decomposition of the stress tensor into both principal and shear in-plane stress components. Consequently, regions of high tensile stress, which are detrimental to the mechanical integrity of the wafer, can be easily identified. In addition to the mechanical characterization, the residual stress produced by the thermal gradient/solidification process for multi-crystalline Si wafers was also correlated to electrical performance of mc-Si wafers using photoluminescence.

The goal of this research was to investigate an experimental infrared transmission technique to extract the full stress components of the in-plane residual stresses in thin multi crystalline silicon wafer, and try to meet the need of photovoltaic industry to in situ measure residual stress for large cast wafers.

No description available.

Polarimetry, as applied to chemical analysis, deals with the determination of the extent and direction that an optically active chemical species will rotate incident linearly polarized light. Although well developed for physical sensing, the technique of fiber optic polarimetry for chemical sensing remains in its infancy. This thesis is concerned with the design and development of an optical fiber polarimeter which measures the optical rotation of linearly polarized light that occurs in a sensing region between two multi-mode optical fibers. Over short distances, the polarization preserving capabilities of large-core multi-mode optical fibers were investigated. Polarimetric analyses were performed using sucrose and quinine hydrochloride. The instrument has a resolution of 0.08·, and is an excellent platform for an LC or FIA detector. Its more intriguing future lies in evanescent field sensor applications and studies of chiroptical surface interactions. / Master of Science

The diploma thesis deals with comparative analysis of stress and strain of notched machine parts using photoelasticity and finite element method (FEM). Experimental and numerical comparative analyses were performed on three models: hook, J shaped bracket and 3-point bending beam with notch. Equivalent stresses, principal stresses and its directions were analyzed. The emphasis is given on photoelasticity, the theory and principles of photoelasticity are described in more detail. FEM analysis was performed using software ANSYS 11. The work presented includes the preparation of polariscope in the laboratory of Institute of machine and industrial design in order to use it in tutorials focused on experimental stress analysis using photoelasticity.